Sector News

Arm-based SBC is robust and expandable for the IIoT

Thu, Aug 10, 2023

ASUS IoT has based the Tinker Board 3N single board computer (SBC) on the 64-bit, quad core Arm Rockchip RK3568 processor. The company said it is robust and ready for the industrial IoT (IIoT).

Built on the Arm v8 architecture, the Rockchip RK3568 is claimed to generate a GPU performance capable of seamless graphics processing with low power consumption. In-house test results shows that Tinker Board 3N delivers up to 17 per cent higher GPU performance and up to 31 per cent increased UX scores, encompassing data security, processing capabilities and image and video processing. According to ASUS IoT, the Tinker Board 3N is suitable for applications such as an IoT gateway, human machine interfacing (HMI) and factory automation.
The SBC also incorporates several mechanical design enhancements to facilitate embedded application use. For example, it features a low profile push pin heatsink and SoC placement on the back of the board. This adds strength and eases installation, said ASUS IoT with its diminutive NUC-scale dimensions allowing for use in SWaP-constrained deployments. The Tinker Board 3N is also engineered to operate smoothly in harsh industrial environments over a wide temperature range of  -40 to +85 degrees C to fulfill industrial automation needs.

Tinker Board 3N-series devices are equipped with PoE, LVDS, COM and CAN bus interfaces, and M.2 E and M.2 B slots to accommodate WiFi 5/6 and 4G/5G expansion modules for cloud computing. The onboard LVDS supports FHD output via dual channels, making it suitable for multiple display solutions. Embedded COM headers and CAN bus can be utilised in controllers and robotic arms, for example. 

The SBC also supports a variety of operating systems, catering to different development environment needs. Users can choose from Linux Debian, Yocto, and Android OS. The latest ASUS IoT SBC supports firmware over the air (FOTA) for both Android and Linux, ensuring regular software updates and system maintenance for efficient and optimal performance.

There are three Tinker Board 3N SBCs, the Tinker Board 3N PLUS, Tinker Board 3N and Tinker Board 3N LITE.

https://tinker-board.asus.com/product/tinker-board-3N.html

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Camera kit integrates THine imaging into AI and IoT

Wed, Aug 09, 2023

The THEIA-CAM 13Mpixel PDAF [phase detection autofocus] camera kit by THine Solutions is designed to interface to OLogic’s Pumpkin i350 and Pumpkin i500 evaluation kits. The kit consists of the THSCP101THEIA-CAM camera, which provides high resolution image streaming. The Pumpkin evaluation kits are based on MediaTek’s Genio 350 and Genio 500 SoC, providing edge processing platforms for AI and IoT systems.

The THSCP101 kit is based on THine’s THP7312-P image signal processor (ISP) and Sony’s IMX258 13MP CMOS PDAF image sensor. It includes all items required to interface with the Pumpkin evaluation kits, including a camera board in an acrylic case, a flat flexible cable, an adapter board to support two MIPI CSI-2 ports on the Pumpkin and an available software driver to stream and control images. 

The THEIA-CAM 13Mpixel PDAF camera kit’s optimised ISP firmware provides best in class image quality and quick autofocus using PDAF technology, said THine. The performance of each kit is repeatable ensuring it can be used in high volume production; the images parameters of each image sensor is characterised and calibrated to compensate for variation from sensor to sensor. 

All the Linux files and reference circuit schematics are available to customers. Customers requiring other image performance features can access a GUI-based software development tool that customises the ISP firmware. 

According to Thine, the THSCP101 accelerates MediaTek Genio platform customers’ time to market without expensive initial costs or additional effort for developing embedded camera systems.

Tak Iizuka, chief solution architect of THine Solutions, commented: “MediaTek customers can now just plug the THSCP101 to Pumpkin [evaluation kits] and then see the … image quality just in a few minutes.”

“It is quite a breakthrough for our solution offerings,” said Ted Larson, CEO of OLogic. “We saw many customers who struggled to integrate high resolution cameras. Despite many camera-related components available in the market, it was almost impossible for them to even perform decent colour tuning before going into production.”

Stéphane Le Provost, senior director of technology at MediaTek, added: “This kit makes it simpler for customers to include camera systems in their products without having to manage the long and expensive process of developing and producing them from scratch.”

The THSCP101 is available for purchase at OLogic’s online store and Digi-Key.

http://www.thinesolutions.com

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Radiometric thermal camera offers wider field of view

Wed, Aug 09, 2023

Believed to be the first radiometric thermal camera module with a 95 degree field of view, the Lepton 3.1R has 160 x 120 resolution and a scene dynamic range of up to 400 degrees C. Its wider field of view and scene temperature range enables people, fire and conditioning monitoring applications, said Teledyne FLIR.
The 3.1R model maintains the familiar compact and low power form factor of earlier Lepton thermal camera modules which are used in mobile, small electronics and uncrewed systems. The Lepton thermal micro camera module has been integrated into many devices, from ruggedised smartphones to drones. Mike Walters, vice president, product management at Teledyne FLIR, said: “Lepton 3.1R can now propel advancements in cost-saving and lifesaving unattended products ranging from early fire monitoring of critical machinery, electrical switchgear, and data centres to IoT products for smart factory, occupancy monitoring, smart homes, smart appliances, and even elderly care applications,” he said.
The Lepton 3.1R is a drop-in enhancement for existing Lepton-based products. It has the same visual object and space perception interface (VoSPI), inter-integrated circuit (I2C), and electrical and mechanical form and fit. It is claimed to have the lowest-cost focal plane array (FPA) -based thermal sensor on the market.
All Lepton modules include thermal sensitivity of less than 50mK for an uncooled micro thermal camera.
It also includes many proprietary technologies, including wafer-level detector packaging, wafer-scale microoptics, a custom ASIC and a low-cost, easy-to-integrate camera package. The Lepton family also includes integrated digital thermal image processing and radiometry, the ability to provide the temperature of every pixel in the scene.
To help reduce development costs and shorten time to market, users can take advantage of an online Lepton integration toolbox with application notes and source code for testing on Windows, Linux, Raspberry Pi and BeagleBone.
The Teledyne FLIR technical services team is available to support customers licensing MyFLIR application software and image-enhancing multi-spectral dynamic imaging (MSX) and Vivid-IR, helping customers reduce technical risk and maximise performance.

http://www.teledyne.com

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Embedded chip antennas are small and durable for the IoT

Tue, Aug 08, 2023

Surface mounted embedded antennas have been added to the antenna portfolio by Amphenol RF. The surface mounted chip antennas offer electrical performance up to 8.5GHz and support cellular 4G/5G-FR1 frequencies as well as Wi-Fi and Bluetooth / Bluetooth Low Energy (BLE) and LoRa, UWB and GNSS. 

The embedded RF antennas are compact and have a durable construction, making them suitable for IoT and smart devices.

By surface mounting the chip antenna directly on the PCB, with antenna ensure there is no need for external antennas. They are manufactured from ceramic or FR-4 materials and are omnidirectional. In addition, said Amphenol RF, they are easy to tune and available in tape and reel packaging. 

 The small size of ceramic chip antennas enables efficient integration into compact devices where space is at a premium. These antennas are well suited for smart utility meters, robotics, intelligent transport systems, set-top boxes and gateways, and mobile electronic wallets. 

Amphenol RF provides local technical support and matching of antennas. 

Amphenol RF manufactures coaxial connectors for use in radio frequency, microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has sales, marketing and manufacturing locations in North America, Asia and Europe.  Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions. 

https://www.amphenolrf.com

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