Sector News

RTG4 Sub-QML is claimed to be first rad-tolerant FPGA in a plastic package

Wed, Jun 30, 2021

Microchip’s RTG4 Sub-QML FPGA has been qualified to JEDEC standards in a flip-chip 1657 ball grid array plastic package, with 1.0mm ball pitch. The low-power RTG4 FPGA offers new space system designers the industry’s highest reliability at lowest cost with shortest lead times, says Microchip Technology.

The radiation tolerant (RT) FPGA offers developers of small-satellite constellations and other systems used in new space missions the low cost of a JEDEC-qualified plastic package with the reliability of RTG4 FPGA technology and decades of spaceflight heritage, eliminating full Qualified Manufacturers List (QML) procedures.

“This is a major milestone for system designers who need large volumes of space-grade components at low unit cost, and reduced lead times so they can keep pace with shorter service launch cycles,” said Ken O’Neill, associate director, space and aviation marketing for Microchip’s FPGA business unit.

The RTG4 Sub-QML FPGA is pin-compatible with the company’s QML Class V-qualified RTG4 FPGAs in ceramic packages, making it easy for developers to migrate their designs between new space and more rigorous Class-1 missions. The RTG4 Sub-QML FPGAs in plastic packages are also available as prototypes in small quantities, allowing designers to evaluate the product and prototype their systems before committing to large volumes of flight models.

Other Microchip products available in plastic packages for spaceflight systems include its LX7730 telemetry controllers, LX7720 position sensing and motor controllers, and high-reliability plastic versions of its microcontrollers, microprocessors, Ethernet PHYs, ADCs, EEPROM and flash and memory.

The JEDEC-qualified RTG4 Sub-QML FPGA in the 1657 ball plastic BGA package is available in production volumes.

Microchip Technology offers development tools and a comprehensive product portfolio and serves more than 120,000 customers across the industrial, automotive, consumer, aerospace and defence, communications and computing markets.

http://www.microchip.com

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Payment bracelets interpret gestures and use biometric data

Tue, Jun 29, 2021

Collaboration between Italian start-up, DEED and Infineon Technologies, is showcased at MWC21. The get bracelets interpret human gestures and use biometic data to pick up a call or make payments.

At the core of get is a system consisting of components from Infineon that enable the wearable with connectivity, computing, sensing and security capabilities. Infineon’s Secora Connect supports the payment functionality based on lowest power consumption to achieve longest battery life for the consumer. Infineon’s Xensiv MEMS technology provides high-fidelity voice recording during phone call. The PSoC 6 microcontroller family which uses a high performance dual-core M4/M0 architecture is paired with Infineon’s Airoc Wi-Fi and Bluetooth for secure, low power  connectivity.

According to Edoardo Parini, CEO and founder of DEED, the bracelet’s pioneering features include new and higher security standards, an ID acquisition method for contactless payment and there is no screen. “It is the perfect bridge between ‘you‘ and ‘your’ digital-self!” said Parini.

Patented techniques have been used to create a seamless, light and water resistant wearable wristband, made up of several layers, based around a rigid-flex PCB. The intuitive human machine interface (HMI) allows for natural operation because the wearer does not have to swipe on screens or touch any display. Motion sensors with artificial intelligence (AI), for gesture recognition allow it to interpret human gestures, for example, to pick up a call, to check the time or to make payments. Consumers can use it to listen to audio or answer calls by holding their finger to their ear by ‘wrist bone conduction’, sending the sound through the body to the inner ear. Contactless payments can be released after individual electrocardiogram-based biometric identification. The bracelet also allows fitness and health monitoring.

http://www.infineon.com

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IR dynamic gesture sensor keeps driver’s eyes on the road

Tue, Jun 29, 2021

Hand gestures can be recognised by the MAX25405 next-generation optical sensor to ensure that a driver’s eyes remain on the road. The optical sensor recognises a variety of gestures in a quarter of the size and at 10x lower cost than camera-based time of flight systems in automotive, industrial and consumer applications, says Maxim Integrated.

The MAX25405 detects a wider proximity of movement and doubles the sensing range to 40cm compared to earlier generations, in a form factor that is a quarter the size of camera-based systems in automotive, industrial and consumer applications. According to Maxim, these enhancements offer an alternative to voice communications, enabling drivers to focus on the road.

The MAX25405 has integrated optics, a 6 x 10 infra red sensor array and a glass lens which increases sensitivity and improves the signal to noise ratio. The improved performance doubles the proximity and distance of sensing applications so that passengers in the front and rear seats can be also operate entertainment displays, for example, with gestures. There is a high level of integration compared to competitive ToF solutions that require three chips and a complicated microprocessor.

The MAX25405’s small 20-pin, 4.0 x 4.0 x 1.35mm quad flat no-lead (QFN) package together with four discrete LEDs measures up to 75 per cent smaller than ToF camera-based solutions.

The MAX25405 recognizes nine gestures, including swipe, rotation, air-click, linger to click and 3 x 2 proximity zones with minimal lag time. It is affordable for use in multi-range automotive, consumer and industrial applications, including touch-free smart home hubs and thermostats.

The MAX25405 gesture sensor and associated MAX25405EVKIT# evaluation kit are available now.

Maxim Integrated has a broad portfolio of semiconductors, tools and support, to delivers analogue solutions including efficient power, precision measurement, reliable connectivity and robust protection along with intelligent processing for automotive, communications, consumer, data centre, healthcare, industrial and IoT applications.

http://www.maximintegrated.com

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Reference design enhances 3D computer vision for edge AI

Tue, Jun 29, 2021

Combining the AI computing of Blaize and the image processing of eYs3D Microelectronics, the Blaize Pathfinder P1600 system on module reference design is available for indoor and outdoor AI-based autonomous robotics, security, touchless control, autonomous vehicles and smart retails.

There is an integrated eYs3D depth camera which has stereo vision capabilities that deliver millimeter-level accuracy of depth at optimal range, says Blaize. The Blaize Pathfinder P1600 system on module (SoM) capabilities can eliminate the use of costly lidar implementations for robotics and other autonomous services, Blaize advises.

The SoM uses Blaize’s programmable Graph Streaming Processor (GSP) architecture and software productivity suite to process both RGB camera data and depth data for accurate 3D sensor fusion applications at the edge. According to Rajesh Anantharaman, senior director products at Blaize, the GPS architecture and eYs3D integration enables faster time-to-market for systems incorporating visual simultaneous location and mapping (VSLAM), facial feature depth recognition, and gesture-based commands.

The combined design improves depth and distance sensing via the camera’s 3D sensor application that includes a sensor fusion function enabling a combination of two sets of data – RGB camera data and depth data. The Blaize P1600 can convert the depth camera’s USB output to high-speed Ethernet connectivity, for enhanced video processing. Software development kits for the reference design will accommodate a wide range of operating systems, programming languages and development tools.

“We are excited to partner with Blaize to bring advanced computer vision capability to market, such as filtering, depth-sensing fusion, real-time 3D point cloud compression and streaming, that further enhance edge AI capability,” said James Wang, eYs3D’s chief strategy officer.

“Depth-sensing technology has been widely adopted commercially in consumer and industrial applications in the last few years. eYs3D is a leader in 3D-stereo vision and its technology has already been used in popular VR headsets, robot arm visual systems and facial recognition kiosks. We are now seeing growing applications in robotics, 3D scene learning, drones, smart retail and other markets,” he added.

The Blaize AI software suite comprises Blaize Picasso and AI Studio.

http://www.blaize.com

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