Wireless modules for embedded systems now available from Tria Technologies

Tria Technologies, an Avnet company has announced the availability of two new wireless modules, the SPB611 and SPB209. These modules support multiple short-range protocols and help speed the development of wireless-enabled embedded systems.

The SPB611 supports Wi-Fi 6 (802.11ax 80 MHz) dual-band and Bluetooth 5.2, while the SPB209 offers Wi-Fi 5 (802.11ac) and Bluetooth 4.2. The SPB611 (Wi-Fi 6) module also offers a tri-radio option to add 802.15.4-2020 (Thread and ZigBee) mesh networking capabilities. Both modules can be supplied with an LTE filter and PCB antenna to reduce system size.

These 3.3V modules are supplied in a compact 14 x 14 mm (196 mm2) 41-pin form factor. A 4-bit SDIO 3.0 and HS-UART provide the external interface for WLAN and Bluetooth data respectively, supported by extensive DMA hardware to minimise the processing load on the host CPU. Sleep and standby modes enhance the low power design, and the broad temperature operating range of -40 to +85°C makes the modules ideal for a wide range of industrial applications.

Both modules were previously available in custom Tria System Solutions and pre-integrated on Tria SMARC compute modules. Now they are also offered as stand-alone products under the Tria brand, providing engineers complete flexibility to meet wireless connectivity needs using SMARC compute modules, custom Tria system or by deploying the modules as stand-alone devices on their own hardware or custom carrier board.

“As the only leading embedded compute board manufacturer that also designs and manufactures wireless modules, we are uniquely positioned to provide unified software and support for both compute and RF components,” said Thomas Staudinger, President of Tria. “The benefits to customers of buying from a single supplier include simplified software upgrades, ensured software compatibility and direct support to help engineers comply with security requirements such as the RED DA and the Cyber Resilience Act (CRA). Working with Tria also ensures that the wireless module lifecycle will match the compute module, eliminating the expense of wireless modules reaching end of life before the compute board.”

The modules also benefit from Tria bringing over 10 years of experience in integrating RF connectivity for embedded compute. They are pre-certified, fast-tracking time to market and reducing certification costs. A BlueZ software stack qualification avoids test effort and ensures full compliance, facilitating a much faster and cost-effective listing and logo license.

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Digi connect sensor XRT-M for IoT, industrial, sensor, and gateway applications

Mouser is now shipping the new Digi Connect Sensor XRT-M from Digi International. The Digi Connect Sensor XRT-M is a rugged, battery-powered LTE-M-enabled cellular gateway designed for zero-infrastructure remote monitoring in the toughest IoT environments in utilities, agriculture, environmental compliance, mining, and industrial applications.

The Digi Connect Sensor XRT-M, offers users both edge and cloud-based control options, together with a management platform equipped with an intuitive interface, for streamlining data management and enhancing operational efficiency. With intelligent edge processing powered by battery or solar, it gives reliable insights utilising Digi Axess to deliver the flexibility of the cloud, while seamlessly adjusting to supply consistent and reliable readings to enrich operational efficiency for field sensors in water and wastewater management, oil and gas operations, industrial automation, and environmental monitoring. The Digi Connect Sensor XRT-M is created for telemetry monitoring, while Digi Axess reveals actionable insights from remote assets.

Featuring support for the industry-standard MQTT protocol, setup is quick and intuitive, with deployment and data reception taking under 10 minutes. The web-based system ensures a fast and efficient setup process with streamlined configuration, extensive data analytics, and the ability to customise reports and alerts for specific conditions. The Digi Connect Sensor XRT-M is Digi’s most powerful remote telemetry device yet — offering flexibility in sensor integration, reliable cloud-connected data delivery via Digi Axess, and robust, IP68-rated protection.

mouser.com

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Renesas’s new GaN charging solution delivers 500W of power

Renesas has expanded its suite of AC/DC and power adapter solutions with a new GaN-based Half-Wave LLC (HWLLC) platform that supports 500W or higher operation across IoT, industrial and infrastructure systems. The new HWLLC converter topology scales an ultra-efficient, compact power architecture from 100W-class designs to 500W, enabling the next wave of high-speed chargers for power tools, e-bikes and other appliances without the size, heat and efficiency penalties of legacy topologies.

The portfolio expansion adds four controller ICs that build on Renesas’ proprietary zero-standby power (ZSP) technology. At the heart is the RRW11011, an interleaved power factor correction (PFC) and HWLLC combo controller engineered for high power density and high efficiency. The PFC with phase-shift control cancels ripple, reduces component size and cost, balances current and ensures robustness. The combo controller allows designers to lower operating temperature while delivering the wide output range (5V to 48V) required by USB Extended Power Range (EPR) and other variable-load charging systems. The new solution also features the RRW30120 USB Power Delivery (USB PD) protocol and closed-loop controller, which achieves maximum USB power delivery of 240W, and the RRW40120 half-bridge GaN gate driver and RRW43110 intelligent synchronous rectifier controller.

The HWLLC’s wide 500W power envelope broadens the addressable charging market to encompass large TVs and monitors, as well as higher-power appliances like vacuums, power tools, outdoor and industrial lighting and some medical devices. The new HWLLC-based AC/DC topology also helps designers move beyond 100W USB-C charging devices and adopt 240W USB EPR charging to shrink proprietary brick chargers in smartphones, laptops and many gaming systems. Renesas’ compact, high-power fast charging technology was recently incorporated into a GaN-based charger from Belkin. The Belkin Z-Charger features an innovative ZSP chip with Renesas’ advanced SuperGaN depletion mode (d-mode) GaN technology.

GaN technology drives the efficiency and power density behind Renesas’ next-generation AC/DC designs, enabling higher switching performance that helps shrink magnetics, reduce losses and keep thermals in check. Renesas’ SuperGaN d-mode technology employs a cascode configuration that is more robust and easier to drive than other GaN implementations, with a higher threshold voltage and drop-in compatibility with standard silicon gate drivers. The result is a faster path for customers to achieve compact, high-efficiency power supplies they can scale, validate and manufacture with greater confidence.

By eliminating transformer winding and reducing component count versus traditional LLC implementations, Renesas reduces design complexity and enables more compact magnetics. The enhancement accelerates design re-use across product families that support different wattages, voltages and form-factors while improving reliability and easing BOM management. The highly integrated, wide Vin/Vout offline solution helps customers build smaller, cooler and readily compliant products while achieving standout no-load/standby performance that supports higher energy-efficiency ratings.

renesas.com

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u-blox brings secure tri-band Wi-Fi 6E for industrial IoT

u-blox has announced the launch of the JODY-W6, the latest addition to its JODY family of modules. Based on the NXP Semiconductors IW623 chipset, the JODY-W6 combines tri-band Wi-Fi 6E (2.4 / 5 / 6 GHz) with 2×2 MIMO and Bluetooth Dual-Mode including LE Audio and qualified against Bluetooth Core 5.4. This powerful integration delivers higher throughput, better network availability, and an improved audio experience while addressing the industry’s growing need for secure, professional-grade wireless connectivity in industrial and IoT applications. The introduction of Wi-Fi 6E and Bluetooth LE Audio comes at a critical time, as industries face increasing spectrum congestion, demand for richer user experiences, and the need to comply with emerging cybersecurity regulations.

JODY-W6 is built on the NXP IW623 chipset and supports tri-band Wi-Fi 6E with 2×2 MIMO: Featuring Bluetooth Dual-Mode including LE Audio, JODY-W6 is qualified against Bluetooth Core 5.4. With a compact footprint and pin compatibility with the JODY module family, the new host-based multiradio module facilitates seamless migration across technology generations, offering simplicity, flexibility and cost savings in design. JODY-W6 provides a professional-grade solution designed to withstand harsh operating environments (-40 °C to +85 °C) while bringing enhanced security features, including NXP EdgeLock and secure boot on chip, to address growing cybersecurity requirements across industrial IoT deployments.

The JODY-W6 is well suited for industrial automation, healthcare, network infrastructure, and smart building applications, as well as security and surveillance systems that demand secure, high-throughput, and low-latency wireless performance.

Supporting SDIO or PCIe interfaces, the JODY-W6 offers flexibility for a wide range of host-based designs. The module is available in variants with two or three antenna pins, making it adaptable to diverse product requirements. Evaluation kits, including EVK-JODY-W683 and an M.2 form factor option, simplify design, testing, and integration.

By integrating the latest NXP IW623 chipset and supporting Wi-Fi 6E and Bluetooth LE Audio, the JODY-W6 addresses critical industry challenges such as spectrum congestion, cybersecurity compliance, and demand for high-performance wireless solutions.

u-blox.com

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