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Adlink launches Intel Core Ultra COM-HPC Mini with powerful computing performance

Tue, Apr 08, 2025

Adlink has announced the launch of its COM-HPC-mMTL — an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities. This makes it the perfect fit for edge applications that demand both superior processing power and versatile connectivity.

Powered by the Intel Core Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. It is for high-performance battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.

The COM-HPC-mMTL is designed with up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467MT/s, supporting maximum performance and efficiency. Its 95mm x70mm size allows it to fit into even the most constrained spaces, with a rugged operating temperature range from -40°C to 85°C (for selected SKUs).

In spite of its compact form factor, the COM-HPC-mMTL integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.

The COM-HPC-mMTL ensures that high-performance embedded solutions are now possible even in tight spaces, offering the right balance of power, size, scalability, and a stackable design that maximises space efficiency without compromising functionality for next-generation edge applications. Adlink offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, available in the 2nd half of 2025.

https://www.adlinktech.com

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ST releases microprocessors featured for performance and economy

Mon, Apr 07, 2025

STMicroelectronics has announced mass-market availability of new STM32MP23 general-purpose microprocessors (MPUs), combining high-temperature operation up to 125°C with the speed and efficiency of dual Arm Cortex-A35 cores, for performance and ruggedness in industrial and Internet-of-Things (IoT) edge compute, advanced HMI, and machine-learning applications.

Joining the STM32MP25 series launched in 2024, the new MPUs contain dual 1.5GHz Arm Cortex-A35 cores, a 400MHz Cortex-M33 for real-time applications, and a neural network accelerator with 0.6 TOPS performance. There is also a 3D graphics processor, H.264 decoder, MIPI CSI-2 camera interface with raw data support, dual Gigabit Ethernet ports with time-sensitive networking (TSN), and two CAN-FD interfaces.

Combining diverse processing resources and optimised on-chip features, the STM32MP23 series fulfils numerous sensing, processing, and data-handling roles throughout smart factories, smart cities, and smart homes. With the neural engine, bringing AI and machine-learning capabilities, these MPUs handle intuitive and adaptive HMIs, vision-based interaction, and predictive maintenance. The H.264 decoder supports up to 1080p60 video resolution and the 3D GPU handles high-performance, real-time graphics with support for open-source frameworks including OpenGL, OpenCL, and Vulkan.

The STM32MP23 series targets SESIP3 (already achieved for STM32MP25 MPUs) and PSA Level 1 certifications. Protection features include secure boot, Arm TrustZone architecture, secure key storage, and tamper detection, with hardware cryptographic accelerators.

Coinciding with the STM32MP23 release, ST is also extending support for each release of the OpenSTLinux distribution from two years to five years. The enhanced support ensures stability for customers throughout development and extends access to the latest security patches easing compliance with the EU Cyber Resilience Act (CRA). ST’s commitment to mainlining OpenSTLinux lets developers work comfortably with popular frameworks including Yocto, Buildroot, OpenWRT, and OpenSTDroid, and helps accelerate time to market.

Additional benefits for developers include three BGA package options that offer the choice of high-density 0.5mm interconnect pitch or 0.8mm pitch that allows simplified 4-layer PCBs with plated-through holes. The three packages are all pin-to-pin compatible with STM32MP25 MPUs. The devices operate over the industrial temperature range, from -40°C to 125°C maximum junction temperature.

https://www.st.com

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The smart evolution of Bluetooth module from Panasonic

Tue, Apr 01, 2025

Panasonic has announced the release of PAN1783, a Bluetooth 5.4 Low Energy (LE) module that follows the PAN1780. Building upon the success of its predecessor, the PAN1780, the PAN1783 sets new standards in performance, versatility, and efficiency.

According to Tomislav Tipura, Product Manager at Panasonic Industry Europe’s IoT Department, “the PAN1783 represents a significant leap forward in Bluetooth technology, offering unparalleled features and capabilities to meet the evolving needs of our customers.”

Being as compact as 15.6 x 8.7 mm, the PAN1783 is one of the smallest nRF5340 module currently available in the market. It is powered by the Nordic nRF5340 single-chip controller, boasting isochronous channels for LE audio support. This module is available with both an on-board chip antenna and an RF-bottom pad, providing flexibility to suit various design requirements – CE RED, FCC, UKCA und ISED certificates included!

Featuring Bluetooth 5.4 enhancements, including isochronous channels, LE audio, and support for high-throughput of 2 Mbps, advertising extensions, and long range, the PAN1783 delivers exceptional performance, according to Panasonic. Its all-in-one System-on-Chip (SoC) design combines the best features of the nRF52 Series with increased performance and memory, all while minimising power consumption. The improved sensitivity of the nRF5340, coupled with the LE coded PHY, makes the PAN1783 an attractive choice for a wide range of applications, including advanced computer peripherals, I/O devices, wearables, and wireless audio devices. Moreover, its ultra-low current consumption makes it ideal for battery-powered devices, extending operational lifespans.

Equipped with two Cortex-M33 processors – one as an application processor and the other as a network processor – the PAN1783 offers seamless integration and standalone operation. This eliminates the need for an external processor, simplifying design, reducing space requirements, and ultimately helps lowering costs for manufacturers.

In addition to its Bluetooth capabilities, the PAN1783 supports angle of arrival (AoA) and angle of departure (AoD) direction finding, enhancing location-based services and applications. Furthermore, it also supports Type 2 Near Field Communication (NFC-A), facilitating simplified pairing and payment solutions when used with an external antenna.

https://industry.panasonic.eu

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TI introduces new line of functionally isolated modulators

Thu, Mar 27, 2025

Texas Instruments (TI) has introduced the industry’s first functionally isolated modulators, helping designers achieve more precise motor control in compact robot designs. The new AMC0106M05, AMC0136 and AMC0106M25 isolated modulators enable increased precision and higher resolution of 12 to 14 effective number of bits (ENOB) for accurate and reliable phase current sensing and DC voltage sensing measurements. Offered in a small lead-less package, the new products in TI’s isolated analog-to-digital converter (ADC) portfolio help designers achieve smooth torque operation and fine motor control, while decreasing size and cost in low-voltage (<60V) robotics designs.

Engineers today are challenged to design smarter robots to perform more detailed tasks. The galvanically isolated modulators enable robotics engineers to achieve precise motor control and system protection in smaller, more sophisticated designs. This precision makes it possible for robots to complete a variety of complex tasks, such as threading a needle or handling small nuts and bolts. In addition, the small size of the new modulators—measuring just 3.5mm x 2.7mm—requires 50% less board space than competing reinforced isolation solutions. With this decrease in size, designers have more space to incorporate additional features that support precise control and reliable operation in compact robot applications.

“These modulators from TI enable designers to increase robotics accuracy and productivity in new use cases and smaller form factors, from the factory floor to the operating room,” said Karthik Vasanth, vice president and general manager of Data Converters and Clocks at TI. “For example, where humanoid robots could previously only complete simple tasks, our new functionally isolated modulators now allow them to carry out more dexterous and precise jobs.”

Production quantities of the new functionally isolated modulators are available now on TI.com in an 8-pin very thin small-outline (VSON) package. To support designers, evaluation modules for all three modulators are available, as well as reference designs and simulation models.

https://www.TI.com

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Adlink launches Intel Core Ultra COM-HPC Mini with powerful computing performance

ST releases microprocessors featured for performance and economy

The smart evolution of Bluetooth module from Panasonic

TI introduces new line of functionally isolated modulators

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