Sector News

OKW boosts enclosure range with larger sizes

Wed, Oct 06, 2021

OKW has added four sizes to its EasyTec range of fast-mount flanged enclosures. The new larger sizes suit more complex applications that require extra installation volume, such as IT network technology and smart factory sensor equipment.

These flanged enclosures are said to offer good stability. The flat base has a curved recess for secure pole mounting. Integrated mounting lugs feature apertures for cable ties and holes for panhead screws and there is a soft contoured top.

Internal screw pillars in the top and base enable EasyTec to accommodate two PCBs. Tamperproof stainless steel Torx assembly screws suit the housings to medical electronics.

EasyTec can be mounted quickly and easily on poles or flat surfaces in challenging industrial environments – either indoors or outdoors. Applications include IoT/IIoT, sensor systems, security and monitoring, stock control, environmental, medical and laboratory technology.

The enclosures come in four plan sizes, the original 80 and 100 and now 125 and150. Each plan size comes in two heights, giving a range of eight sizes from 101 x 50 x 22 mm to 172 x 93 x 46 mm. The enclosures are moulded from tough and UV-stable ASA+PC-FR (UL 94 V-0) in off-white (RAL 9002) as standard.

Prices start at £16. Accessories include IP 65 seals, 2.5 x 6 mm self-tapping screws (PZ1 and Torx T8) and a Torx T8 screwdriver.

Customising options include CNC machining, lacquering, printing/laser marking of legends and logos, EMC shielding, installation and assembly.

For more information go to https://www.okw.co.uk/en/Plastic-enclosures/Easytec.htm

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EasyPack 2B EDT2 power module for traction inverters up to 50 kW

Tue, Oct 05, 2021

Infineon Technologies has launched the automotive qualified EasyPack 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A RMS. The module is optimised for inverter applications in hybrid and electric vehicles.

With the introduction of the EDT2 (electric drive train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters.

The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip helps ensure significantly lower losses than current products on the market, says Infineon, and outperforms Infineon’s previous chip generation by 20 per cent.

Plug-and-play simplifies integration and compared to the classic through-hole discrete packages, as well as the  HybridPack 1, there Is no longer a need to solder pins.

Infineon’s PressFIT contact technology enables a reduction in mounting time and the compact package size means three EasyPack 2Bs need 30 per cent less surface area than a HybridPack 1.

The EasyPack 2B EDT2 is fully qualified to the AQG324 standard.

Over the past 10 years, Infineon has sold more than 50 million EasyPack module with various chip sets for a range of industrial and automotive applications.

The new EasyPack 2B EDT2 module FF300R08W2P2_B11A will be available starting in this month.

For more information go to http://www.infineon.com/easyinverter

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Impulse Embedded supplies Vecow’s EAC-2000 AI series

Tue, Oct 05, 2021

Impulse Embedded is now supplying the EAC-2000 series from Vecow. These compact, high-performance Edge intelligence systems use the NVIDIA Jetson Xavier NX SOM chip.

The series offers power efficiency in a rugged enclosure with wide temperature and DC power input ranges suitable for AI Vision projects, as well as industrial applications including traffic vision, intelligent surveillance, auto optical inspection, Smart Factory, AMR or AGV.

The NVIDIA Jetson Xavier NX System on Module (SOM) is a 15W processing unit that is built around a 384 Core NVIDIA Volta GPU, with 48 Tensor cores and a Hexa-core NVIDIA Carmel ARM V8.2 64-bit CPU with 6MB of L2 cache.

Capable of offering 21 TOPs of GPU accelerated performance, the Xavier NX can decode up to four 4K30 HEVC video streams while running modern neural networks in parallel. The EAC-2000 series is ready to be deployed out of the box as the Jetson Xavier NX also ships complete with 8GB of LPDDR4x of system memory and 16GB of eMMC storage.

NVIDIA’s Jetpack software suite means the EAC-2100 can be deployed with any application that was developed on a Jetson development kit.

The EAC-2000 is targeted at Edge AI demands and is powered by the NVIDIA Jetson Xavier NX. Packed with I/O, the EAC-2000 comes with one HDMI display port, two Gigabit PoE+ ports with 25W per port, dual Gigabit Ethernet, four USB3.1 and two serial ports.

For wireless connectivity, there is an M.2 E-key for wi-fi and Bluetooth, and an M.2 3042/3052 B-key slot that can support up to 5G cellular comms along with SIM card support and six antenna breakouts. For storage, in addition to the onboard 16GB eMMC included, there is an M.2 2280 M-key, plus an external SD card slot offering a variety of options.

The EAC-2100 expands on the feature set provided by the EAC-2000 and focuses more on in-vehicle usage, with the addition of CANbus support, four Fakra-Z connections for GMSL automotive cameras, and two Gigabit PoE+ ports.

Both models come in a compact wall-mountable metal chassis with EN 50155 and EN 50121-3-2 certification for EMC, a wide -20 degrees C to +70 degrees C operating temperature and 9V to 50V DC power input to meet the demands of a range of industrial automation and Edge applications, as well as support for the rail and in-vehicle market.

For more information go to http://www.impulse-embedded.co.uk

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Software packages support non-signalling RF tests

Tue, Oct 05, 2021

From Anritsu Corporation come two software packages that enhance its Radio Communications Test Station MT8000A to support non-signalling RF tests of 5G base stations (BTS). The MT8000A, with the software, helps address the increasing market demand for BTS antennas and complexities associated with 5G BTS.

The Base Station Test Suites for both NR sub-6 GHz (FR1) and NR mmWave (FR2) support most of the commonly used FR1 & FR2 frequencies, with multiple RF ports, globally. The new software supports downlink measurements for Tx tests and uplink signal generation for Rx tests in manufacturing environments.

The Radio Communications Test Station MT8000A, an all-in-one platform, can conduct measurements that are compliant with 3GPP TS38.141-1 and TS38.141-2 with the software installed. Tests supported include Tx power, frequency error, EVM, TAE, ACLR, OBUE Rx tests, and Rx sensitivity.

A flexible design allows the MT8000A to conduct highly efficient 5G BTS tests, says Anritsu. A GUI allows users to set parameters and view measurement results and an all-at-once measurement result display lets users view multiple Tx measurement items simultaneously.

It supports multi-carrier measurement and measurement results for each component carriers concurrently. With four RF ports, parallel measurements can be performed by the MT8000A, helping to improve test times and controlling cost-of-test.

Provider of communications test and measurement solutions for 125 years Anritsu partners with its customers to develop wireless, optical, microwave/RF, and digital solutions for research and development manufacturing, installation, and maintenance applications, as well as multi-dimensional service assurance solutions for network monitoring and optimisation.

Anritsu also provides precision microwave/RF components, optical devices, and high-speed electrical devices for communication products and systems. The company develops advanced solutions for 5G, M2M, IoT, as well as other emerging and legacy wireline and wireless communication markets.

With offices throughout the world, Anritsu has approximately 4,000 employees in more than 90 countries.

For more information go to http://www.anritsu.com

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