Bosch Sensortec launches BMI5 motion sensor platform at CES

At CES 2026, Bosch Sensortec introduces the BMI5 platform, a new generation of inertial sensors designed to provide consistent, high-precision performance across multiple device classes. Built on a shared hardware foundation and adapted through intelligent software, the platform launches with three variants – BMI560, BMI563 and BMI570.

At the core of the BMI5 platform is Bosch’s latest MEMS architecture, which defies thermo-mechanical stress effects, provides ultra-low noise, vibration robustness and twice the full-scale range of the previous generation. A latency of below 0.5 ms, combined with a time increment of approximately 0.6 µs and a timing resolution of 1 ns, ensures responsive and reliable motion tracking in highly dynamic environments. A compact industry-standard LGA package further simplifies integration. A programmable Edge-AI classification engine supports always-on functionality by analysing motion patterns directly on the sensor, reducing system power consumption and accelerating customer-specific use cases.

The BMI560 is optimised for XR headsets and glasses, where low noise, low latency and precise time synchronisation enable natural head motion, frame prediction and intuitive 3D interaction. For smartphones and action cameras, its advanced OIS+ performance helps capture stable, high-quality footage even in dynamic environments.

The BMI563 combines an extended Full Scale Range (FSR) with the platform’s vibration robustness, supporting Simultaneous Localisation and Mapping (SLAM), high-dynamic XR motion tracking and motion-based automatic scene tagging in action cameras. Its design ensures reliable data acquisition under demanding robotic motion profiles.

The BMI570 provides dependable activity tracking, advanced gesture recognition and accurate head-orientation data for spatial audio. Its robustness under dynamic sports and everyday movements makes it a strong fit for next-generation wearables and hearables.

Across all variants, the BMI5 platform meets Bosch Sensortec’s highest ecological standards to date, combining technical performance with responsible innovation. This unified architecture enables device makers to streamline development across product lines, while supporting future edge-AI and ML-enabled enhancements.

www.bosch-sensortec.com

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Nordic Semiconductor simplifies edge AI for billions of IoT devices

Nordic Semiconductor is bringing AI intelligence and functionality to the smallest battery-powered IoT devices. With an ultra-low-power Edge AI solution, Nordic accelerates the arrival of a new generation of devices with integrated edge AI intelligence – combining energy efficiency with unmatched ease of use for developers.

“AI factories train intelligence, but Nordic deploys it – on device, at the edge, where the world happens – said Vegard Wollan, CEO at Nordic Semiconductor. “Edge AI is no longer optional – it’s the only way to deliver safety, privacy, and sustainability at scale. Nordic’s edge AI solution enables millisecond decisions without round-trip latency to the cloud, ensures compliance through local processing, and delivers radically improved battery life for billions of connected devices. This is the new standard for ultra-low-power edge AI and Nordic is defining it.”

In 2023, Nordic acquired Atlazo and its Axon technology. The nRF54LM20B SoC is the first large-memory member of the nRF54L Series, integrating the Axon Neural Processing Unit (NPU), an ultra-efficient AI hardware accelerator, to supercharge demanding edge AI workloads. Axon delivers up to 7 times faster performance and up to 8 times higher energy efficiency versus competing solutions for tasks such as sound classification, keyword spotting, and image-based detection.

The nRF54LM20B SoC pairs the Axon NPU with 2 MB NVM, 512 KB RAM, a 128 MHz Arm Cortex-M33 plus RISC-V coprocessor, high-speed USB, up to 66 GPIOs, and Nordic’s fourth-generation ultra-low-power 2.4 GHz radio supporting Bluetooth® LE, Bluetooth Channel Sounding, Matter over Thread, and more.

The Neuton models are ultra-tiny, CPU-run edge AI models that are typically under 5 KB and up to 10 times smaller, faster, and more efficient than other CPU-run models. Nordic Edge AI Lab helps developers generate custom Neuton models for anomaly detection, activity and gesture recognition, biometric monitoring, and more – delivering privacy-preserving, real-time intelligence on tiny batteries and constrained memory, without cloud dependency.

With Nordic Edge AI Lab and Neuton models, intelligence moves from concept to reality without complexity. One recent deployment illustrates this: A global supply chain solution upgraded its smart tracking devices with AI models created in Nordic Edge AI Lab effortlessly, enabling detection of real handling events such as shock, shaking, and transportation directly on an nRF54L Series SoC. These AI-driven insights were rolled out across an entire fleet without operational disruption, thanks to Nordic’s nRF Cloud lifecycle services.

“With Nordic Edge AI Lab, Neuton models, and the Axon NPU, Nordic makes advanced on-device AI practical for every embedded developer,” said Oyvind Strom, EVP Short-Range BU at Nordic Semiconductor. “Developers get the simplicity to move fast, and the disruptive performance to scale from wearables to industrial sensing – all enabled within Nordic’s trusted ultra-low-power hardware solutions.”

As intelligence moves to the edge, the need for OTA management and deep observability is growing. At the same time, cloud-based lifecycle services remain critical for device management, embedded observability, and location services. Manufacturers increasingly need continuous insight into device performance – not just to improve products in real time, but to meet growing regulatory and customer requirements. Using data from deployed devices enhances features and optimises performance without disrupting the user experience. This ensures connected products can evolve securely and efficiently throughout their lifecycle.

www.nordicsemi.com

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ST scales STM32 microprocessors for cost-efficient, low-power, and flexible performance

ST has introduced STM32MP21 microprocessors (MPUs) for cost-aware edge applications in smart factories, smart homes, and smart cities, combining advanced cores and peripherals with strong security targeting SESIP Level 3 and PCI pre-certification.

Extending ST’s STM32MP2 series, the new MPUs with a 1.5GHz 64-bit Arm Cortex-A35 core and advanced 32-bit Cortex-M33 at 300MHz ensure fast execution times with flexibility. The two cores handle complex tasks and real-time control, adding the opportunity for boot processing on the Cortex-M33 to launch services quickly and accelerate system wake-up from power-saving modes.

Bringing a focused feature set, STM32MP21 MPUs integrate MIPI CSI-2 and image signal processing (ISP) pipeline for machine-vision applications such as industrial inspection and barcode or QR-code readers. Also, two Gigabit Ethernet ports with Time-Sensitive Networking (TSN) support applications that need determinism, low latency, jitter-free communication, synchronisation, and scheduling, including industrial automation, robotics, functional safety, and sensor-data capture.

On top of DDR4/LPDDR4 DRAM support, the series supports DDR3L memory, enabling designers to optimise system performance, footprint and BoM, while maintaining competitive pricing and secure supply amid ongoing DDR4/LPDDR4 shortages and price surges.

The security architecture shared throughout the STM32MP2 series is built to comply with increasingly strengthened regulations worldwide, including the incoming EU Cyber Resilience Act (CRA). The MPUs’ SESIP Level 3 security-assurance target aligns with CRA implementation guidelines that specify AVA_VAN.2 or AVA_VAN.3 resistance for Important (Class II) products and at least AVA_VAN.4 for Critical products. Customers’ applications are protected even before delivery with ST’s in-factory secure secret provisioning (SSP) to load the unique identity and immutable passwords for authentication and attestation. A secure hardware cryptographic accelerator inhibits physical attacks, while supporting secure boot and applicative needs. Code isolation with Arm TrustZone protects startup and sensitive processes, completed with hardware protection of memory and peripherals leveraging ST’s proprietary resource isolation framework (RIF) to prevent tampering.

Product developers can take advantage of the STM32 ecosystem that provides extensive software and tools for building and testing MPU applications. These include ST Edge AI desktop and cloud tools, OpenSTLinux and software expansion packages, as well as evaluation boards, the STM32MP215F-DK Discovery kit, and adapter boards. On top of the well-established OpenSTLinux distribution, with Yocto and Buildroot flavors, a bare metal offer will be available for the STM32MP2 series in 2026, as presented previously for the STM32MP13 series.

The new STPMIC2L power-management IC (PMIC) provides the power supplies needed for the STM32MP21 and DRAM, to simplify system design and minimise circuit footprint. Additional PMICs are available, suited to other combinations of STM32 MPU and peripherals, and are described online at ST’s website. CAD resources in the STM32 MPU product pages give access to Altium projects for the most commonly used configurations to further accelerate customers’ designs.

STM32MP21 package options include 8mm x 8mm 225-pin and 10mm x 10mm 361-pin VFBGAs suited to 6-layer high-density interconnect (HDI) boards. In addition, a 11mm x 11mm 273-pin VFBGA and 14mm x 14mm 289-pin TFBGA are available for cost-conscious 4-layer boards. The 10mm x 10mm VFBGA361 is pin-to-pin compatible across the entire STM32MP2 series.

www.st.com

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AAEON compact industrial AI system with enhanced expansion options

AAEON has released the GENESYSM-MTH6, a slim SubCompact System powered by Intel Core Ultra processors Series 1 (formerly Meteor Lake).

Measuring just 190mm x 134.1mm x 43mm and with both wall and VESA mounting options, the GENESYSM-MTH6 appears well-suited to act as a compact edge AI system for industrial setups. However, given the presence of three LAN ports for peripheral camera support, AAEON have noted it has the specifications necessary to operate as part of AI-assisted surveillance applications.

Differentiating itself from previous AAEON SubCompact Systems is the GENESYSM-MTH6’s inclusion of the PER-SB2B expansion module as part of the product’s BOM. The module, which was offered as an optional accessory for the board-level GENE-MTH6, will be included by default for the GENESYSM-MTH6.

This module provides a substantial boost to the expansion options available, providing the system with two M.2 2280 M-Key slots for high-speed storage or AI acceleration, while maintaining an additional M.2 2280 M-Key on the system’s motherboard. Other expansion options include an M.2 3052 B-Key and M.2 2230 E-Key, which allow for the installation of 5G and Wi-Fi 6E CNVi modules, respectively.

The GENESYSM-MTH6 has a robust I/O that lends itself to industrial use, including three RJ-45 LAN, two of which run at 2.5GbE and one at 1GbE. AAEON notes that Intel vPro and PXE support is available on the system’s two 2.5GbE ports on SKUs featuring select processors from the Intel® Core Ultra processors (Series 1) range. Rounding off its I/O, the GENESYSM-MTH6 offers two COM ports for RS-232/422/485, two USB 3.2 Gen 2, a GPIO 8-bit, and a choice of SMBus or I2C.

Environmental resilience reinforces the GENESYSM-MTH6’s credibility for industrial deployment, with a 9V to 36V power input range with ERP support alongside a -10°C to 50°C operating temperature range.

 

aaeon.com

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