Nexans and Authentic Vision partner to tackle cable counterfeiting 

Counterfeiting in the cabling industry is a serious challenge which has prompted cable manufacturer, Nexans to  partner with Authentic Vision, a provider of mobile authentication solutions, applying Authentic Vision’s Holographic Fingerprint labels to Nexans’ cable products.

The strategic alliance partnership is based on consumer safety and improving the customer experience, said Nexans. Authentic Vision’s patented Holographic Fingerprint labels have already been applied to Nexans products packaging in Peru and Lebanon and are deployed in other countries. The labels make it easy for customers or distributors to scan and verify the authenticity of a product with any smartphone. According to Nexans, this approach provides value-added services to its customers and protects them from potentially harmful, sub-standard products. 

The most important risk associated with counterfeit cable is cheating on the quantity of copper, which can have dramatic consequences. By reducing the diameter of the copper conductor, counterfeit cables can become abnormally hot when current is passed through them and cause a short circuit and can lead to fire breaking out. 

Through our partnership with Authentic Vision, digital innovation plays a key role in our customers’ safety,” said Jérôme Fournier, vice president of innovation at Nexans. “It helps Nexans guarantee its products’ conformity in terms of manufacturing and safety standards”, he added.

The Group is now planning to roll out and deploy Authentic Vision’s solution in products around the world.

Authentic Vision’s security labels are secure, easy to use and instantly provides clear positive / negative verification results, said Thomas Weiss, CEO of Authentic Vision. No additional training or specialised equipment is required for use. They cannot be copied, due to the physical randomness used in the production process, revealed Weiss. “Even we are not able to duplicate or copy the labels ourselves”, he said. “Our solution provides customers with proof of authenticity, and in the event a fake attempt occurs, precise geo-location provides brands with actionable data. 

The labels are based on Meta-Anchor technology which provides every product with a physically and digitally unique identifier (UID) and tracks counterfeiting attempts. This provides valuable data for companies to prosecute counterfeiters and fraudsters, said Nexans. 

The holographic label means anyone can differentiate a genuine product that respects standards in force and one that is manufactured in the frame of the Group Sustainability action plan. “By fighting against counterfeit products, we create value for our customers”, added Elyette Roux, chief sales and marketing, communications officer at Nexans. 

Beyond ensuring the authenticity of the product, making these products unique and connectable also represents an added value for our customers in terms of information exchange with Nexans, such as installation guide videos or product features brochures,” she added.

Nexans is driving the change towards a safer, more sustainable, renewable, carbon-free world, accessible to all. The Group is a leader in the design and manufacturing of cable systems and services across five main business areas: energy generation and transmission, distribution, usages, industry and solutions and telecomms and data. 

Nexans was the first company in its industry to create a foundation supporting sustainable initiatives bringing energy to disadvantaged communities worldwide. The Group pledged to contribute to carbon neutrality by 2030.

http://www.nexans.com

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UP Xtreme i12 Edge computer bring AI to health and transport

The latest addition to the UP series by Aaeon is based on the 12 th generation Intel Core, or Intel Celeron processors. 

The UP Xtreme i12 Edge makes substantial upgrades on Aaeon’s predecessor with the power-efficient, multi-core architecture of 12 th Generation Intel Core i7 / i5 / i3 / Celeron processors (formerly Alder Lake-P), onboard LPDDR5, and AI module support. These contribute to its adaptability for industrial, healthcare, and transport applications.

For expansion, the UP Xtreme i12 Edge has four M.2 Keys for Wi-Fi 6, 5G, AI and PCIe 4.0 storage module support, in order to bring edge AI computing capabilities to a wider variety of markets. The computer also supports Intel Iris Xe graphics, Intel DL Boost, and the Intel Distribution of OpenVINO Toolkit. This boosts GPU image classification inferencing performance by up to 2.81 times that of the previous generation, confirmed Vishay.

Housed in a fanless 152 x 123.8 x 72.5mm chassis, the UP Xtreme i12 Edge also has one USB 4.0, three USB 3.2, and three USB 2.0 ports, along with an Intel i226-IT LAN port running at 2.5Gbits per second and with TSN (time sensitive networking). Aording to Aaeon, the UP Xtreme i12 can achieve real-time data processing using its onboard LPDDR5 system memory. 

A selection of I/O ports complement the display interface, which can support four simultaneous 4K displays via configurations of HDMI 2.0, DP 1.4a and eDP 1.4b ports, enhanced by Intel Iris Xe graphics. 

Potential uses of the combination of computing performance and AI are smart retail and industrial automation solutions, particularly given its fanless chassis and 12 to 36V power input range.

The UP Xtreme i12 Edge is in mass production and available for order.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI Edge solutions. Aaeon provides computing platforms including industrial motherboards and systems, rugged tablets, embedded AI Edge systems, uCPE network appliances, and LoRaWAN / WWAN solutions. Aaeon provides experience and knowledge to provide OEM / ODM services worldwide. Aaeon also works closely with cities and governments to develop and deploy smart city ecosystems, offering individual platforms and end-to-end solutions. 

Aaeon works closely with premier chip designers to deliver stable, reliable platforms, and is recognised as a Titanium member of the Intel Internet of Things Solutions Alliance. 

http://www.aaeon.com.

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Ultrasonic lens cleaning chipset enables self-cleaning cameras and sensors

Small and affordable cleaning systems for automotive and industrial applications can be created using Texas Instruments’ ultrasonic lens cleaning (ULC) technology which enables camera systems to quickly detect and remove dirt, ice and water using microscopic vibrations.

Removing contaminants from camera lenses traditionally requires manual cleaning which causes system downtime, or necessitates the use of various mechanical parts that could malfunction. TI’s new ULC chipset, including the ULC1001 digital signal processor (DSP) and companion DRV2901 piezo transducer driver, is based on a proprietary technology that allows cameras to rapidly self-clear contaminants using precisely controlled vibrations to rapidly eliminate debris, which improves system accuracy and reduces maintenance requirements. 

The chipset offers designers a compact and affordable way to use ULC in a wide range of applications and camera sizes.

Avi Yashar, product marketing engineer at TI, commented: “With the recent proliferation of cameras in a variety of applications, from automotive and traffic cameras to smart cities and manufacturing, there’s a strong need for a simple, cost-effective way to enable self-cleaning cameras.”

The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, and temperature and fault detection without any image processing, making ULC technology adaptable to various camera lens designs. The chipset’s small form factor makes it possible to improve machine vision and sensing in a variety of applications , wherever a camera or sensor could get dirty, said TI. 

“As advanced driver assistance systems [ADAS] become more sophisticated and drivers rely on them more extensively, it will become more important than ever that the sensor suite is fully operational at all times,” said Edward Sanchez, senior analyst, global automotive practice, TechInsights. 

“Dirt or foreign material on a camera lens, which would be just a nuisance in the case of a rear view camera, becomes a vital functional and safety issue on a vehicle that relies on accurate and precise imaging and sensor data.

The ULC1001 ultrasonic cleaning DSP with proprietary algorithms integrates a pulse-width modulator, current- and voltage-sense amplifiers and an analogue to digital converter (ADC). Used with the DRV2901 piezo transducer driver as a companion amplifier, TI’s chipset enables ULC in a compact footprint with a PCB size less than 25 x 15mm, reducing the bill of materials while providing more functionality than a discrete implementation.

The ULC1001 DSP is in volume production and available from the manufacturer and authorised distributors in a 4.5 x 5.0mm, 32-pin HotRod quad flat no-lead (QFN) package.

The DRV2901 piezo transducer driver is also available now together with an evaluation module, the ULC1001-DRV290XEVM.

http://www.TI.com

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GaN eToF laser driver IC can lower lidar system cost, says EPC

Time-of-flight (ToF) lidar applications including robotics, 3D security cameras, 3D sensing and vacuum cleaner can benefit from the EPC21701, an 80 V laser driver IC, said Efficient Power Conversion (EPC). The 80V, 15A GaN eToF laser driver IC, the EPC21701, is capable of 15A pulsed current, suitable for ToF lidar applications.

The monolithic device integrates an 80V, 40A FET with gate driver and 3.3V logic level input. The IC is tailored for lidar systems for gesture recognition, ToF measurement, robotic vision or industrial safety, said EPC.

The EPC21701 laser driver uses 5.0V supply voltage and is controlled using 3.3V logic. It is capable of high frequencies greater than 50MHz and super short pulses down to two nanoseconds to modulate laser driving currents up to 15A. Voltage switching time is less than one nanosecond and delay time from input to output is less than 3.6 nanoseconds. 

The EPC21701 is a single-chip driver plus GaN FET using EPC’s proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.7 x 1.0 x 0.68mm.   

The wafer level packaging is small with low inductance, added EPC. The small form factor and the integration of several functions mean that the overall solution is 36 per cent smaller on the PCB compared to an equivalent multi-chip discrete implementation, said EPC.

The 80V EPC21701 complements the ToF driver IC family in chip-scale package (CSP) that also includes the 40V, 15A EPC21601 and the 40V, 10A EPC21603 devices.

Integrated devices in a single chip are easier to design, easier to layout, easier to assemble, said EPC and additionally save space on the PCB, increase efficiency, and reduce cost to enable faster adoption of ToF across a wider array of end user applications.

Alex Lidow, CEO, and co-founder of EPC, commented: “Integrating a GaN FET with driver on one chip generates an extremely powerful and fast IC and reduces size and cost for wider adoption in consumer and industrial applications.” The EPC21701 extends the family and Lidow confirmed that the company will soon announce a further extension to 100V and 125A.

The EPC9172 development board features the EPC21701 eToF laser driver IC and is primarily intended to drive laser diodes with short, high current pulses. Capabilities include minimum pulse widths of less than two nanoseconds, 15A peak currents, and bus voltage rating of 40V. 

The EPC21701 and EPC9172 are available for immediate delivery from Digi-Key.

Designers interested in replacing silicon MOSFETs with a GaN device can use EPC’s GaN Power Bench, a cross-reference tool, to find a suggested replacement. The tool can be accessed on the EPC website.

EPC specialises in enhancement mode gallium nitride (eGaN) -based power management. eGaN FETs and ICs provide performance many times greater than the best silicon power MOSFETs in applications such as DC/DC converters, remote sensing technology (lidar), motor drives for eMobility, robotics, and drones, and low-cost satellites.

http://www.epc-co.com

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