Advantech packs features into COMe Mini Type 10 module

Despite being the size of a business card, Advantech’s COMe Mini Type 10 module is populated with Intel’s 11th generation Core processors.

In addition to the Intel Core i7 processors, the SOM-7583 features on-board LPDDR4 memory and NVMe SSD. It supports multiple I/O and displays, including 2.5GbE LAN supporting time sensitive networking (TSN), a PCIe Gen 3 x4, two USB 3.2 Gen 2 (10Gbits per second), two SATA Gen3, and two independent 4k displays. The platform has AI Acceleration with Intel Deep Learning Boost engine, vector neural network instructions (VNNI), which can improve the efficiency and increase the inference performance dramatically, says Advantech.

Based on demand, Advantech says it will offer Edge AI Suite software, the Intel OpenVINO toolkit.

The SOM-7583 is suitable for powerful computing applications in aerospace, defence, industrial control and transportation.

The SOM-7583 yields 40 per cent higher CPU performance, 60 per cent better graphics and five times AI performance than the previous generation module. It integrates with LPDDR4X 4266Mt/s IBECC RAM, up to 16Gbyte and on-board NVMe SSD which achieves a 10 times increase in the sequential reading and writing speed compared with eMMC 5.1.

The fanless thermal module is designed to dissipate heat and keep the system running under thermal design power (TDP) 15W at 60 degrees C ambient temperature.

The thermal module has a height at only 27mm and comes with a copper block for direct contact with the CPU. It then transfers the heat to the ambient via heat pipes soldered with stacked fins.   

The SOM-7583 features USB 3.2 Gen 2 (10GT per second) and PCIe Gen 3 (8.0GT per second), both of which are considerably faster than the previous COMe mini solutions, reports Advantech. It is designed to enable low-latency networking performance in factory automation applications via 2.5GbE LAN with TSN. This improves the precision of data synchronisation over the network, and minimises jitter to reduce latency during real time device communication. Similarly, the SOM-7583 enables USB4 compliance via its carrier board design. A reference design is available to help partners integrate USB-C to the carrier board for portable devices, test equipment, and defence applications.

The SOM-7583 provides multi-layer security via BIOS secure boot and Intel’s FW TPM to protect user’s data. Advantech also offers a free trial of WISE-DeviceOn to facilitate SSD health, memory loading, CPU temperature, and measurement monitoring via an optimised user interface. The combination of WISE-DeviceOn OTA (over-the-air) and WOL (wake-on-LAN) enables customers to remotely schedule BIOS and software updates for factory capacity optimisation. Customised software bundling with on-board NVMe SSD enables fast data formatting which removes confidential information from internal storage to meet military and aerospace requirements.

The SOM-7583 is rugged, anti-vibration board which supports a wide range power input of 8.5 to 20V and extended temperature range of -40 to +85 degrees C.

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ST extends STM32WB series with extra power-saving modes

Devices that combine entry-level features with extra power savings have been added to the STM32WB Bluetooth Low Energy microcontroller series.

The dual-core STM32WB15 and STM32WB10 Value Line pair an Arm Cortex-M4 processor, which runs the main application with a Cortex-M0+ for Bluetooth 5.2 connectivity. ST explains that this ensure real-time performance from each. The radio stage has a 102dBm link budget to ensure reliable connections over long distances and integrates balun circuitry to save board space and reduce the bill of materials.

The STM32WB15 and STM32WB10 have a power saving mode that allows the radio to remain operational. They also have tailored peripherals and memory to suit cost-sensitive, power-conscious embedded applications including wearables, beacons, smart circuit breakers, trackers, IoT endpoints, and equipment for industrial automation.

There is a software development kit (SDK) for each microcontroller. This includes standardised radio protocol stacks and openness to proprietary protocols with a set of security mechanisms that ensure safe software updates for device integrity. There is also Proprietary Code Read-Out Protection (PCROP) to guard intellectual property.

The STM32WB series scales across package variants, offering options such as extended general purpose I/Os and pin-to-pin compatibility between similar packages of the portfolio. Customers can migrate designs between devices to take advantage of different features and memory densities.

The development ecosystem includes STM32Cube-certified radio stacks, software expansion packs and sample code, the STM32CubeMX configurator and initialisation code generator, the STM32CubeIDE development environment, a powerful STM32CubeMonitor-RF evaluation tool, and associated Nucleo hardware tools.

The STM32WB15 and STM32WB10 microcontrollers are in production now, offering various pin-compatible configurations in a QFN48 package.

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Miniature wireless comms modules address low power edge devices

Miniature Wi-Fi and Bluetooth Low Energy modules from InnoPhase combne wireless connectivity and an integrated microcontroller for edge of network IoT devices that require low power and a direct-to-cloud connection.

The fabless semiconductor company has introduced the Talaria Two INP1012 and INP1013 modules for a range of products including smart home, smart industrial and smart health applications. The miniature modules are 40 per cent smaller than the original INP1010 and INP1011 modules, which introduced digital radio architecture and which claimed to provide the lowest power Wi-Fi connectivity in the industry.

The INP1012 includes an RF pin for routing the antenna signal onto a main PCB. This allows for independent antenna or antenna connector selection and solder pads. The INP1013 includes a ceramic chip-antenna mounted on the module and solder pads.

Typical smart IoT applications use a significant percentage of the overall system power for Wi-Fi connectivity – up to 75 per cent, explained InnoPhase, even while idly connected to the network. The INP1012 and INP1013 Talaria Two modules can increase the battery lifetime by months or years and require less space, claimed InnoPhase. The INP1012 module also has the capability to allow the user to select the antenna connection and placement. This makes it particularly suitable for industrial applications.

The INP1012 and INP1013 modules can be used in smart door locks, remote security cameras, connected sensors or other space-constrained products within home, commercial, industrial and health markets.

The INP1012 and INP1013 modules use the Talaria Two multi-protocol SoC, with Wi-Fi and Bluetooth Low Energy 5 for wireless data transfer, an embedded Arm Cortex-M3 for system control and user applications, there are also advanced security elements for device safeguards.

The modules can operate in standalone mode, in conjunction with an external microcontroller or in a hybrid mode where the system control and processing responsibilities are shared between the module and an external microcontroller.

The module can be connected to a single power supply and when general purpose I/Os are connected to the peripherals, the system is ready for use, said InnoPhase.

All modules will be certified with the Wi-Fi Alliance and Bluetooth SIG and include government body certifications such as FCC, IC (Canada) and CE/RED approval.

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Lidar camera uses “world’s smallest micro-mirror” for continuous field of view scanning

Continuous laser scanning across the entire field of view is achieved in the Intel RealSense Lidar camera L515, using a MEMS mirror developed by STMicroelectronics.

The lidar camera is 61mm diameter and 26mm high (2.4 inches and 1.02 inches respectively), or the size of an ice hockey puck. The micro-mirror enables continuous laser scanning across the entire field of view. In combination with a custom photodiode sensor, the RealSense Lidar Camera L515 renders a 3D depth map of the entire scene.

The camera provides high resolution scanning for industrial applications such as robotic arms for bin picking, volumetric measurements, logistics and 3D scanning.

The second-generation micro-mirror delivers 30 frames per second and a field of view of 70 degrees by 55 degrees, for 3D scanning and detection applications.

The L515 camera uses the scanning capabilities of ST’s MEMS to deliver high-resolution depth with no interpolated pixels, together with the ability to control the field of view, and provide close to zero pixel blur driven by the low 50nS exposure time, continued ST.

“Intel RealSense technology has been used to develop products and solutions for use in Robotics, Logistics, Scanning and other computer vision applications.  The Intel RealSense LiDAR Camera L515 using ST’s micro-mirrors delivers unparalleled precision and is the world’s smallest high-resolution Lidar depth camera, making it suitable for a variety of use cases,” said Sagi BenMoshe, chief incubation officer, corporate vice president and general manager, Emerging Growth and Incubation Group at Intel.

Intel RealSense technologies are reshaping the future by equipping devices with the ability to see, understand, interact with and learn from their environment, says Intel. RealSense provides a wide variety of vision-based solutions, from the world’s smallest high-resolution lidar camera to low power, platform-agnostic stereo depth cameras, as well as customisable software. Intel RealSense has applications in robotics, 3D scanning, facial authentication, measurement and logistics.

ST Microelectronics is an independent device manufacturer, working with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the IoT and 5G technology.

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