Taoglas expands TFM series of multi-band GNSS front-end modules

Taoglas has announced the expansion of its TFM series of multi-band GNSS front-end modules. Building upon the existing product range, the expanded series offers design engineers more options for simplifying and accelerating product development for high-precision GNSS applications.

TFM modules comprise a two-stage cascaded filter and low noise amplifier (LNA) topology encapsulated within a shielded, robust, compact, low-profile surface mount package. This design ensures streamlined integration with any multi-band antenna or GNSS receiver, acting as a bridge between the antenna and RF module to facilitate the addition of active electronics to GNSS designs.

The TFM series simplifies integration by combining impedance matching, filters, and low noise amplifiers (LNAs) into a single package. The integrated pre-filters attenuate out-of-band signals, while the LNAs ensure an optimal noise figure across the entire signal chain. Furthermore, high-gain architecture, featuring cascaded LNAs with pre-filters and optimised impedance matching, provides at least 25 dB gain to the GNSS receiver. The 1 dB compression points of the modules are -31 dBm or better, depending on the model and frequency. All TFM modules operate from a DC input voltage of 1.8 to 5.5 VDC, providing maximum design flexibility. The compact footprint and low-profile design, housed in a shielded, surface mount package measuring from 15 mm x 15 mm x 2.7 mm, conserves space without the need for external components.

“Using TFM modules typically saves designers at least six months of development time compared to designing active circuitry on the PCB themselves,” said Taoglas CEO, Dermot O’Shea. “It not only speeds things up and enables them to focus on the rest of their design, but because of our many years of experience designing such circuits for our own antennas, you know you are getting best in class and can be confident in the reliability and accuracy of your GNSS data.”

The expanded TFM series now includes:

TFM.100A – Multi-Band GNSS Front End Module covering L1+B1+G1/L2
TFM.100B – Multi-Band GNSS Front End Module covering L1+B1+G1/L5
TFM.110A – Multi-Band GNSS Front End Module covering L1/L2/L5
TFM.120A – Multi-Band GNSS Front End Module covering L1+B1+G1/L2/L5+L-band
TFM.112A – Multi-Band GNSS Front End Module covering L1+B1+G1/L2/L5+L-band
TFM.115A – Multi-Band GNSS Front End Module for Bands L1, B1, G1, L Band and L5

TFM modules are designed for high-precision, multi-band GNSS applications, including navigation, transportation, robotics, precision agriculture, and autonomous vehicles.

Evaluation boards for the TFM series are now available, allowing engineers to quickly integrate and test these high-performing GNSS modules in their product designs. https://www.taoglas.com/

 

 

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New industrial-grade Two-in-One interactive display solution from IBase

IBASE Technology has unveiled the IXPC-W215 industrial modular panel PC, an innovative two-in-one interactive display solution that seamlessly integrates a 21.5” fully waterproof touch screen (IPPL-W215) with a high-power PD 60W rugged embedded system (ACS200-210) via a USB Type-C single cable connection. It offers two different combination modes, rear mounted or within 2 meters range through an industrial-grade waterproof Type-C cable.

The IPPL-W215 features a Full HD (1920×1080) LCD panel with a wide viewing angle and a projected capacitive touchscreen, delivering 800-nit brightness for excellent visibility. Its IP65-rated front panel and IP54-rated body ensure waterproof protection, making it ideal for harsh environments. Its VESA 100x100mm mounting and 6mm T&V-slot linear rail groove design allows for flexible installation. Paired with the ACS200-210, a high-performance embedded system powered by Intel Atom x7000E Series, N-series or Core 3 Processor N355, it ensures seamless edge computing performance with expandable M.2 slots for WiFi, 4G/5G, Nano SIM slot and dual storage RAID 1 support.

With a single USB Type-C cable supporting data, video, and power delivery up to 60W, the IXPC-W215 simplifies cabling, reduces clutter, and enhances reliability. Whether used in POS, production lines, or industrial control systems, this adaptable and modular panel PC redefines efficiency and performance in the industrial computing landscape.

https://www.ibase.com.tw

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Renesas extends mid-class AI processor line-up for smart factories and intelligent cities of tomorrow

Renesas has expanded its RZ/V Series of microprocessors (MPUs) with a new device that targets the high-volume vision AI market. Similar to its high-end device, the RZ/V2H, the new RZ/V2N MPU comes with Renesas’ proprietary AI accelerator, DRP (Dynamically Reconfigurable Processor)-AI3, boasting 10 TOPS/W (Tera Operations Per Second Per Watt) power efficiency and an AI inference performance of up to 15 TOPS through its advanced pruning (Note 1) technology. With the latest addition of the RZ/V2N, the RZ/V series has now expanded to cover a full range of markets, from the low-end RZ/V2L (0.5TOPS) to the high-end RZ/V2H (up to 80 TOPS).

The new MPU is significantly smaller than the RZ/V2H, with its package area measuring only 15 mm square, reducing the area required for mounting by 38%. Inheriting the advanced features of the RZ/V series, the RZ/V2N combines high AI performance with low power consumption. These optimised features suppress heat generation, eliminating the need for additional cooling fans and reducing the size and cost of embedded systems. Developers can easily implement vision AI in a wide range of applications, from AI cameras for traffic and congestion analysis in commercial facilities, industrial cameras for visual inspection on production lines, to driver monitoring systems for behaviour analysis.

Double-angle image processing with two cameras
Similar to the RZ/V2H, the new RZ/V2N is equipped with four best-in-class Arm Cortex-A55 CPU cores and a single Cortex-M33 core, coupled with a high-quality image signal processor (ISP), Arm Mali-C55. The RZ/V2N also has two channels of MIPI camera interfaces, which allow two cameras to be connected to capture double-angle images. The two-camera system significantly improves spatial recognition performance compared to a single camera system and enables more precise human motion line analysis and fall detection. Furthermore, the dual-camera system captures images from different locations, allowing a single chip to count cars in a parking lot and recognise license plates efficiently.

“Since launching the RZ/V2H last year to target next-generation robotics requiring vision AI and real-time control, we have received tremendous interest in using the Renesas DRP-AI accelerator,” said Daryl Khoo, VP of Embedded Processing at Renesas. “With the addition of the RZ/V2N, sharing the same lineage as the RZ/V2H, we are extending our reach to address mid-range applications, particularly endpoint vision AI that does not need to be realised with power hungry designs. I am excited that our customers will be able to select the best AI MPU from Renesas that meets their system and budget requirements.”

“Vision AI applications across markets including smart city, enterprise and industrial are broad and varied, but all demand sustained performance and efficient processing,” said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. “Renesas’ new RZ/V2N MPU leverages the leading-edge capabilities of the Arm compute platform to deliver against the performance and efficiency needs of next generation vision AI use cases.”

The RZ/V2N will be available with the Renesas evaluation board kit and a software development environment, along with various AI applications covering more than 50 use cases that are provided in the AI Applications and AI SDK (GitHub). The SDK assists users without in-depth AI knowledge to quickly evaluate and develop AI applications, shortening time to market. Additionally, partner companies will provide a SOM (system-on-module) board, SBC (single board computers), camera modules, and other products that incorporate the Renesas RZ/V2N. This reduces hardware design work, allowing developers to focus on AI application development and bring their products to market rapidly.

Renesas has developed the AI Camera Solution, which targets a variety of applications, including factories, public facilities, and commercial facilities. This solution consists of the RZ/V2N, power management IC, and real-time clock IC, and can be used as a reference for AI camera systems.

https://www.renesas.com/rzv2n

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Synaptics launches ultra-low-power Wi-Fi/Bluetooth SoC family for embedded Edge AI IoT

Synaptics has extended its Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for the embedded Edge AI Internet of Things (IoT), the SYN461x is optimised for power, system integration, size, and rapid time to market while delivering rate-over-range performance and seamless interoperability. The versatile Matter-compliant SoCs offer advanced Bluetooth features, such as Channel Sounding and LE Audio—including Auracast. The SYN461x specifically targets consumer and industrial applications and is tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, security cameras, asset trackers, and factory automation.

Launched in 2024, Veros encompasses Synaptics’ entire wireless portfolio of solutions characterised by performance, interoperability, coexistence, power efficiency, and bill of materials integration. Veros features built-in support for Synaptics Astra, the AI-Native compute platform for the IoT.

“The SYN461x family is a breakthrough addition to our Veros portfolio,” said Vineet Ganju, VP of Wireless Product Marketing at Synaptics. “The SoCs are our first in a series designed from the ground up for ULP embedded Edge AI IoT applications. We believe their low-power architecture, software support, and low-density packaging extend our broad-market reach and position us to share in a ~$3.2 billion market opportunity.

“The degree of versatility required to meet the unique connectivity needs of the diaspora of diverse low-power IoT applications demands a high degree of domain expertise,” said Phil Solis, Research Director at IDC. “Ultra-low-power and highly flexible solutions such as the SYN461x make a solid case for discrete, targeted, wireless SoCs in markets where more options are needed.”

The SYN461x family extends Synaptics’ Triple Combo series into ULP, highly optimised IoT applications where it delivers reliable connectivity of up to 50 Mbps while extending battery life and maximising range. Features include:

● Up to tri-band 1×1 Wi-Fi support across 2.4, 5, and 6 GHz with power-optimised architecture
● Low-power Bluetooth/BLE—with Channel Sounding for precise distance measurement
● IEEE 802.15.4 (Thread/Zigbee) with Matter support for seamless interoperability across popular low-power networks
● Integrated Tx/Rx switch, LNAs, and PAs that reduce area BOM and system cost while simplifying design by only requiring a direct antenna connection
● Low-pin-count WLBGA package option for low-cost, plated-through-hole (PTH) PCBs (25% reduction in typical board cost)
● An integrated processor that offloads the host application processor to help minimise system power consumption
● Secure Boot to help ensure system integrity

https://www.synaptics.com

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