Sector News

Ampleon bases its integrated Doherty power amplifier on its LDMOS technology

Fri, Jul 02, 2021

Based on Ampleon’s LDMOS transistor technology, the LGA series of RF power amplifiers are targeted at small cell infrastructure and massive multiple input/multiple output (MIMO) implementations. They are supplied in 50Ohm in/out packages and are compact with dimensions of 7.0 x 7.0mm.

The LGA series power amplifiers cover frequencies from 700MHz through to 4.1GHz. Each features a three-stage, fully integrated Doherty design, which helps to reduce the board space needed for the power amplifier circuitry. It also accelerates  development time and facilitates volume production, says Ampleon. They support signal bandwidths reaching all the way to 300MHz, with the elevated output powers that they can deliver (up to 16W) enabling greater network coverage. The strong efficiency figures (greater than 40 per cent at 9.0dB on some models) contribute to keeping power consumption levels low, and mean that the power amplifiers generate only minimal heat enabling smaller and less visible base stations.

The compatible pinout definition shared across all of the devices in this series allows engineers to apply the same base layout to cellular network hardware designs covering different frequencies. The relevant device can simply be dropped in as required, explains Ampleon. This means the multi-operator business models that are now emerging may be addressed.

Created in 2015, Ampleon specialises in high-frequency applications based on  LDMOS and GaN technologies. Ampleon has more than 1,600 employees worldwide, dedicated to enabling customers to be successful with RF power products through close co-operation and partnership, innovation, and excellent execution. The consistent portfolio offers products and solutions for 4G LTE and 5G NR infrastructure, industrial, scientific, medical, broadcast, aerospace, and defence applications.

http://www.ampleon.com

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RTG4 Sub-QML is claimed to be first rad-tolerant FPGA in a plastic package

Wed, Jun 30, 2021

Microchip’s RTG4 Sub-QML FPGA has been qualified to JEDEC standards in a flip-chip 1657 ball grid array plastic package, with 1.0mm ball pitch. The low-power RTG4 FPGA offers new space system designers the industry’s highest reliability at lowest cost with shortest lead times, says Microchip Technology.

The radiation tolerant (RT) FPGA offers developers of small-satellite constellations and other systems used in new space missions the low cost of a JEDEC-qualified plastic package with the reliability of RTG4 FPGA technology and decades of spaceflight heritage, eliminating full Qualified Manufacturers List (QML) procedures.

“This is a major milestone for system designers who need large volumes of space-grade components at low unit cost, and reduced lead times so they can keep pace with shorter service launch cycles,” said Ken O’Neill, associate director, space and aviation marketing for Microchip’s FPGA business unit.

The RTG4 Sub-QML FPGA is pin-compatible with the company’s QML Class V-qualified RTG4 FPGAs in ceramic packages, making it easy for developers to migrate their designs between new space and more rigorous Class-1 missions. The RTG4 Sub-QML FPGAs in plastic packages are also available as prototypes in small quantities, allowing designers to evaluate the product and prototype their systems before committing to large volumes of flight models.

Other Microchip products available in plastic packages for spaceflight systems include its LX7730 telemetry controllers, LX7720 position sensing and motor controllers, and high-reliability plastic versions of its microcontrollers, microprocessors, Ethernet PHYs, ADCs, EEPROM and flash and memory.

The JEDEC-qualified RTG4 Sub-QML FPGA in the 1657 ball plastic BGA package is available in production volumes.

Microchip Technology offers development tools and a comprehensive product portfolio and serves more than 120,000 customers across the industrial, automotive, consumer, aerospace and defence, communications and computing markets.

http://www.microchip.com

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Payment bracelets interpret gestures and use biometric data

Tue, Jun 29, 2021

Collaboration between Italian start-up, DEED and Infineon Technologies, is showcased at MWC21. The get bracelets interpret human gestures and use biometic data to pick up a call or make payments.

At the core of get is a system consisting of components from Infineon that enable the wearable with connectivity, computing, sensing and security capabilities. Infineon’s Secora Connect supports the payment functionality based on lowest power consumption to achieve longest battery life for the consumer. Infineon’s Xensiv MEMS technology provides high-fidelity voice recording during phone call. The PSoC 6 microcontroller family which uses a high performance dual-core M4/M0 architecture is paired with Infineon’s Airoc Wi-Fi and Bluetooth for secure, low power  connectivity.

According to Edoardo Parini, CEO and founder of DEED, the bracelet’s pioneering features include new and higher security standards, an ID acquisition method for contactless payment and there is no screen. “It is the perfect bridge between ‘you‘ and ‘your’ digital-self!” said Parini.

Patented techniques have been used to create a seamless, light and water resistant wearable wristband, made up of several layers, based around a rigid-flex PCB. The intuitive human machine interface (HMI) allows for natural operation because the wearer does not have to swipe on screens or touch any display. Motion sensors with artificial intelligence (AI), for gesture recognition allow it to interpret human gestures, for example, to pick up a call, to check the time or to make payments. Consumers can use it to listen to audio or answer calls by holding their finger to their ear by ‘wrist bone conduction’, sending the sound through the body to the inner ear. Contactless payments can be released after individual electrocardiogram-based biometric identification. The bracelet also allows fitness and health monitoring.

http://www.infineon.com

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IR dynamic gesture sensor keeps driver’s eyes on the road

Tue, Jun 29, 2021

Hand gestures can be recognised by the MAX25405 next-generation optical sensor to ensure that a driver’s eyes remain on the road. The optical sensor recognises a variety of gestures in a quarter of the size and at 10x lower cost than camera-based time of flight systems in automotive, industrial and consumer applications, says Maxim Integrated.

The MAX25405 detects a wider proximity of movement and doubles the sensing range to 40cm compared to earlier generations, in a form factor that is a quarter the size of camera-based systems in automotive, industrial and consumer applications. According to Maxim, these enhancements offer an alternative to voice communications, enabling drivers to focus on the road.

The MAX25405 has integrated optics, a 6 x 10 infra red sensor array and a glass lens which increases sensitivity and improves the signal to noise ratio. The improved performance doubles the proximity and distance of sensing applications so that passengers in the front and rear seats can be also operate entertainment displays, for example, with gestures. There is a high level of integration compared to competitive ToF solutions that require three chips and a complicated microprocessor.

The MAX25405’s small 20-pin, 4.0 x 4.0 x 1.35mm quad flat no-lead (QFN) package together with four discrete LEDs measures up to 75 per cent smaller than ToF camera-based solutions.

The MAX25405 recognizes nine gestures, including swipe, rotation, air-click, linger to click and 3 x 2 proximity zones with minimal lag time. It is affordable for use in multi-range automotive, consumer and industrial applications, including touch-free smart home hubs and thermostats.

The MAX25405 gesture sensor and associated MAX25405EVKIT# evaluation kit are available now.

Maxim Integrated has a broad portfolio of semiconductors, tools and support, to delivers analogue solutions including efficient power, precision measurement, reliable connectivity and robust protection along with intelligent processing for automotive, communications, consumer, data centre, healthcare, industrial and IoT applications.

http://www.maximintegrated.com

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