Rutronik signs Europe and Israel distribution deal with MediaTek 

Independent distributor, Rutronik, has signed a franchise agreement with fabless semiconductor company, MediaTek to distribute MediaTek’s portfolio of IoT chipsets in Europe and Israel. 

Its Genio processors offer fast multi-core performance with high energy efficiency, making them suitable for robotics, industrial automation and IoT applications. 

The agreement adds another semiconductor company to Rutronik’s linecard. MediaTek specialises in developing SoCs for mobile, home entertainment, connectivity and IoT products. The Genio series targets brands developing consumer, enterprise, and industrial smart applications at the premium, mid-range and entry levels. Rutronik will help distribute the Genio processors to customers that are designing smart home appliances, industrial automation applications, robotics, POS (point of sale) devices, digital signage, and other IoT applications.

“For us, customer orientation and future viability means offering precisely those products that are currently in demand or will be in demand. MediaTek’s innovative components and technologies add real value to our line card. The symbiosis of high-performance components and our know-how fulfills exactly what our customers expect from us as a distributor,” said Reza Armin Maghdounieh, vice president product marketing, semiconductors at Rutronik.

MediaTek said its Genio series combines quality, robustness and longevity. It offers fast multi-core performance with high energy efficiency, even for computationally intensive applications, said the company. Its development environment allows designers to customise products using Yocto Linux, Ubuntu, and Android and MediaTek’s development kits help to reduce the costs of development in the long term and accelerate time to market. 

In addition, Rutronik’s Embedded portfolio offers board-level solutions from manufacturers including Advantech, Kontron, Seco, and VIA in different form factors using the Genio chipsets. For customers, this means a fully comprehensive ecosystem from the product to the design and the solution, said Rutronik.

“We are continuing to see a strong demand for consumer, enterprise, and industrial smart applications, so we look forward to working closely with Rutronik to help brands bring intelligent devices to market faster,” said Richard Lu, vice president of MediaTek’s IoT business unit.  

He hoped: “As the largest European distributor, Rutronik will help us to further expand our IoT footprint in the region.” 

http://www.rutronik.com

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Dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 module is automotive-grade

In order to prevent wireless network congestion in a vehicle and enhance audio functionalities, the u-blox JODY-W5 is an automotive-grade module with Bluetooth LE Audio. It has a compact form factor and operates in  temperatures up to 105 degrees C. 

It blends dual-band Wi-Fi 6 and dual-mode Bluetooth 5.3 technologies, including LE Audio, and is described as both cost-effective and compact while enabling different antenna configurations. 

The u-blox JODY-W5 can be used in helmet-to-helmet communication for two-wheel vehicles, EV charging solutions such as link/device configuration and data charging via an access point, telematics control and head units such as diagnostics and software updates. It can also be used for infotainment with rear seat entertainment connectivity, smartphone tethering and hands-free calling. 

The module is available in two operating temperature variants, operating at up to +85 and +105 degrees C meeting Automotive Grade 2 requirements. On request, the JODY-W5 provides an LTE-coexistence filter and antenna configurations. It is pin compatible with other u-blox JODY modules for ease of migration, design flexibility and upgradability while saving time and cost.  

Enhanced security features support secure boot and over-the-air firmware updates, key management, and hardware encryption for critical protocol keys with NXP Semiconductors’ EdgeLock Secure Subsystem, built into NXP’s AW611. These features reduce implementation efforts considerably said u-blox, while helping avoid costly security incidents. 

“By integrating the AW611 into the JODY-W5 module, we extend our partnership with u-blox, offering a solution that balances the trade-off between the adoption of latest technologies and product cost,” said Larry Olivas, general manager and vice president, Wireless Connectivity Solutions, NXP Semiconductors. 

The JODY-W5 module covers RF design and certification requirements for end devices use and applications, which can be extended globally upon request, said Sebastian Schreiber, Product Strategy, Short Range Radio, at u-blox.

The globally certified module minimises the need for specific radio testing, explained u-blox, enabling a faster time to market. The first samples will be available by the end of the third quarter of 2023.

http://www.u-blox.com

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Gaia Converter augments DC/DC converter portfolio for rail applications 

High reliability and industrial grade wide input DC/DC converters from Gaia Converter now include an input bus conditioner for rail applications, designed to meet the needs of the rapidly-evolving railway infrastructure. 

Railways worldwide are expanding and evolving to reduce emissions while optimising safety, capacity, and interoperability, said the company. The widespread adoption of smart signalling and speed control systems like the European Rail Traffic Management System (ERTMS) is setting new, more stringent requirements for power conversion devices.

The new input bus conditioner can suppress extreme surges in railway environments and board-mount parts rated at 20W, 40W and 80W, with the added feature of 3kVAC reinforced safety isolation rating to IEC 62368-1. 

Input range for each part is 12 to 160V DC, to include 24V, 48V, 72V, 96V and 110VDC nominals in order to meet EN 50155 and other rail specifications, as well as standards for common industrial applications. The input will also withstand 176V DC for 100ms to include the surge specified in rail standard NF-F 01-510 for 110V DC nominal, as well as the RIA12 specification of 168V DC for 20ms for 48V DC nominal. 

Surges to 385V DC for 20ms to specification RIA12 can be met with the additional input bus conditioner type FLHGI90, which also attenuates fast transients, provides reverse polarity protection and ensures compliance with EN 550121 EMC specification. 

Without the input bus conditioner, the parts can meet EN 55022 Class B EMI with a recommended external filter. Outputs available for each model are 2 x 5V, 2 x 12V or 2 x 15V, which are mutually isolated and can be paralleled for higher current, placed in series for higher voltages or connected as ±bipolar outputs for maximum flexibility. Efficiency is typically 87 per cent and case operating temperature range is from -40 to +105 degrees C without derating. Output power derates by just 25 per cent for input voltages lower than 36V DC.

Control functions include an on/off pin and output trim which can vary the outputs (-20 to +10 per cent). Protection features are over-load, short-circuit, soft-start and input under-voltage lock-out, with a trimmable threshold, to match all battery voltage standards.

Each converter is offered in a fully potted, low profile metallic case measuring 35 x 30 x 10mm for the 20W part, 46 x 36 x 10mm for the 40W part and 50 x 44 x 12.9mm for the 80W part.

MTBF performance is typically above 1000khrs according to Mil HDBK 217F GB, 25 degrees C, where the usual figure for competing products is nearer to 300 to 500khrs for the same standard conditions.

https://www.gaia-converter.com

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Low power positioning technology extends RivieraWaves Bluetooth IP

Support for Channel Sounding over Bluetooth technology has been added by Ceva to its RivieraWaves Bluetooth IP portfolio. The company said it has been introduced to meet the surging demand for high-accuracy secure positioning in the automotive, industrial and broader IoT markets.

Channel Sounding (previously referred to as HADM or high accuracy distance measurement) is a radical improvement on traditional Bluetooth distance and position measurement techniques, namely received signal strength indicators (RSSI) with angle of signal arrival/departure (AoA/AoD). It has additional security and accuracy compared to previous generations of Bluetooth positioning, as well as a low power profile, which makes Bluetooth-based Channel Sounding suitable for applications such as automotive digital keys. It is also suitable for general applications such as industrial / warehouse / consumer asset tracking, and real-time sport / fitness tracking.  

Ceva said that its implementation provides best-in-class decimeter-level accuracy in complex, multi-path real-world environments. This robust, low power architecture, incorporates advanced security mechanisms to defeat distance-spoofing and ‘relay attacks’, said the company, describing these as essential for next generation digital keys and wireless payment systems.

Beyond the demanding secure vehicle entry segment and asset tracking, Bluetooth-based positioning is also experiencing growth in the retail location services segment, especially when coupled with Bluetooth-based electronic shelf label (ESL) systems. 

Ceva’s Channel Sounding for Bluetooth will be available for general licensing in September 2023. The company will be demonstrating the technology at MWC Shanghai 2023 (28 to 30 June), booth N2.EMR04 in Hall 2.

Ceva’s RivieraWaves Bluetooth IP platforms provide solutions for both Bluetooth LE and Bluetooth dual mode connectivity, spanning RF, modem, baseband controller, and complete host and profile software stacks. All the latest features of Bluetooth are supported, including LE Audio / Auracast, LE channel classification, PaWR, and other enhancements. 

The RivieraWaves Bluetooth IP is widely deployed in consumer, automotive and IoT devices with many of the world’s leading semiconductors companies and OEMs, including smartphones, tablets, beacons, wireless speakers, wireless headsets and earbuds, hearing aids and other wearables.

Ceva licenses wireless connectivity and smart sensing technologies and custom SoCs. It also provides digital signal processors, AI engines, wireless platforms, cryptography cores and complementary embedded software for sensor fusion, image enhancement, computer vision, spatial audio, voice input and artificial intelligence. 

http://www.ceva-dsp.com 

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