PICO-ITX board powers industrial AI and machine vision, says Aaeon

Equipped with the 11th generation Intel Core U processors, the PICO-TGU4 is the latest PICO-ITX board from Aaeon. It is intended for industrial artificial intelligence (AI) and machine vision applications.

The 11th generation Intel Core processors (formerly Tiger Lake) are based on Intel’s 10nm microarchitecture, delivering up to 15 to 20 per cent better performance than the previous generation processors. The PICO-TGU4 is available with Intel Core U i3 / i5 / i7 or Intel Celeron processors. All of these processors support data integrity, accuracy and security, including on-board TPM 2.0 and in-band memory error code correction (ECC) with selected models. There is also up to 32Gbyte of on-board LPDDR4x memory, making the PICO-TGU4 capable of deployment in a wide range of embedded and edge computing applications, said Aaeon.

The PICO-TGU4 has two expansion slots which can be used to add functionality to power AI edge applications. The M.2 2280 slot delivers PCIe 4.0 [x4] speeds, for AI accelerator cards such as the AI Core XM2280, as well as providing the throughput needed to support the next generation of AI accelerators. The full-sized Mini Card (mPCIe) slot has support for AI accelerators, wireless modules such as Wi-Fi or LTE, expanded storage with mSATA support and 30-bit digital I/O cards.

The PICO-TGU4 offers a broad I/O layout allowing the board to easily connect to a wide range of sensors and devices or integrate with projects. There are eight USB connections, made up of two USB3.2 Gen 2 type A ports, two USB3.2 Gen 1 headers and four USB2.0 headers. There are also two serial port headers and 8-bit GPIO and I2C/SMBUS connectors.

The PICO-TGU4 also features dual LAN ports, one Intel i225 2.5Gbits per second port for fast LAN connectivity and an Intel i219 port with support for Intel vPro, enabling remote system monitoring. Storage includes both SATA III (6.0Gbits per second) and support for Mini Card mSATA storage. Additionally, there are eDP and HDMI 2.0 ports for 4K 60Hz resolution.

The PICO-TGU4 is backed by Aaeon’s expertise in building compact, rugged solutions to operate in a wide range of industrial and other environments. Aaeon also offers a range of manufacturer and OEM/ODM services, from customising board layouts to helping developers create a board level solution that fits application requirements.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI edge  computing platforms including industrial motherboards and systems, rugged tablets, embedded AI edge systems, uCPE network appliances, and LoRaWAN / WWAN.

The company is an Associate member of the Intel Internet of Things Solutions Alliance.

http://www.aaeon.com

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Sensor evaluation board accelerates IoT development, says Bosch Sensortec

R&D effort can be simplified to assist rapid prototyping and reduce time to market for the segmented IoT market, using the Application Board 3.0, says Bosch Sensortec. It offers Bluetooth connectivity and a small form factor for IoT applications and supports the full range of Bosch Sensortec sensors

The Application Board 3.0 simplifies the evaluation and prototyping of sensors for a wide range of applications, particularly in Industry 4.0, IoT, smart home systems, and wrist- and head-mounted wearables, explained Bosch-Sensortec.

Any Bosch Sensortec sensor mounted on a ‘shuttle board’ is simply plugged into the socket on the Application Board. All shuttle boards have an identical footprint, and Bosch Sensortec’s software automatically detects which sensor is plugged in at any given moment to launch the appropriate software. This enables the straightforward evaluation of a wide range of sensors and solutions, said Bosch Sensortec. Prototypes can be built to quickly test different use case configurations, added the company.

 The board measures just 47.0 x 37.0 x 7.0mm3, which is practical for evaluating sensors used in portable applications, observed Bosch Sensortec. The board can be powered using a 3.7V Li-ion battery or a standard 5V USB power supply.

“The Application Board 3.0 makes it quick and easy for developers to build their projects with any of our sensors on a single platform, meaning that they can now focus on creating unique use cases and differentiating their products,” says Dr. Stefan Finkbeiner, CEO at Bosch Sensortec. “Our customers also benefit from efficient support through regional field application engineers and Bosch offices,” he continued.

The integrated development environment (IDE) software provided with the board includes a simplified graphical user interface (GUI) to evaluate and tune sensor parameters, as well as to visualise and record sensor data. The software also saves time in troubleshooting sensor-related issues, claims Bosch Sensortec.

Application Board 3.0 is designed around the u-blox NINA-B302 Bluetooth Low Energy (BLE) module and is based on the nRF52840 chipset from Nordic Semiconductor, which includes an Arm Cortex-M4F CPU. It is certified and compliant with multiple directives for different international regions: CE, RoHS, China RoHS, FCC, IC, VCCI, SRRC and NCC.

The board is supplied with 256kbyte RAM, 1Mbyte of internal flash and 2Gbyte of external flash memory for data logging. It provides full-speed micro-USB 2.0 connectivity and BLE to connect to a host, such as a PC, for transferring the logged sensor data from the board.

The Application Board 3.0 is available now.

http://www.bosch-sensortec.com

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Imec develops 120Gbaud SiGe BiCMOS to advance optical interconnects

To enable a “significant increase” in baud rate combined with at least 80GHz analogue output bandwidth, a scalable SiGe BiCMOS technology developed by Imec, can be produced in volume, “paving the way to cost-effective, high-speed optical transceivers for the Tbit era,” said the research group.

It has been designed for data-intensive applications, such as cloud services, video streaming, high-performance computing and 5G, which place demands on optical communication networks within data centres. The most performant optical links operate at speeds up to 400Gbits per second, using for example four 100Gbit per second channels. Data centre operators believe that Terabit per second optical transceivers will be needed within a few years. At the same time as the increasing demands on data centres’ optical networks, co-packaged paradigms are emerging to help optical switches manage the massive bandwidth density at input. These are also expected to reach 100Terabits per second. In these co-packaged optics, Si photonics transceivers are tightly integrated with the high-speed electronic circuits.

Increasing the capacity of the optical links despite the smaller footprints of transceivers will impact the design of photonic high-speed ICs used in transceivers, said Imec. One solutions is to increase signalling rates beyond 100Gbaud. Such rates may be beyond the capabilities of advanced CMOS nodes (for example FinFETs), leaving greater than 100Gbaud speeds to be handled by InP technologies, where their smaller wafer sizes and reduced capability to integrate more complex functionality makes scaling up these processes challenging. Imec is looking at III-V on CMOS processes, initially with the integration of novel circuit architectures in SiGe BiCMOS to achieve beyond 100Gbaud operation.

Scientists from imec-IDLab have developed a novel transmitter architecture that has key building blocks fabricated in a mainstream SiGe BiCMOS process. Imec’s Peter Ossieur, explained: “The resulting IC decodes four 30Gbaud PAM-4 (or four 60Gbits per second NRZ) streams, and simultaneously multiplexes and equalises these streams into a 120Gbaud PAM-4 signal with more than 80GHz bandwidth, 1.2Vpp voltage swing and 2200mW power consumption. Since the four-level pulse amplitude PAM-4 modulation format involves two bits per symbol (denoted as 00, 01, 10 and 11), this is the equivalent of a 240Gbit per second (single lane) transmitter, he told Electronic Design.

Within the transmitter IC, a multiplexer (MUX) combines multiple low-speed input signals from a CPU or GPU within the data centre, into a single full-rate data stream. This stream is then equalised to compensate for any bandwidth losses in the modulator and the channel. The high-speed equalised signal is then used as an input signal for the driver that subsequently feeds the optical modulator.

Rather than performing equalisation in the digital domain using a DSP, before conversion into an analogue signal, Imec has developed a transmitter IC architecture which implements an analogue signal processing variant of the DSP filter, with the integrated MUX, FFE and driver fabricated in mainstream 55nm SiGe BiCMOS.

“The work shows a doubling of the operating rate compared to FinFET solutions and closely matches the speed and power obtained in InP-based solutions”, reported Peter Ossieur.

“These building blocks will also be crucial for developing novel coherent transceiver concepts, which exploit the phase and polarisation of the optical field to further increase the bit rate,” said Ossieur.

http://www.imec-int.com

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Intuitive GNSS receiver evaluation software gives GPS a boost

Global navigation satellite system (GNSS) evaluation software from u-blox, u-center 2, offers advanced features to explore u-blox positioning technologies.

The software runs on Microsoft Windows and is suitable for 10 generation u-blox GNSS technology. It has an intuitive interface to configure GNSS products, evaluate their performance, improve software quality and experience the performance boost achieved using GNSS-related services, said u-blox.

The successor to the u-blox u-center GNSS evaluation software is compatible with the latest u-blox M10 GNSS technology. u-center 2 includes additional features which simplify the configuration, evaluation, and software development of GNSS-based solutions.

It provides personalised workspaces with adaptive windows for a choice of views to observe the connected GNSS receiver’s static and dynamic behaviour. A built-in log player accepts log files from the previous version of the software. It also features  message- and time-based navigation and lets users set the playback speed. Updates are automatic to ensure that the software always includes the latest features, added u-blox.

It also serves to simplify the evaluation of GNSS-related location services, including AssistNow, through which GNSS receivers gain access to GNSS aiding data, enhancing startup performance and saving power, claimed the company.

Bernd Heidtmann, product manager, product strategy for Standard Precision GNSS at u-blox, commented: “With its fresh and minimalist user interface, the upcoming quick product configuration designed for key use cases, and optimised data logging, u-center 2 will raise the benchmark for GNSS evaluation tools in terms of performance and user experience.”

u-center 2 is free for download.

u-blox specialises in positioning and wireless communication in automotive, industrial, and consumer markets, providing services and products which let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks.

The company’s portfolio of chips, modules, and secure data services and connectivity, allows customers to develop solutions for the IoT, quickly and cost effectively.

The company’s headquarters are in Thalwil, Switzerland, with offices in Europe, Asia, and the USA.

http://www.u-blox.com

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