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Qualcomm announces “first 5G Advanced-ready modem-RF system”

Thu, Feb 16, 2023

Claimed to be the first modem to antenna system to support 5G Advanced, Snapdragon X75 will push the boundaries of connectivity including coverage, latency, power efficiency and mobility, said Qualcomm. Target applications are smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.

Snapdragon X75 has a dedicated hardware tensor accelerator, Qualcomm 5G AI processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1. It also introduces Qualcomm 5G AI Suite Gen 2 with AI-powered optimisations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The 5G AI suite’s AI-based capabilities include what is believed to be the first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2 to optimise 5G performance.

The Snapdragon X75 is powered by a new modem-to-antenna upgradeable architecture and is scalable. In addition to the 10-carrier aggregation for mmWave, there is 5x downlink carrier aggregation and FDD uplink MIMO for sub-6GHz bands, which optimise spectrum aggregation and capacity.

Converged transceiver for mmWave and sub-6GHz paired with the new Qualcomm QTM565 mmWave antenna modules reduce cost, board complexity, hardware footprint and power consumption, said the company.

There is also the company’s 5G PowerSave Gen 4 and RF Power Efficiency suite for extended battery life.

The modem to antenna system has support for DSDA Gen 2, enabling 5G/4G Dual Data on two SIM cards simultaneously. For fast, reliable, long range uploads, there is the Smart Transmit Gen 4 now includes support for Snapdragon Satellite.

“5G Advanced will take connectivity to a whole new level, fuelling the new reality of the connected intelligent edge,” said Durga Malladi, senior vice president and general manager, cellular modems and infrastructure, Qualcomm Technologies. He added the Snapdragon X75 Modem-RF system with “innovations such as hardware accelerated AI and the support for upcoming 5G Advanced capabilities, . . . unlock a whole new level of 5G performance and a new phase in cellular communications.”

Qualcomm has also announced the Snapdragon X72 5G modem-RF system (pictured). It is optimised for mainstream adoption of mobile broadband applications, supporting multi-Gigabit download and upload speeds.

Snapdragon X75 is currently sampling, with commercial devices expected to launch by the second half of 2023.

http://www.qualcom.com

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TDK adds two digital MEMS accelerometer sensors to Tronics AXO300 series

Thu, Feb 16, 2023

The AXO301 and AXO305 digital MEMS accelerometer sensors have been introduced by TDK.

The AXO301 high resolution accelerometer and inclinometer is for railway and industrial systems and the AXO305 is a high performance accelerometer for land, marine and robotics applications.

The AXO301 low noise and high resolution ±1 g accelerometer is suitable for high precision acceleration/deceleration measurements in railway applications and inclination control in industrial applications. The AXO305 ±5 g accelerometer is tailored for navigation, positioning and motion control of land and marine manned and unmanned systems.

They use a closed-loop architecture that delivers high linearity and stability even under strong vibrations, said TDK. The accelerometers have a one year composite bias repeatability of 1mg and composite scale factor repeatability of 600ppm.

The AXO301 offers a performance-equivalent, low-SWaP (size, weight and power) and cost-effective alternative to force balance inclinometers and servo-accelerometers, said TDK. It demonstrates a low noise density of eight microg/√Hz with 50 microg resolution to offer high-accuracy inclination angle measurements. The AXO301 is tailored to odometry assistance for train positioning and localisation systems, high-end industrial tilt and inclination measurements systems as well as motion control of construction machinery. It is compliant with EN61373 railway standard for vibrations and shocks.

The AXO305 has an input measurement range of ±5g and vibration rectification error of 20 microg/g². It is tailored to navigation, positioning and motion control functions of land, rail and marine transportation systems and vehicles. It demonstrates a bias instability of 4 microg with a ±0.5 mg bias over its temperature range, thus enabling precise GNSS-aided navigation of manned and unmanned ground vehicles and trains when integrated into inertial navigation system (INS), said TDK. AXO305 is a candidate for motion reference units (MRUs) used for ship motion control and dynamic positioning, inertial measurement units (IMUs) for land navigation, sub-sea navigation of AUVs (autonomous underwater vehicles) and ROVs (remotely operated vehicles), platform and crane stabilisation as well as precision robotics.

The closed-loop architecture offers high resolution and strong vibration rejection, said TDK.

The accelerometers are housed in a miniature, hermetic, ceramic J-lead package that ensures long operational and storage life and guarantees a high compliancy with the stringent thermal cycling requirements of critical applications. They embed hard-coded electronics with a 24-bit digital SPI for fast integration into standalone sensor modules, INS, IMUs as well as attitude and heading reference systems (AHRS). Built-in self-test ensures initial verification of the sensor’s integrity and continuous in-operation functionality test, added TDK.

http://www.tdk-electronics.tdk.com

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Assisted reality headset has HyperDisplay for hands-free computing

Thu, Feb 16, 2023

Rugged headwear for frontline professionals from RealWear uses HyperDisplay viewing for enhanced viewing. The RealWear Navigator 520 is the company’s next generation rugged, assisted reality headset which builds on the earlier RealWear Navigator 500, but with an upgraded and redesigned viewing system, HyperDisplay, for a bigger, sharper and bolder image for frontline professionals.

The HyperDisplay in RealWear Navigator 520 replaces the Core Display in standard definition (SD) found in RealWear Navigator 500, offering a 20 per cent larger high definition (HD) screen in 720p with twice the pixels and an eye box that is five times larger, and improved eye relief to extend the maximum distance the eye can be from the display to view the content easily and identify minute details.

RealWear Navigator 520 includes a modular platform (compatible with the new thermal module) with an upgradeable 48Mpixel camera system, a hot-swappable battery, with Wi-Fi, Bluetooth and an optional 4G modem. The user interface includes patented noise-cancellation, with support in 23 languages and dialects. RealWear has more than 200 optimised partner apps for remote collaboration, workflow and computer vision.

Rama Oruganti, chief product officer, RealWear, said the Navigator 520’s improvements and innovations, devices, accessories, apps and cloud-based control has set a new, high bar for a full stack enterprise-level wearable product in the industrial wearables market.

Oruganti continued: “Our customers are focused on resiliency and retaining technical talent through an unprecedented labour and skills shortage and next wave of digital transformation. Our device is a compelling offering for these moments where every minute of productivity and efficiency must count toward the bottom line.”

RealWear said the Navigator 520 can improve individual and team productivity, allowing each frontline professional to do more with less time or support.

RealWear Navigator 520 is shipping now available through all authorised RealWear resellers. It includes a one year warranty. 

RealWear provides assisted reality wearable products for frontline industrial workers to perform work tasks more safely, and with increased efficiency and precision. RealWear gives these workers real-time access to information and expertise, while keeping their hands and field of view free for work.

RealWear customers include Shell, Goodyear, Mars, Colgate-Palmolive, and BMW.

http://www.RealWear.com

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Farnell signs EDAC Clipzin Connectors for Raspberry Pi

Wed, Feb 15, 2023

Manufactured by EDAC and designed by OpenLX, the Clipzin range of connectors is intended for the Raspberry Pi Pico and PicoW, and Arduino Connect modules. An exclusive deal with the manufacturer and Farnell has been signed. In addition to the modules listed, more options are to follow, said Farnell.

The Clipzin edge connector eases manufacturing and facilitates modularisation, encouraging sustainability by promoting easy in-service upgrades and reusability, said Farnell. It allows customers to produce one design that can be customised and to offer variants, reducing design time and the need to stock many versions.

Clipzin enables rapid connection and disconnection of sensor, communication and compute modules, such as Raspberry Pi’s new Pico. The retention clip is designed for prototyping to production use. It ensures that modules will not shake free after assembly or in service, yet allows PCBs to be easily swapped later if required.

Prior to Clipzin, modules like PicoW required users to solder through-hole connectors to the PicoW as well as fitting a connector to their PCB. Clipzi™ requires only a surface mount connector to be fitted to one PCB, greatly improving production efficiency, advised Farnell.

The range of Clipzin connectors is available in a 20 way model with six, eight and 17 way models coming soon. They are designed to semi-permanently mount one PCB to another and are suitable for surface mount soldering for production efficiency.

Assembly is tool-less, with a positive, confirming click.

The connector is gold plated for reliability.

Romain Soreau, head of single board computing at Farnell, says, “Clipzin . . . provides a new, solderless way of mounting the Raspberry Pi Pico to another PCB, which allows interchange between Pico models”.

Dr Andrew Robinson, engineering director at OpenLX added, “With PiFace and CodeBug, we have a strong history of bringing innovative products to market with Farnell. Combined with EDAC’s years of experience it’s a fantastic partnership to develop a new connector that makes it easier for people to use and reuse the growing range of modules such as Raspberry Pi PicoW. Clipzin unlocks the efficiencies of surface mount manufacturing, over the cost and complexity of through hole assembly of existing header-pin solutions.”

The Clipzin PCB connectors from EDAC, OpenLX are now available from stock at Farnell in EMEA, and element14 in APAC.

http://www.farnell.com

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Qualcomm announces “first 5G Advanced-ready modem-RF system”

TDK adds two digital MEMS accelerometer sensors to Tronics AXO300 series

Assisted reality headset has HyperDisplay for hands-free computing

Farnell signs EDAC Clipzin Connectors for Raspberry Pi

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