Qualcomm launches mobile processor with fully integrated RFID capabilities

Qualcomm has announced the Qualcomm Dragonwing Q-6690, which is the world’s first enterprise mobile processor with fully integrated UHF RFID capabilities. The processor includes built-in 5G, Wi-Fi 7, Bluetooth 6.0, and ultra-wideband, supporting proximity-aware experiences and global connectivity. Designed to support a wide range of form factors from ruggedised handhelds to retail point-of-sale systems and smart kiosks, the Dragonwing Q-6690 offers OEMs and ODMs a scalable and upgrade-ready platform with software-configurable feature packs that can be upgraded over the air.

“The Dragonwing Q-6690 combines integrated RFID, AI, and next-gen wireless capabilities in a single, scalable platform, designed to accelerate innovation across industries including retail, logistics, and manufacturing,” said Art Miller, vice president and head of retail, Qualcomm Technologies, Inc. “We are particularly excited about working with retailers today that need platforms that are not only powerful and connected, but also adaptable to evolving customer expectations, from smarter kiosks and handhelds to real-time inventory analytics and contactless experiences.”

The Dragonwing Q-6690 is the world’s first enterprise mobile processor with fully integrated RFID capabilities, eliminating the need for external RFID reader modules and therefore enabling smaller, more efficient device designs. This integration eases the enablement of security-focused, contactless use cases such as access control, asset tracking, inventory management, and product authentication, ideal for retail, logistics, and industrial applications. For more information on the benefits of embedded RFID, visit OnQ blog.

The Dragonwing Q-6690 introduces software-configurable feature packs that let OEMs choose their offerings depending on the computing demands, multimedia capabilities, camera support, or peripheral configurations they need—with the ability to upgrade over the air without redesigning hardware. This modular approach not only accelerates time to market and reduces certification overhead but also extends product lifecycles by enabling over-the-air upgrades as customer needs evolve.

https://www.qualcomm.com

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New ST  Bluetooth 5.4 / Thread module for smart and IoT applications now at Mouser

Mouser Electronics is now shipping the new ST67W Wi-Fi 6 / Bluetooth 5.4 / Thread module from STMicroelectronics. The ST67W Module simplifies the development of next-generation wireless solutions for smart homes, smart appliances, healthcare, and industrial IoT applications.

The STMicroelectronics ST67W module, available from Mouser, is powered by Qualcomm’s high-performance 1 × 1 2.4GHz Wi‑Fi 6 and Bluetooth 5.4 QCC743 microcontroller, with support for Matter protocol over Wi-Fi that operates as a future-proof IoT connectivity transceiver, together with an external STM32 host MCU for running applications.

The ST67W module is ready to integrate with any STM32 MCU with all RF front-end circuitry built-in, including power/low-noise amplifiers, the RF switch, balun, and integrated PCB antenna, with 4Mbyte Flash for code and data storage and a 40MHz crystal. The module’s security features, cryptographic accelerators and services, including secure boot and debug reaching PSA Certified Level 1, make it easy for designers to comply with the upcoming Cyber Resilience Act and RED directives. The STMicroelectronics ST67W module is self-contained, pre-certified, and comes in a 32-lead LGA package ready for board placement. The module is offered with a PCB antenna (version B) or an RF connector for an external antenna (version U).

The STMicroelectronics X-NUCLEO-67W61M1 expansion board, also available from Mouser, is a versatile development tool for the ST67W module. The expansion board can be used with the ARDUINO® Uno V3 and Raspberry Pi boards, and is stackable on ST’s Nucleo-64, Nucleo-144, and Discovery boards.

https://www.mouser.com

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Easily integrate technology with Microchip’s portfolio of GNSS disciplined oscillator modules

Aerospace and defence applications rely on Position, Navigation and Timing (PNT) technology for mission-critical accuracy and reliability. However, integrating PNT into a design requires extensive domain knowledge in this area. To fast track the development process, Microchip has announced its portfolio of GNSS Disciplined Oscillator (GNSSDO) Modules that integrate the company’s embedded atomic clock and oscillator technologies, including the Chip-Scale Atomic Clock (CSAC), Miniature Atomic Clock (MAC) and Oven-Controlled Quartz Crystal Oscillators (OCXOs).

The GNSSDO modules process reference signals from GNSS or an alternative clock source and disciplines the on-board oscillator to the reference signal, enabling precise timing, stability and holdover performance based on end application requirements. These GNSSDOs are used in military and defence applications such as radar, satellite communications (SATCOM), mounted and dismounted radios, vehicle platforms and other critical PNT applications including GNSS-denied environments.

A GNSSDO module acts as a PNT subsystem within a larger system design or as a stand-alone system, providing precise timing that is critical to any high-performance system. The local oscillators used in the GNSSDO modules are engineered and manufactured by Microchip, ensuring customers have a product that they can trust. Other Microchip components on the module include 32-bit microcontrollers (MCUs) and SmartFusion® 2 FPGAs.

Microchip’s newly released GNSSDO modules include:

• The MD-013 ULTRA CLEAN is Microchip’s highest performance standard GNSSDO module that can support multiple GNSS constellations, including GPS, Galileo, BeiDou, and NavIC or an external reference input. This module is designed around a high-performance OCXO that enables outputs with ultra-low phase noise and short-term frequency stability characteristics. The respective specifications for phase noise performance are −119 dBc/Hz at a 1 Hz offset and noise floor of −165 dBc/Hz. Short-term frequency stability, measured by Allan Deviation (ADEV), is 3E-13 at 1s tau, 6E-13 at 10s tau and 9E-13 at 100s tau.

This module can generate 1 PPS TTL, 10 MHz sine wave and 10 MHz square wave outputs that are disciplined to an embedded 72-channel single-band GNSS receiver, with the option to upgrade to a configurable L1/L2 or L1/L5 dual-band, multi-GNSS receiver.

• The MD-300 is Microchip’s GNSSDO module for harsh environments, available in a small 1.5 × 2.5-inch footprint. The MD-300 has an embedded MEMS OCXO or TCXO as the local oscillator, enabling low g-sensitivity, high shock and vibration tolerance and low thermal transient response. Due to its Size, Weight and Power (SWaP) performance, the MD-300 is well-suited for applications like drones and manpacks. The module can discipline to an embedded GNSS receiver or external reference and output high- performance 10 MHz and 1 PPS signals.

• The LM-010 is a PPS disciplined module that provides precise timing for Low Earth Orbit (LEO) applications that demand radiation tolerance coupled with stability and holdover capability. As a standard platform module, the LM-010 provides both 1 PPS TTL and 10 MHz sinewave outputs that are disciplined to an external reference input. Internal to the module is Microchip’s digitally corrected OCXO or low-power CSAC SA.45.

Microchip’s GNSSDO modules utilise a common serial communication protocol and Graphical User Interface (GUI) for command and control of the unit. A variety of parameters can be configured through the software including inputs, outputs, auto switching, holdover parameters, GNSS tracking and observables, as well as reporting messages coming off the serial interface.

Development Tools
The GNSSDO portfolio is supported by Microchip’s VDOM3 software and GUI to help developers adjust performance parameters of the GNSSDO modules and quickly test integrating these products into their systems. The MD-01X Evaluation Kit is also available to easily connect and monitor the MD-01 series of GNSSDOs.

https://www.microchip.com

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New direct Time-of-Flight sensor from ams OSRAM, sees the difference!

The TMF8829 direct Time-of-Flight (dToF) sensor significantly increases resolution — from the previously common 8×8 zones to 48×32 — and it is designed to detect subtle spatial differences and distinguish closely spaced or slightly varied objects. The new sensor from ams OSRAM can tell whether an espresso cup or a travel mug is placed under a coffee machine, ensuring the right amount is dispensed every time. This kind of precision is critical for a broad spectrum of applications: from logistics robots that distinguish between nearly identical packages, to camera systems that maintain focus on moving objects in dynamic video scenes.

With dToF technology, the sensor emits light pulses in the invisible infrared range. These pulses reflect from objects in the sensor’s field of view and return to the sensor, which calculates the distance based on the time it takes for the light to travel — similar to how the delay of an echo reveals distance: the longer it takes, the farther away the object. Multi-zone sensors enhance this by capturing reflected light from multiple viewing angles (zones), like a network of echo points. This enables the creation of detailed 3D depth maps.

The TMF8829 divides its field of view into up to 1,536 zones — a significant improvement over the 64 zones in standard 8×8 sensors. This higher resolution enables finer spatial detail. For example, it supports people counting and presence detection in smart lighting systems, object detection and collision avoidance in robotic applications, and intelligent occupancy monitoring in building automation. The detailed depth data also provides a foundation for machine learning models that interpret complex environments and enable intelligent interaction with surroundings.

Measuring just 5.7 × 2.9 × 1.5 mm— thinner than a cent coin and more compact than typical sensors with lower resolution — the TMF8829 delivers high resolution in a format ideal for space-constrained devices. Because it operates without a camera, it supports privacy-sensitive applications. When paired with a camera, the sensor enables hybrid vision systems like RGB Depth Fusion, combining depth and colour data for AR applications such as virtual object placement.

Classified as a Class 1 eye-safe device, the TMF8829 uses a dual VCSEL (Vertical Cavity Surface Emitting Laser) light source to measure distances up to 11 meters with 0.25 mm precision — sensitive enough to detect subtle movements like a finger swipe. With its 48×32 zones, the sensor covers an 80° field of view, delivering depth information across a scene comparable to that of a wide-angle lens. On-chip processing reduces latency and simplifies integration. Instead of relying on a single signal, the sensor builds a profile of returning light pulses to identify the most accurate distance point — ensuring stable performance even with smudged cover glass. Full histogram output supports AI systems in extracting hidden patterns or additional information from the raw signal.

https://ams-osram.com/

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