Sector News Archives - Page 281 of 622 - SmartCitiesElectronics.com

IAR Embedded Workbench for Arm supports NXP’s S32K3 MCUs

Tue, Nov 16, 2021

The complete development toolchain IAR Embedded Workbench for Arm now supports NXP Semiconductors’ latest automotive microcontroller (MCU) family, the S32K3.

The announcement extends the list of MCUs supported by the embedded tool suite. NXP’s S32K3 MCUs are designed for automotive body electronics, battery management and zone and domain controllers. The extended MCU support will help developers maximise application performance, maintain a high level of code quality and achieve functional safety compliance in automotive designs, says IAR.

The introduction is intended to meet the growing complexity in automotive embedded systems with development tools that help companies maximise the capabilities of the chosen MCU without compromising on workflow efficiency. IAR Embedded Workbench for Arm delivers optimisations, comprehensive debugging features and integrated code analysis tools. In addition, the toolchain is available in a functional safety edition certified by TÜV SÜD in accordance with 10 standards, such as the international umbrella standard for functional safety, IEC 61508, and the automotive standard ISO 26262

The S32K3 MCUs are based on single, dual and lockstep-configured Arm Cortex-M7 cores and support ASIL B/D safety applications. They include a hardware security engine with NXP firmware, support for firmware over-the-air (FOTA) updates and ISO 26262 compliant real-time drivers software for AutoSAR and non-AutoSAR with IAR Embedded Workbench support.

IAR Systems supplies future-proof software tools and services for embedded development, enabling companies worldwide to create the products of today and the innovations of tomorrow.

The company was established in 1983 and is headquartered in Uppsala, Sweden. It has sales and support offices all over the world.

Since 2018, Secure Thingz, which specialises in device security, embedded systems, and lifecycle management, has been part of IAR Systems Group.

http://www.iar.com

> Read More

5G beamformer IC family includes dual-polarisation mmWave devices

Mon, Nov 15, 2021

Third-generation beamformer ICs by Renesas Electronics include two dual-polarisation mmWave devices optimized for 2×2 antenna architecture for 5G and broadband wireless applications. They are claimed to have best-in-class performance at n257, n258, and 261 bands. The integrated F5288 and F5268 transmitter / receiver (8T8R) chipsets are in a 5.1 x 5.1mm BGA package and are claimed to have the industry’s highest Tx output power capability in silicon, delivering more than 15.5dBm linear output power per channel. They are intended for cost-efficient radio design with extended signal reach for wireless infrastructure applications including wide area, small cell and macro basestations, as well as CPE (customer premises equipment) and fixed wireless access (FWA) access points. Communications customers can reduce design times by repurposing antenna array designs across different applications, advises Renesas.

The F5288 and F5268 ICs feature a Dynamic Array Power (DAP) technology that enables high-efficiency operation at linear output power levels programmable from 10 to 16dBm.

“Adequate signal range – or lack thereof – remains the biggest challenge as the industry shifts to 5G mmWave technologies for both urban and suburban mobile and fixed wireless networks,” said Naveen Yanduru, vice president of RF communications product division at Renesas.

The third-generation mmWave beamformer ICs’ dual-polarisation eight-channel architecture provides a symmetric and low loss antenna routing network to improve overall antenna efficiency, says Renesas. The exposed die package allows for efficient thermal management at the board with improved heat dissipation through the back of the IC. According to Renesas, temperature compensation techniques minimise RF performance degradation with varying temperatures The package pinmap is designed to simplify board design and reduce design risks.

In addition to Dynamic Array Power technology for scaling output power, the F5288 and F5268 ICs feature ArraySense technology which allows users to monitor IC performance in array operation and apply critical corrections real-time. They also include RapidBeam advanced digital control technology to enable simultaneous synchronous and asynchronous control of several beamformer ICs to achieve extremely fast beamsteering operations.

The F5288 operates at 26.5 to 29.5GHz and the F5268 operates at 24.25 to 27.5GHz. They also have phase and gain control which includes 360 degree phase control with true six-bit resolution and up to 31.5dB gain control in 0.5dB steps. There are improved Rx linearity modes and Rx noise figures as low as ~4.5dB at room temperature and under 5.5dB at temperatures up to 95 degrees C.

The F5288 and F5268 beamformer ICs and evaluation systems are available now.

http://www.renesas.com

> Read More

Rohde & Schwarz and MediaTek deliver Wi-Fi 6E production test

Mon, Nov 15, 2021

Rohde & Schwarz has integrated its CMP180 radio communication test platform into MediaTek’s ATE tool to offer one of the first production test solutions for Wi-Fi 6E devices.

The R&S CMP180 radio communication test platform is designed to manage multiple parallel signals for both multiple devices and MIMO transmission methods, providing maximum measurement speed at frequencies up to 8GHz. The analyser / generator single box tester covers wireless standards including Wi-Fi 6E, Wi-Fi 7 and 5G NR at FR1 frequencies, with a wide range of legacy technologies.

Wi-Fi 6E devices can now take advantage of the 6GHz band to the full power of Wi-Fi 6 by making use of 160MHz channels in a widely uncongested band. They are able to deliver multi-gigabit connection speed, and low latency for applications like working, schooling, gaming and streaming.

In January 2021, MediaTek announced its Wi-Fi 6E platforms for access points and client-side devices have been selected for the Wi-Fi Alliance Wi-Fi 6E Certification Program. The company offers both MT7915-AP-AX (access point) and MT7915-STA-AX (client-side) as testbed devices.

As a result of the co-operation, the R&S CMP180 is now qualified for Wi-Fi production testing with MediaTek’s automatic production test tool (Meta and Multi ATE). MediaTek’s customers using the latest MediaTek mobile platforms with wireless technologies can now integrate the R&S CMP180 in production lines.

According to Dr Yenchi Lee, deputy general manager of MediaTek’s wireless communications business unit at MediaTek explained that the collaboration has enabled customers to speed up development and verification of products using the R&S CMP180 alongside devices under test (DUT) provided by MediaTek.

The Rohde & Schwarz technology group has products for test and measurement, technology systems and networks and cybersecurity. Founded more than 85 years ago, the group is headquartered in Munich, Germany.

http://www.press.rohde-schwarz.com

> Read More

Multi-cell battery ICs tackle large, HV battery packs

Fri, Nov 12, 2021

Battery packs that packs that power e-scooters, energy storage, high-voltage power tools, and other high-voltage equipment can be managed with RAA48920x ICs. Renesas Electronics claims that the multi-cell battery front end ICs for battery management systems (BMS) accelerate battery development for mobility, uninterrupted power supplies (UPS) and energy storage systems.

The ICs provide fast, flexible, cell balancing up to 200mA to enable fast recharging and high utilisation in large battery packs with hot plug tolerance up to 62V.

BMS, or the ‘brains’ of the battery pack, is increasingly adopted in UPS and data centres, driving demand for ICs that can support higher voltage and larger cell battery pack sizes, said Andrew Cowell, vice president at Renesas’, mobility, infrastructure and IoT power business division. The RAA489206 and RAA489204 ICs have been designed to simplify the design process and create robust, cost-effective battery systems for the growing mobility, UPS back up and energy storage markets, he explained.

The RAA489206 is designed for higher voltage mobility applications where larger cell count and temperature variance across cells are more likely to lead to cell-to-cell imbalances. It provides full high-side battery protection and monitoring for 4S to 16S cell battery packs. The RAA489204 provides improved daisy chain operation with accelerated device-to-device communication and enhanced diagnostics compared with previous-generation devices. It also has internal cell balancing options and support for the higher voltages and cell count required by UPS systems, grid back up and other energy storage systems.

The ICs’ high integration simplifies the design cycle and reduces customers’ system bill of materials’ costs “significantly”, claims Renesas, adding that it also accelerates design and bill of material selection time from months to weeks.

The ICs also feature extensive built-in self diagnostics, improving safety functionality, reducing firmware workload and easing the design burden for meeting safety standards. They are pin-to-pin compatible with Renesas’ previous battery front end devices.

Both the RAA489206 and RAA489204 ICs are available now.

http://www.renesas.com

> Read More

IAR Embedded Workbench for Arm supports NXP’s S32K3 MCUs

5G beamformer IC family includes dual-polarisation mmWave devices

Rohde & Schwarz and MediaTek deliver Wi-Fi 6E production test

Multi-cell battery ICs tackle large, HV battery packs

About Smart Cities