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Supermicro revises server architecture to lower cloud operating costs

Wed, Jan 04, 2023

Servers in the Supermicro MegaDC family, paired with Ampere Altra and Altra Max CPUs can contribute to lower operational costs, said Super Micro Computer (Supermicro).

The Arm-based servers use Ampere Altra and Ampere Altra Max processors and the Mt. Hamilton platform uses a single unified motherboard design, explained Supermicro, to target cloud-native applications, such as cloud gaming, video on demand, CDN (content delivery network), infrastructure as a service (IaaS), database, object-storage, dense VDI (virtual desktop infrastructure), and telco edge (distributed unit and centralised unit) operations. In addition, they address objectives for cloud-native workloads, specifically delivering high performance per watt while executing scalable workloads and those that require very low latency responses.

Ivan Tay, senior vice president of product management, Supermicro, added that the company can “quickly offer optimised application servers for customers worldwide using our Building Block Solutions approach”.

The MegaDC Arm-based product lines use a Building Block design which features a single socket motherboard paired with an Ampere Altra or Altra Max CPU with up to 128 cores per server. This is currently the highest core count in the server industry, said Supermicro. There is also up to 4Tbyte of DDR4 memory. The modular design supports options for maximising I/O, PCIe and storage.

The MegaDC product line includes a range of servers with a single Ampere Altra or Altra Max CPU, in a 1U or 2U form factor, with up to four double-width GPUs or up to 24 x 2.5 inch U.2 NVMe hot-swappable drives. The systems include an onboard redundant 25GbE SFP28 Ethernet networking using Nvidia Mellanox CX4.

Air cooling ensures the servers are certified up to 35 degrees C ambient temperature for enterprise and 55 degrees C for edge applications.

Supermicro is based in San Jose, California, USA and specialises in products for the enterprise, cloud, AI and 5G telco / edge IT Infrastructure, with server, AI, storage, IoT, and switch systems, software, and services while delivering motherboard, power, and chassis products.

The products are designed and manufactured in house (in the US, Taiwan and the Netherlands), and optimised to improve TCO (total cost of ownership) and reduce environmental impact (Green Computing).

The Server Building Block Solutions allows customers to optimise for the exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power and cooling solutions (air-conditioned, free air cooling or liquid cooling).

http://www.supermicro.com

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Axiomtek bases fanless edge AI computer vision on Xilinx AI accelerator

Fri, Dec 23, 2022

The latest fanless, edge AI computer vision system from Axiomtek is based on the Xilinx AI accelerator. The RSC201 uses the Xilinx Kria K26 SoM AI accelerator to support the simultaneous execution of multiple algorithms through the built-in multi-node function. According to Axiomtek, it delivers superior AI computing performance with low latency over other mainstream models in the market.

The RSC201 is compact with a wide operating temperature range. The 5G wireless connection empowers rapid data transmission between edge devices and data centres that improve the decision-making process in machine learning. Typical use cases for the RSC201 are traffic management, automated warehouse logistics, smart fence and autonomous guided vehicles / autonomous mobile robots (AGV / AMR).

The Xilinx Kria K26 SoM provides fast vision AI computing with native ROS 2 support for higher productivity in robotics and industrial automation. It also has 4Gbyte DDR4 system on-board memory and 16Gbyte eMMC.

For expansion interfaces, the RSC201 supports one M.2 Key B 3052 slot and one SIM socket for seamless 5G communication. It also has an M.2 Key B 2242 slot for SSD storage.

It also has extensive system I/O, with one 10 / 100 / 1000Mbits per second Ethernet LAN port, one DisplayPort 1.4, two USB 3.0 ports, one COM port, one CANbus for real-time communication among microcontrollers, one PMOD for peripheral modules connecting and 12 to 24V DC wide power input.

The rugged, fanless RSC201 can withstand a wide operating temperature range of -30 to +75 degrees C and has an IP40-rated extruded aluminium and heavy-duty steel housing to protect against dust and dirt.

The RSC201 is compact and lightweight at only 1.5kg.

It supports the Linux operating system.

The RSC201 is available for ordering now.

http://www.axiomtek.com

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Mouser ships Qorvo DWM3001C module to accelerate IIoT design

Thu, Dec 22, 2022

The DWM3001C is Qorvo’s 6.5 and 8.0GHz ultra-wideband (UWB) module which is now available from Mouser. The DWM3001C UWB module is designed to accelerate industrial IoT (IIoT) applications such as tags, access control, asset tracking and secure bubble environments. The integrated module streamlines UWB implementation in factory and warehouse automation and security systems. It also provides real time location for healthcare staff and patient applications, retail security, connected home and navigation applications, said Mouser.

The Qorvo DWM3001C module integrates the DW3110 transceiver IC, Nordic Semiconductor nRF52833 Bluetooth Low Energy SoC, a planar UWB antenna, accelerometer, power management and crystal.

It is certified to FCC, ETSI and IC and designed to simplify UWB implementation in systems using a standard low power microcontroller. It has adjustable data rates from 850kbits per second to 6.8Mbits per second, with maximum packet lengths of 1023bytes for high data throughput applications.

The module’s RF design is fully tested and calibrated to offer low power consumption for battery-powered applications. The DWM3001C UWB is compliant with the IEEE 802.15.4z standard and developed in accordance with the FiRa Consortium PHY and MAC specifications and Car Connectivity Consortium (CCC) specifications.

The DWM3001C module can be used in two-way ranging (TWR) or time difference of arrival (TDoA) applications and is also interoperable with the Apple U1 chip (beta evaluation).

Mouser also offers the DWM3001CDK development kit, which enables designers to evaluate hardware performance as a TWR or TDoA tag and to build an evaluation real-time location system (RTLS). An on-board J-Link debugger provides SWD and UART interfaces to the DWM3001C.

Mouser Electronics, a Berkshire Hathaway company, is an authorised semiconductor and electronic component distributor serving the global electronic design engineer and buyer community. Its website is available in multiple languages and currencies and features more than 6.8 million products from over 1,200 manufacturer brands. Mouser offers 27 support locations worldwide and provides customer service in local languages, currencie and time zones.

The distributor ships to over 650,000 customers in 223 countries / territories from its distribution facilities in Texas USA.

https://www.mouser.com

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Qualcomm introduces Wi-Fi 7 immersive home platforms

Wed, Dec 21, 2022

For connected homes, Qualcomm Technologies, has unveiled its Wi-Fi 7 Immersive Home network platform. It is built to support the latest high speed broadband connections and devices populating for connected homes. The Qualcomm Wi-Fi 7 Immersive platform delivers more than 20Gbits per second of total system capacity in a compact, power-efficient, cost effective network chipset architecture.

The platform introduces Qualcomm Multi-Link Mesh for high throughput and real-time responsiveness.

Nick Kucharewski, senior vice president and general manager, Wireless Infrastructure and Networking, Qualcomm Technologies, said: “Wi-Fi 7 brings powerful new capabilities which are best experienced using a tri-band system. . . Wi-Fi mesh can deliver performance gains for both new and legacy devices.”

The Qualcomm Immersive Home Platform is engineered to enable collaboration, telepresence, AR/VR (augmented reality / virtual reality) and immersive gaming applications. It offers multi-Gigabit coverage and low latency.

Within the platform, Qualcomm Multi-Link Mesh redefines home networking, said Qualcomm, through dynamically managed client-facing and mesh-backhaul wireless links. Through a process of selecting, aggregating or alternating links in the 2.4, 5.0 and 6.0GHz unlicensed spectrum bands based on network conditions, device capabilities and home network topology, it enables deterministic low latency for virtually lag-free gaming experiences. Real-time latency in congested environments can be reduced by up to 75 per cent reduction, reported Qualcomm.

Wi-Fi 7 can achieve extremely high performance with multi-Gigabit coverage over a wide area. Key features include expanded 5.0GHz spectrum performance, with 240MHz channels and 4K QAM (quadrature amplitude modulation) that can deliver 80 per cent higher capacity compared to Wi-Fi 6.

The maximised 6.0GHz spectrum performance, with 320MHz and 4K QAM modulation can deliver 140 per cent higher capacity compared to Wi-Fi 6E, added Qualcomm. Full support for the turnkey Qualcomm AFC provides corner-to-corner multi-Gigabit coverage, said the company. The AFC Solution is available for customer device integration immediately. Once regulatory approvals are granted, it will be commercially available for use by the public.

Support for Wi-Fi 7 Multi-Link and adaptive interference puncturing is claimed to optimise operation even in congested environments. Intelligent congestion avoidance algorithms ensure high performance even in the presence of potential interference from neighbouring networks or other devices.

The platform delivers maximum connectivity to the latest high-performance devices, delivering peak speeds up to 5.8Gbits per second to a single connected device, said Qualcomm.

The platform is based on low profile form factors based on a modular and scalable design architecture to accelerate time to market. It uses advanced process node and fully integrated RF front-end modules (FEMs) for performance optimisation.

The tri-band Wi-Fi 7 configurations, ranging from 10 to 20Gbits per second peak wireless capacity, mean the platform delivers nearly twice the capacity of comparable Wi-Fi 6 systems, claimed Qualcomm, enabling higher user count, higher speed connections, or extended range requirements.

David Henry, president and general manager of Connected Home Products and Services at Netgear, commented: “We’re looking forward to combining this technology with our wireless RF and networking expertise to provide our customers with unique, high performance, multi-band Orbi Mesh products.”

Sharing a common architecture with the production-ready Qualcomm Networking Pro Series Wi-Fi 7 platform, the Immersive Home Platforms are sampling now with commercial availability expected in the second half of 2023.

http://www.qualcomm.com

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Supermicro revises server architecture to lower cloud operating costs

Axiomtek bases fanless edge AI computer vision on Xilinx AI accelerator

Mouser ships Qorvo DWM3001C module to accelerate IIoT design

Qualcomm introduces Wi-Fi 7 immersive home platforms

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