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Ryzen Embedded R2000 has 2x cores for IoT, says AMD

Mon, Jul 04, 2022

Equipped with up to two times as many cores as the previous generation of Ryzen Embedded SoC processors, the Ryzen Embedded R2000 series targets industrial and robotics systems, machine vision, the IoT and thin client equipment, said AMD.

The R2514, for example has up to 81 per cent higher CPU and graphics performance than the comparable R1000 series processor, confirmed AMD. Performance-per-watt efficiency is also optimised using Zen+ core architecture with AMD Radeon graphics for multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in 4K resolution.

Embedded R2000 Series processors are scalable up to four Zen+ CPU cores with eight threads, 2Mbyte of L2 cache and 4Mbyte of shared L3 cache, allowing embedded system designers can scale performance and power efficiencies with a single processing platform, said the company. The Ryzen Embedded R2000 also supports up to 3200Mtransfer per second DDR4 dual channel memory and expanded I/O connectivity, to deliver 33 per cent higher memory bandwidth and up to two times greater I/O connectivity compared to R1000 series processors.

The series is suitable for industrial applications like robotics and machine vision as well as thin clients and mini-PCs, which require performance, optimised power and graphics, commented the company.

They can power up to four independent displays in 4K resolution leveraging DisplayPort 1.4, HDMI 2.0b or eDP 1.3 interfaces. They also feature peripherals and interfaces with up to 16 lanes of PCIe Gen3, two SATA 3.0 and six USB ports (USB 3.2 Gen2 and 2.0).

OS support includes Microsoft Windows 11/10, and Linux Ubuntu LTS.

The series consists of the R2324 and R2312 SoC processors which are in production now and the R2544 andR2541 which are expected to be available in October 2022. Planned product availability extends up to 10 years, providing customers with a long-lifecycle support roadmap

http://www.amd.com

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3D magnetic resolver IC is smallest available, claims Melexis

Mon, Jul 04, 2022

For industrial and automotive applications, the MLX90381 AEC-Q100 / ISO 26262 -compliant pico-resolver is supplied in a DFN-6 package, measuring just 2.0 x 2.5mm. Only three external capacitors are required to complete the circuit.

The ASIL-ready IC is programmable at module level and enables sensored mechatronic miniaturisation, particularly in rotor position detection, said the company. Being AEC-Q100 and ISO 26262 compliant (ASIL B SEooC), also makes it suitable for automotive safety related systems.

The 3D magnetic pico-resolver has a small outline and analogue outputs providing sine and cosine signals. It uses Melexis’ Triaxis Hall technology and can be used for absolute rotary position sensing where its low latency and fast response characteristics are able to measure rotational speeds of more than 50,000 rpm.

The MLX90381 pico-resolver can be used with DC, brushless DC (BLDC) and permanent magnet synchronous motors (PMSM) in applications such as e-valves and e-bike motors.

The MLX90381 can be combined with Melexis’ family of smart embedded LIN drivers. These include the MLX81330 and MLX81332 (up to 10W) for directly driving flaps, valves and single-coil fans and pumps. It also works with the MLX81340, MLX81344 and MLX81346 pre-drivers (up to 2000W) which are incorporated into power blowers, engine cooling fans, pumps, window lifters, seat adjusters and sunroofs.

The selectable magnetic field axes (X/Y, X/Z and Z/Y) enable the MLX90381 to handle on-axis position sensing as well as off-axis through-shaft sensing. The sensitivity and filter bandwidth of each axis can be programmed directly through the device’s I2C interface. A dedicated high sensitivity version of the pico-resolver allows additional robustness against external magnetic stray fields.

The MLX90381 is available for order now.

Melexis designs, develops and delivers mixed-signal semiconductor sensor and actuator components addressing the integration of sensing, driving and communication into products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

Melexis specialises in automotive semiconductor sensors. Today, on average, every new car produced worldwide contains 13 Melexis chips, according to the company. The portfolio includes magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and time of flight (ToF). The company’s driver IC portfolio incorporates advanced DC and BLDC motor controllers, LED drivers and FET pre-driver ICs.

Melexis is headquartered in Belgium.

http://www.melexis.com

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Tensilica DSP IP cores target radar and lidar

Mon, Jul 04, 2022

Two IP cores have been added to the Tensilica ConnX family of DSPs by Cadence. Intended for embedded processing in automotive, consumer and industrial markets, the ConnX 110 and ConnX 120 DSPs’ architecture is optimised for small memory footprint and low-power signal processing. The ConnX 110 and ConnX 120 DSPs share a common instruction set architecture (ISA) with the ConnX B10 and B20 DSPs preserving software compatibility for easy migration.

The 128-bit ConnX 110 DSP and 256-bit ConnX 120 DSP feature an N-way programming model an, like the rest of the Tensilica DSP portfolio, support the Tensilica Instruction Extension (TIE) language, which allows customers to tailor the instruction set, add specialised data types, and implement tightly integrated interfaces between the DSP and external logic.

The new DSPs are supported by a comprehensive set of complex math library functions in the NatureDSP, Eigen and Radar libraries. As with all existing ConnX DSPs, they are automotive-ready with full ISO 26262 compliance to ASIL-D with FlexLock or to ASIL-B.

The Tensilica ConnX 110 and 120 DSPs have an optimised instruction set for radar, lidar and communications applications. They also feature optional acceleration operations for linear-feedback shift, convolutional encoding, single peak search and dual peak search. The 128-bit (ConnX 110) and 256-bit (ConnX 120) SIMD are suitable for complex math operations based on eight-, 16- and 32-bit fixed-point and half-, standard- and double-precision floating-point.

The ConnX 120 additionally offers Viterbi and Turbo decoders.
NXP uses Cadence Tensilica DSP cores for its ADAS (advanced driver assistance system) product offerings, said Robert Dunnigan, director program management ADAS at NXP Semiconductors.

Another customer, indie Semiconductor develops multiple sensor modalities “in the pursuit of the uncrashable car”. Lionel Federspiel, executive vice president of engineering for indie Semiconductor, commented: “Cadence’s Tensilica ConnX processor family in conjunction with indie’s architecture is ideally suited to implement unique design solutions with high performance, low power, and gate count optimisation. As a pure-play automotive solutions innovator, quality and reliability are essential to the success of our products.”

“Radar and communications processing trends require solutions that perform more processing in less time,” explained David Glasco, vice president of research and development for Tensilica IP at Cadence. “Automotive radar demands multi-antenna, high-resolution systems with rapid response. Similarly, 5G wireless communications requires much higher data rates and lower latencies than previous generations. The Tensilica ConnX 110 and ConnX 120 DSPs meet these demands by extending the already-efficient processing capability of the ConnX DSPs and enhancing them with even more fixed- and floating-point complex data processing capacity at low power and area.”

http://www.cadence.com

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ToF module perceives 3D space in high resolution

Thu, Jun 30, 2022

Believed to be the industry’s first high resolution, industrial quality, indirect time-of-flight (iToF) module for 3D depth sensing and vision systems, the ADTF3175 has been announced by Analog Devices.

It enables cameras and sensors to perceive 3D space in 1Mpixel resolution for accurate (+/-3mm) iToF technology. It is suitable for use in a range of machine vision applications ranging from industrial automation to logistics, healthcare and augmented reality.

The ADTF3175 offers designers a scalable, fully engineered and calibrated depth system that can be integrated into 3D sensing and vision systems, eliminating the need to design specialised optics or address electromechanical integration challenges. It accelerates time to market by simplifying the complex sensor design process, said Analog Devices. The robust, high resolution module is specifically designed to perform in a range of environmental settings. It uses triple junction vertical cavity surface emitting laser (VCSEL) technology from Lumentum Operations to enable sensing in a wide range of lighting conditions.

“We are thrilled to work with ADI on solutions for the industry’s most demanding and highest resolution 3D sensing applications, ranging from extended reality to industrial applications like robotics, intelligent buildings, and logistics systems,” said Téa Williams, senior vice president and general manager of 3D sensing at Lumentum. The company provides VCSEL arrays for light detection and ranging (lidar) and 3D sensing applications, to enable sensing in a range of lighting conditions. “Our 10W VCSEL arrays allow ADI to enable more capable sensing and vision systems that can operate under a wide range of lighting conditions and thereby removing environmental obstacles to broader and more rapid machine vision deployment,” Williams added.

The ADTF3175 features an infra red illumination source with optics, laser diode and driver, and a receiver path with a lens and an optical band-pass filter. The module also includes flash memory for calibration and firmware storage with power regulators to generate local supply voltages. It is supplied pre-programmed and offers operating modes optimised for long and short range, said Analog Devices.

“Machine vision needs to make the leap to perceiving smaller, more subtle objects faster in industrial environments that often include harsh conditions and multiple stimuli,” explained Tony Zarola, senior director for ToF at Analog Devices. “The ADTF3175’s . . . . resolution and accuracy allows vision and sensing systems – including industrial robots – to take on more precision-oriented tasks by enabling them to better understand the space they’re operating in and ultimately improve productivity“. The module is expected to accelerate the deployment of next generation automation and critical logistics systems, he added.

Analog Devices also offers an accompanying open source design for the ADTF3175 module. It includes all of the required drivers and access to ADI’s depth processing capabilities. ADI also offers guidance on how to achieve Class One eye safety certification for the end product.

The module measures 42 x 31 x 15.1mm.

http://www.analog.com

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Ryzen Embedded R2000 has 2x cores for IoT, says AMD

3D magnetic resolver IC is smallest available, claims Melexis

Tensilica DSP IP cores target radar and lidar

ToF module perceives 3D space in high resolution

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