Renesas introduces ultra-low-power MCUs for next-generation smart home appliances

Renesas has introduced the new 16-bit RL78/L23 microcontroller (MCU) group, expanding its low-power RL78 family. Running at 32MHz, the RL78/L23 MCUs combine industry-leading low-power performance with essential features such as dual-bank flash memory, segment LCD control, and capacitive touch functionality to support smart home appliances, consumer electronics, IoT and metering systems. These compact devices address the performance and power requirements of modern display-based human-machine interface (HMI) applications.

The RL78/L23 is optimised for ultra-low power consumption and ideal for battery-powered applications that spend the majority of time in standby. They offer an active current of just 109μA/MHz and a standby current as low as 0.365μA, along with a fast 1μs wake-up time to help minimise CPU activity. The LCD controller’s new reference mode, VL4, reduces LCD operating current by approximately 30 percent when compared to the existing RL78/L1X group. The MCUs come with SMS (SNOOZE Mode Sequencer), which enables dynamic LCD segment display without CPU intervention. By offloading tasks to the SMS, the devices minimise CPU wake-ups and contribute to system-level power savings.

The RL78/L23 offers a wide operating voltage range of 1.6V to 5.5V, which supports direct operation from 5V power supplies commonly used in home appliances and industrial systems. This capability reduces the need for external voltage regulators. The MCUs also integrate key components such as capacitive touch sensing, a temperature sensor, and internal oscillator, reducing BOM cost and PCB size.

Its built-in segment LCD controller and capacitive touch realize sleek, responsive user interfaces for products such as induction cooktops and HVAC systems. The IH timer (Timer KB40) enables precise multi-channel heat control, which is essential in smart kitchen appliances such as rice cookers and IH cooktops. The devices include dual-bank flash memory for seamless firmware updates via FOTA (Firmware Over-the-Air), allowing continuous system operation in applications like metering, where downtime must be minimised. The dual-bank architecture allows one memory bank to run the user program, while the other receives updates. This approach keeps the system functional throughout the process for improved reliability.

The RL78/L23 comes with an easy-to-use development environment. Developers can leverage support tools such as Smart Configurator and QE for Capacitive Touch to streamline system design. Renesas offers the RL78/L23 Fast Prototyping Board which is compatible with Arduino IDE, and a capacitive touch evaluation system for in-depth testing and validation.

https://renesas.com

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Latest Bluetooth module from Panasonic now in mass production and supporting Bluetooth 6.0

Now in mass production, the PAN B611-1 Bluetooth module from Panasonic Industry is based on the powerful Nordic nRF54L15 single chip controller. The product now also supports Bluetooth 6.0 and the cutting-edge Bluetooth Channel Sounding feature, enabling precise distance measurement and improved wireless communication.

All 32 pins available on nRF54L15 are routed out on to a hybrid packaging consisting of castellated edges and LGA in a hybrid layout such that a dedicated number of pins positioned at the edge lending for easy prototyping, with the rest of the GPIOs located at the bottom that allows leveraging the full potential of the wireless SoC platform.

The module benefits from very small dimensions of only 10.35 mm × 9.8 mm × 1.9 mm. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.

Based on nRF54L15, the module is shipped with an open embedded application processor based on ARM Cortex-M33 processor clocking up to 128 MHz for high performance embedded applications with a 256 kB RAM. Furthermore, the module has a non-volatile memory of 1.5 MB as available on the SoC.

However, Panasonic adds further features above and beyond those available on the SoC. Pascal Maier, Head of IOT Devices at Panasonic Industry comments: “Our latest PAN B611-1 Bluetooth module is a versatile device that can support a variety of applications – from ultra-low power battery driven solution to very complex applications like Matter, as well as sophisticated algorithm-heavy features like Channel Sounding. This is why we offer different spec variants to enable a variety of applications. The modules are for example available with additional integrated slow clock crystal for energy efficient battery powered operation and additional 4 MB Flash Memory for more complex applications. We think our clients will love this module for its versatility and power at a competitive price point.”

An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms.

Furthermore, the PAN B611-1 is ideally suited for Matter applications, as dedicated variants exist with additional flash memory, and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. Apart from Matter, the highly versatile module also supports a variety of wireless protocols in the 2.4 GHz spectrum including Bluetooth LE, Bluetooth Mesh and IEEE 802.15.4 – enabling Zigbee and Thread as well as other third-party proprietary technologies, which make it effortless to develop products for smart home standards like Matter and Zigbee and even allow running multiple wireless protocols concurrently.

The PAN B611-1 Bluetooth module is available with an integrated chip antenna (-1C) or as bottom pad version (-1B) to cater to diverse project needs. It is certified for Europe (CE RED), UK (UKCA), USA (FCC), Canada (ISED), Japan (MIC).

https://industry.panasonic.eu

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Infineon to enable humanoid robots with precise motion and efficiency powered by NVIDIA Technology

Infineon is accelerating the development of humanoid robotics with NVIDIA technology. This integration combines Infineon’s expertise in microcontrollers, sensors, and smart actuators with the cutting-edge NVIDIA Jetson Thor Series modules, enabling original equipment manufacturers (OEMs) and original design manufacturers (ODMs) to create more efficient, powerful, and scalable motor control solutions for humanoid robotics. Humanoid robots are increasingly deployed in various important areas, including manufacturing, logistics, and healthcare, where they require efficient and reliable solutions for precise motion.

“We are excited to collaborate with NVIDIA, a leader and innovator in the humanoid robotics space,” said Jochen Hanebeck, CEO of Infineon Technologies. “By combining our microcontroller, sensor, and smart actuator expertise with NVIDIA accelerated computing technology, we will deliver a simple, integrated, and scalable solution to our customers, reducing their time to market significantly. Infineon enables the key functional blocks in humanoid robots with a broad portfolio of dedicated products and technologies – from power switches to microcontrollers, sensors and connectivity. We empower humanoid robots to sense, move, act and connect. Safe and secure.”

“NVIDIA Jetson Thor is designed to accelerate the future of physical AI and robotics”, said Deepu Talla, Vice President of Robotics and Edge AI at NVIDIA. “Infineon is bringing their broad product and technology portfolio to the Jetson Thor ecosystem to help accelerate customers’ time-to-market by creating more efficient, powerful and scalable motor control solutions for humanoid robots”.

Infineon offers a full suite of dedicated solutions for humanoid robots, including the microcontroller families PSOC and AURIX which offer industry-leading security to protect against cyberattacks and unauthorised access. The microcontrollers provide multi-core real time processing capabilities essential for safe, responsive, and adaptive robotic systems. With its latest acquisition of Marvell’s Automotive Ethernet business, Infineon has further extended its portfolio with the BRIGHTLANE series offering high-speed ethernet capabilities, another core element of humanoid robots.

Real-time AI and Control is critical to general robotics. As part of the collaboration, Infineon provides its PSOC Control C3 family of microcontrollers, which integrate seamlessly with the NVIDIA Holoscan Sensor Bridge to the NVIDIA Jetson Thor series modules – a platform for physical AI and humanoid robotics, delivering real-time reasoning performance and scalability. PSOC Control devices are well-suited for implementing so-called field-oriented-control (FOC) algorithms, which are widely used for precise motor control due to their ability to reduce noise and provide stable torque output which decreases vibrations in humanoid system designs. Additionally, Infineon provides a full motor control chip set including the company’s latest transistor technology based on gallium nitride (GaN) for high-density and best-efficiency motor control solutions. The integration of Infineon’s gate drivers and current sensors helps control communication and design challenges in humanoid robotics, allowing developers to focus on creating innovative solutions.

https://www.infineon.com/

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Infineon introduces 75 mΩ industrial CoolSiC MOSFETs for medium-power applications

Infineon is expanding its CoolSiC MOSFETs 650 V G2 portfolio with new 75 mΩ variants to meet the demand for more compact and powerful systems. The devices are available in multiple package options, including TOLL, ThinTOLL 8×8, TOLT, D2PAK, TO247-3, and TO247-4. As a result, the product family supports both Top Side Cooling (TSC) and Bottom Side Cooling (BSC) approaches and offers developers a high degree of flexibility. The devices are ideal for high- and medium-power switching mode power supplies (SMPS) in different applications, including AI servers, renewable energy, electric vehicle and e-mobility chargers, humanoid robot chargers, televisions, and drives.

The CoolSiC MOSFETs 650 V G2 are based on the second-generation (G2) of CoolSiC technology and offer improved figures of merit, higher reliability, and enhanced ease of use compared to the previous generation. The different packages offer various advantages: TOLL and ThinTOLL 8×8 packages provide high thermal cycle stability on the PCB and enable compact system designs. When used in SMPS, they reduce the space requirements on the PCB and lower manufacturing costs at the system level. The list of target applications for TOLL and ThinTOLL 8×8 has been expanded, enabling PCB designers to address cost-reduction challenges. The addition of TOLT strengthens Infineon’s growing TSC product family, which also includes CoolMOS 8, CoolSiC, CoolGaN and Optimos. The TSC variants allow up to 95 percent direct heat dissipation and enable designers to use both sides of the PCB, improving space utilisation and reducing parasitic effects.

https://www.infineon.com

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