Mouser explores smart tech in farming with agriculture resource hub

Mouser offers insights into the latest innovations in farming through its agriculture resource centre. Through the integration of sensors, drones, and AI, farmers have the capability to collect and analyse vast amounts of data. Technological advancements, like satellites, have enabled farmers to track changes in land use, such as crop growth and vegetation health, which helps feed the growing global population while maintaining sustainable practices. By gaining insights into the field, like pH and CO2 levels in the moisture content, they can better understand their soil quality, leading to enhanced crop yields.

IoT devices are added to optimise agricultural practices like RFID tagging livestock to track their movements and analyse the herd’s feeding behaviours, stress levels, and potential health issues. This new level of data analytics ensures that livestock and plants are receiving proper nourishment in various climates, as well as in greenhouse and indoor agriculture. Connected devices allow engineers to take environmental control and adjust growing conditions through sensors, microcontrollers, and LEDs. Through a range of innovations, traditional farming is evolving into a data-driven and sustainable industry.

The library of resources offers engineers the tools to make informed decisions from irrigation to fertilisation. With eBooks, articles, blogs, and products from Mouser’s technical team and manufacturing partners, readers will gain valuable knowledge on the cutting-edge technology that is transforming agriculture.

https://resources.mouser.com/agriculture/

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Renesas introduces new RA0 series based on the Arm Cortex-M23 processor

The new devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.

RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.

Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.

The RA0E2 devices have a feature set optimised for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.

In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.

Key Features of the RA0E2 Group MCUs
Core: 32MHz Arm Cortex-M23
Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM
Extended Temperature Range: Ta -40°C to 125°C
Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC
Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs
Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection
Security: Unique ID, TRNG, AES libraries, Flash read protection
Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP

The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices if customers wish to do so.

https://www.renesas.com/RA0E2

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Infineon introduces new generation of IGBT and RC-IGBT devices

The market for electric vehicles continues to gather pace with a strong volume growth of both battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The share of electric vehicles produced is expected to see double-digit growth by 2030 with a share of around 45 percent compared to 20 percent in 2024. Infineon is responding to the growing demand for high-voltage automotive IGBT chips by launching a new generation of products. Among these offerings are the EDT3 (Electric Drive Train, 3 rd generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. These devices enhance the performance of electric drivetrain systems, making them particularly suitable for automotive applications.

The EDT3 and RC-IGBT bare dies have been engineered to deliver high-quality and reliable performance, empowering customers to create custom power modules. The new generation EDT3 represents a significant advancement over the EDT2, achieving up to 20 percent lower total losses at high loads while maintaining efficiency at low loads. This achievement is due to optimisations that minimise chip losses and increase the maximum junction temperature, balancing high-load performance and low-load efficiency. As a result, electric vehicles using EDT3 chips achieve an extended range and reduce energy consumption, providing a more sustainable and cost-effective driving experience.

The EDT3 chipsets, which are available in 750 V and 1200 V classes, deliver high output current, making them well-suited for main inverter applications in a diverse range of electric vehicles, including battery electric vehicles, plug-in hybrid electric vehicles, and range-extended electric vehicles (REEVs). There reduced chip size and optimised design facilitate the creation of smaller modules, consequently leading to lower overall system costs. Moreover, with a maximum virtual junction temperature of 185°C and a maximum collector-emitter voltage rating of up to 750 V and 1200 V, these devices are well-suited for high-performance applications, enabling automakers to design more efficient and reliable powertrains that can help extend driving range and reduce emissions.

The 1200 V RC-IGBT elevates performance by integrating IGBT and diode functions on a single die, delivering an even higher current density compared to separate IGBT and diode chipset solutions. This advancement translates into a system cost benefit, attributed to the increased current density, scalable chip size, and reduced assembly effort.

Infineon’s latest EDT3 IGBT chip technology is now integrated into the HybridPACK Drive G2 automotive power module, delivering enhanced performance and capabilities across the module portfolio. This module offers a power range of up to 250 kW within the 750 V and 1200 V classes, enhanced ease of use, and new features such as an integration option for next-generation phase current sensors and on-chip temperature sensing, contributing to system cost improvements.

All chip devices are offered with customised chip layouts, including on-chip temperature and current sensors. Additionally, metallisation options for sintering, soldering and bonding are available on request.

https://www.infineon.com

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Mikroe’s Stephano-I Click delivers WiFi and Bluetooth LE connectivity for reliable IoT

Stephano-I Click from MIKROE, is a compact add-on board designed to add WiFi and Bluetooth LE connectivity to any embedded application. A new member of Mikroe’s mikroBUS enabled Click board family, this board features the Stephano-I (2617011025000) radio module from Würth Elektronik.

Comments Nebojsa Matic, CEO of Mikroe: “Stephano-I Click is ideal for IoT, smart home, and industrial applications, enabling low power wireless communication with smart devices and cloud services.”

The Stephano-I module supports IEEE 802.11 b/g/n WiFi in the 2.4GHz band and Bluetooth LE 5 in both peripheral and central roles, offering dual radio support with a simple AT command interface over UART. It features a 1Mbps data rate, WiFi output power up to 13.4dBm, and Bluetooth LE output power up to 4.5dBm. The Click board includes standard UART communication pins, hardware flow control, reset and wake-up options, and additional unpopulated debug and boot control pins for advanced functionality.

Stephano-I Click is fully compatible with the mikroBUS socket and can be used on any host system supporting the mikroBUS standard. It comes with the mikroSDK open-source libraries, offering unparalleled flexibility for evaluation and customisation.

Stephano-I Click also features the ClickID function which simplifies use by enabling the host system to seamlessly and automatically detect and identify this add-on board.

https://www.mikroe.com

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