10GbE XMC module features dual 10GBASE-KX4 ports 

A rear I/O version of Acromag’s 10GbE network interface card (NIC) mezzanine module is now available. The XMC633 module offers KX4 backplane connections to Intel’s XL710 Ethernet controller.

The XMC633 offers two independent 10Gbit Ethernet (GbE) interface ports with 10GBASE-KX4 protocol. The XMC mezzanine card mounts on VME, VPX, PCIe and other embedded computing carrier boards. An Intel XL710 Ethernet controller provides network connectivity with off-load and virtualisation capabilities. The rear I/O model XMC633 routes two KX4 interfaces to the P16 connector and is compatible with conduction-cooling frames. 

The XMC633 joins two other models available from Acromag. The XMC631 model has four SFP+ front panel connectors for fibre optic or copper media transceivers, and the rear I/O model XMC632 routes two XAUI interfaces to P16. Optional VITA 61 connectors enable PCIe Gen3 data rates across eight high speed serial lanes on the XMC P15 connector. 

The XMC modules are designed for commercial off the shelf (COTS) applications, particularly in defence, aerospace, industrial, and scientific research computing systems. They operate in the extended temperature range of -40 to +85 degrees C.

The XMC modules optimise network performance with intelligent off-loading, virtualisation and advanced traffic direction. The XL710 Ethernet controller, when paired with a Xeon-D processor provide a balanced hybrid modules for compute and off-load capabilities to optimise performance and reduce bottlenecks, added Acromag. For example, with TCP stateless off-loads, the XL710 demonstrates leading performance compared with TOE solutions without restricting feature usage, claimed the company. 

Other features include precision timing, energy efficient Ethernet (EEE) and dynamic load balancing. Advanced traffic steering capabilities increase transaction rates and reduce latency, added Acromag.

In rugged systems, the dual KX4 or XAUI interface offers low-cost, low-power 10GbE chip-to-chip communication over the backplane. The four front I/O SFP+ ports support 10GBASE-SR, 10GBASE-LR, 10GBASE-T and 10GSFP+Cu connections. 

Software support is available for Linux and Windows systems.

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NanoCOM-TGU combines 11th Gen Intel Core processor with UHD Graphics

A COM Express Type 10 module, powered by the 11th Generation Intel Core processor (Tiger Lake UP3), has been released by Aaeon. The NanoCOM-TGU optimises embedded and mobile applications for today’s IoT requirements, says Aaeon.

The NanoCOM-TGU’s computing capability is combined with the graphical processing power enabled by Intel UHD Graphics in a compact COM Express Type 10 mini form factor, measuring 84 x 55mm.

Power by the 11th Generation Intel Core SoC, the module is designed for applications with intensive data and graphic processing needs. The SoC integrates both CPU and GPU, as well as AI and deep learning acceleration engines, to accelerate processing capability in embedded mobile applications, such as telematics, public sectors, and industrial automation.

According to Aaeon, the mini form factor of COM Express Type 10 of NanoCOM-TGU shortens the design and deployment processes for system designers or integrators in embedded mobile projects. In addition, by leveraging the Type 10 form factor, NanoCOM-TGU offers the high-speed I/O interfaces to shorten the system design, including one 2.5Gigabit Ethernet, two display outputs (eDP and DDI), one high-definition audio output, two SATA 3.0 interfaces, one onboard PCIe NVMe SSD (up to 256Gbyte), 10 USBs (allocated as eight USB 2.0 and two USB 3.2 Gen 2 ports), two UARTs and one PCI-Express 4. 

For memory bandwidth and storage, NanoCOM-TGU supports LPDDR4x memory with in-band ECC up to 16Gbyte for IoT and big data related applications. The onboard PCIe NVMe SSD interface supports up to 256Gbyte and accelerates read / write speeds multiple times than conventional storage interfaces. 

Aaeon adds that system designers or integrators can use the Intel UHD Graphics’ graphical processing power for enhanced visual performance. 

Established in 1992, Aaeon designs and manufactures professional intelligent IoT products. It provides reliable and high quality computing platforms, including industrial motherboards and systems, industrial displays, rugged tablets, embedded controllers, network appliances and related accessories and integrated solutions. The company also has the hardware and services for premier OEM/ODMs and system integrators worldwide. 

As an Associate Member of the Intel Internet of Things Solutions Alliance, Aaeon offers customised services from initial product conceptualisation and board product development to mass manufacturing and after-sales service programs.

 

https://www.aaeon.com

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Real time clock modules cut current consumption by 30 per cent

Compact real time clock (RTC) modules from Seiko Epson have current consumption that is reduced by 30 per cent compared to earlier modules from the company. They also have an increased number of events – 32 – that can be recorded by the time stamp function.

The RX8901CE and RX4901CE RTC modules for industrial applications feature a built-in digital temperature compensated crystal oscillator (DTCXO). Package dimensions are 3.2 x 2.5 x 1.0mm (max) which makes them the smallest RTC modules from the company.

The RX8901CE supports an I2C-bus interface and the RX4901CE supports an SPI-bus interface. They are designed for timekeeping in electronic systems which need a small form factor and low current consumption, for example, IoT devices, click-charge systems, security equipment, industrial systems.

Accurate tracking of time and date information is also needed in equipment that is installed in vehicles, outdoors, and other environments where systems are exposed to ambient temperature extremes. In addition, there is greater need for security to prevent information leaks caused by unauthorised product modification and tampering. Intrusions must be detected at all times despite the device’s low current consumption, advises Seiko Epson, which has increased demand for devices that consume less current and remain frequency-stable over a wider operating temperature range.

The RX8901CE and RX4901CE consume 0.24 microA (typical), which is 30 per cent less than the 0.35 microA (typical) consumed by the RX8804CE (an earlier equivalent Epson RTC module). 

The number of time stamp records that can be kept has expanded from one to a maximum of 32. Epson also added an SPI-Bus interface, offered alongside the original I2C-Bus interface.

Epson individually adjusts and guarantees the timekeeping accuracy of modules at the factory. This renders adjustment of timekeeping accuracy unnecessary and helps to increase design efficiency and quality.

The RX8901CE and RX4901CE RTC modules are sampling now and are intended for use in smart meters and security equipment, as well as in factory automation equipment and other small electronic products.

https://www5.epsondevice.com/en 

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Intel updates oneAPI tookits for cross-architecture capabilities

Enhanced oneAPI 2022 toolkits expand cross-architecture features to provide developers greater architectural choice to accelerate computing, says Intel.

New capabilities include what is claimed to be the world’s first unified compiler implementing C++, SYCL and Fortran, data parallel Python for CPUs and GPUs, advanced accelerator performance modelling and tuning, and performance acceleration for AI and ray tracing visualisation workloads. 

The 2022 Intel oneAPI toolkits benefit from over 900 new and enhanced features, added over the course of this year. Included in the foundational and domain-specific toolkits are compilers, libraries, pre-optimised frameworks, analysers and debuggers. 

One highlight is cross-architecture programming. Intel’s unified compiler implements C++, SYCL and Fortran for CPUs and GPUs utilising a common LLVM back end. 

Another new feature is accelerated compute on CPUs and GPUs for the most popular programming language today, Python.

The Intel DPC++ compatibility tool has been improved to automatically migrate 90 to 95 per cent of CUDA code to SYCL/DPC++.

Intel oneAPI Toolkits are optimised to enable advanced features of the latest and upcoming new hardware, including 12th Gen Intel Core processors with AVX-VNNI, Next Gen Intel Xeon Scalable processors, codenamed Sapphire Rapids with Intel Advanced Matrix Extension (Intel AMX), and upcoming Xe client and data centre GPUs.

For AI, the deep learning framework performance has been accelerated up to 10 times over earlier versions with the latest Intel Optimization for TensorFlow and Intel Optimization for PyTorch.3

This edition also introduces the Intel Extension for Scikit-learn which speeds up machine learning algorithms more than 100 times on Intel CPUs over the stock open source version.

Another new feature is the Intel Neural Compressor which is designed to achieve increased inference performance through post-training optimisation techniques across multiple deep learning frameworks.

Advanced tools for development productivity include performance analysis for CPUs and accelerators. This includes Intel VTune Profiler’s flame graph display which helps improve the ability to visualise performance hot spots. Another tools is Intel Advisor’s accelerator performance modelling which allows developers to estimate performance benefits of offloading to a GPU before making code changes.

Advanced ray tracing has new features including cone telemetry, auxiliary feature denoising and FP16 support and there is also support future Intel Xe GPUs and real-time denoising to improve final frame, production-quality rendering.

Expanded development environment support includes deeper Microsoft Visual Studio Code integration, support for Microsoft Visual Studio 2022, and Microsoft WSL2 for Linux development on Windows.

Foundational and domain-specific toolkits are now available to download or use in the Intel DevCloud, free of charge.

The oneAPI cross-architecture programming model provides developers with tools to improve the productivity and velocity of code development when building cross-architecture applications.

An Evans Data survey reported that 40 per cent of developers target heterogeneous systems that use more than one type of processor, processor core or coprocessor.  Developers can use oneAPI to choose the best hardware for a given solution without having to implement proprietary programming models, says Intel.

http://www.intel.com

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