Intel expands neuromorphic research chip – introducing Loihi 2

Now with one million neurons, the second generation research chip from Intel, Loihi 2, uses a pre-production Intel 4 process. There is also now a software framework for developing neuro-inspired applications.

The second-generation chip improves the speed, programmability, and capacity of neuromorphic processing, comments Mike Davies, director of Intel’s Neuromorphic Computing Lab. Loihi 2 broaden the processing technology’s use in power and latency constrained intelligent computing applications. “We are open sourcing Lava to address the need for software convergence, benchmarking, and cross-platform collaboration in the field, and to accelerate our progress toward commercial viability,” adds Davies.

Neuromorphic computing draws insights from neuroscience to create chips that function more like the biological brain. Researchers hope that it will deliver orders of magnitude improvements in energy efficiency, speed of computation and efficiency of learning across edge applications including vision, voice and gesture recognition to search retrieval, robotics, and constrained optimisation problems. To this end, Intel and partners have demonstrated robotic arms, neuromorphic skins and olfactory sensing projects.

Advances in Loihi 2 allow the architecture to support new classes of neuro-inspired algorithms and applications and provide processing that is 10 times faster than its predecessor. It also exhibits up to 15 times greater resource density (up to one million neurons per chip), and improved energy efficiency.

Fabricated with a pre-production version of the Intel 4 process, the use of extreme ultraviolet (EUV) lithography has simplified the layout design rules compared to past process technologies for rapid development of Loihi 2, says Intel.

The Lava software is an open, modular, and extensible framework, for researchers and application developers to build on each other’s progress and converge on a common set of tools, methods, and libraries. Lava runs seamlessly on heterogeneous architectures across conventional and neuromorphic processors, and is interoperable with a variety of AI, neuromorphic and robotics frameworks.

Developers can begin building neuromorphic applications without access to specialized neuromorphic hardware and can contribute to the Lava code base, including porting it to run on other platforms.

Loihi 2’s greater programmability will allow a wider class of difficult optimisation problems to be supported, including real-time optimisation, planning, and decision-making from edge to data centre systems.

Loihi 2 also improves support for advanced learning methods, including variations of backpropagation, the algorithm of deep learning.

Fully programmable neuron models and generalised spike messaging in Loihi 2 suggest reductions of over 60 times fewer ops per inference compared to standard deep networks running on the original Loihi without loss in accuracy. It incorporates faster, more flexible, and more standard I/O interfaces, including Ethernet interfaces, glueless integration with a wider range of event-based vision sensors, and larger meshed networks of Loihi 2 chips.

http://www.intel.com

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Wireless charging transmitter coil driver is in QFN3x3 package

The first in a family of coil drivers from Alpha and Omega Semiconductor (AOS) that are supplied in a thermally enhanced QFN3x3 package are suitable for wireless charging transmitter circuits in a variety of space constrained applications.

The AOZ32033AQI is an integrated half-bridge gate driver capable of driving high-side and low-side N-channel MOSFETs. The coil driver offers 30V, 11 mOhm in a QFN3x3 package. It features slew rate control (SRC) to adjust sink / source current and provide a trade-off between efficiency and EMI optimisation in the design of wireless charging transmitter (TX) circuits, explains AOS.

The coil driver is intended for use in wireless charging TX circuits used in cordless power tools, vacuum cleaners, drones, and other consumers’ electronic equipment which use full-bridge topology with a resonant tank circuit for power conversion efficiency.

The integrated package offers a part count reduction of up to 40 per cent compared to traditional approaches, says AOS. The AOZ32033AQI enables PCB space savings and higher performance in wireless transmitter circuits with high wattage of up to 30W. To ensure the design is robust, the coil driver has multiple protection functions such as high side and low side under-voltage lockout and over-temperature protection. The coil driver can be used for a wide range of input voltages from 4.0 to 28V.

“Wireless charging is offered at increasingly higher power levels as the benefits of eliminating physical connectors and cables are being realised by more end applications,” says said Colin Huang, power IC marketing manager at AOS. This, the first member announced of the company’s coil driver product family, will provide an efficient, power-dense, and cost-effective solution for wireless charging TX circuits, he continues. “The integrated approach offers protection features not possible by using a discrete approach while reducing engineering design cycles and complexities,” he says.

The AOZ32033AQI is immediately available in production quantities with a lead-time of 12 weeks.

Alpha and Omega Semiconductor (AOS) is a designer, developer, and global supplier of a broad range of power semiconductors, including a wide portfolio of  power MOSFET, IGBT, IPM, TVS, HVIC, SiC/GaN, power IC, and digital power products. AOS has developed extensive IP and technical knowledge to introduce innovative products to address the increasingly complex power requirements of advanced electronics.

AOS’s portfolio of products targets high-volume applications, including portable computers, flat-panel TVs, LED lighting, smartphones, battery packs, consumer and industrial motor controls, automotive electronics, and power supplies for TVs, computers, servers, and telecommunications equipment.

http://www.aosmd.com

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Reference design develops 3D spatial audio in headsets and earbuds

Three companies have collaborated to bring 3D spatial audio hardware and software together in a reference design for consumer electronics OEMs and ODMs.

Wireless connectivity and smart sensing specialist, Ceva, has partnered with wireless communications company, Beken and 3D spatial audio expert, VisiSonics to offer a 3D audio reference design to accelerate development and deployment of headsets and true wireless stereo (TWS) earbuds for use in gaming, multimedia and conferencing.

The reference design leverages Beken’s BK3288X Bluetooth Audio SoC series featuring the Ceva-X2 Audio DSP running VisiSonics’ RealSpace 3D audio software, together with Ceva’s MotionEngine Hear head tracking algorithms. OEMs and ODMs can use the ready-to-deploy SoC with any audio encoding format, to introduce 3D audio for VR, AR and the new generation of motion-aware earbuds. The single chip-based reference design provides a self-sufficient 3D audio solution, residing on the headset side, without the need for a 3D audio rendering engine on the host device. As well as being cost-efficient, this also enables a lower latency design, says Ceva.

Weifeng Wang, vice president of engineering at Beken, comments: “Spatial audio brings the wireless audio user experience to the next level and we’re pleased to partner with Ceva and VisiSonics to make it easy for our customers to leverage this exciting new technology in a cost-effective, power-efficient turnkey offering”.

“Spatial audio is an incredibly hot market right now as the Android and PC ecosystems look to build on the industry momentum behind its use in music and gaming to create immersive audio experiences,” adds Moshe Sheier, vice president of marketing at Ceva.

The 3D Audio Reference Design is available now directly from Ceva, and the associated software package combining VisiSonics’ RealSpace 3D audio with Ceva’s MotionEngine Hear is available now for licensing by Ceva and VisiSonics.

Ceva licenses wireless connectivity and smart sensing technologies. It provides DSPs, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence.

DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio / voice / speech and low-power always-on / sensing applications for multiple IoT markets.

https://www.ceva-dsp.com

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MEMS timing accelerates wireless charging says SiTime

For power-sensitive and space-constrained mobile and IoT applications, the SiT3901 uPower digitally controlled MEMS oscillator (DCXO) has been introduced by SiTime. It improves wireless charging speed by up to 25 per cent while reducing the overall timing solution area by up to 90 per cent, says the company. The MEMS oscillator is suitable for wireless charging systems for smart watches, activity trackers, hearing aids, and wearables.

“The power and size requirements of new wireless applications demand a new approach to timing,” says Piyush Sevalia, executive vice president of marketing at SiTime. “The SiT3901 DCXO is the industry’s first µPower digitally controlled oscillator, and it delivers by improving charging efficiency and reducing the area,” he adds.

Wireless charging standards such as Qi and AirFuel rely on resonant power transfer to enable proximity charging. However, environmental interference may dynamically impact the resonant charging frequency, which slows down the charging process. The SiT3901 enables the charger to dynamically tune the resonant frequency, maximising power transfer and delivering up to 25 per cent faster charging. The digital control feature on the SiT3901 DCXO eliminates the need for additional passive components on the board, reducing the timing solution area by up to 90 per cent. The resulting charging system works better and is smaller, more manufacturable, and more reliable, claims SiTime.

The SiT3901 DCXO extends SiTime’s µPower MEMS oscillator family targeting power and space-constrained wearable, hearable, IoT, and mobile applications. The µPower MEMS oscillators consume up to 90 per cent less power and up to 90 per cent less space compared to quartz oscillators, enabling environmentally friendly electronics. The SiT3901 offers high resilience to analogue noise and includes low 105 microA current consumption (typical), a wide digital pull range (up to 15 per cent) for output frequency and a programmable frequency of 1.0 to 26MHz. They are stable over temperature of ±50 and ±100 ppm and have a wide operating temperature range of -40 to +85 degrees C.

The oscillators are supplied in a small 1.5 x 0.8mm package size.

http://www.sitime.com

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