New functionality for EquipmentCloud and KontronGrid improves security and user experience

Kontron offers industrial software for cross-industry automation solutions through its subsidiary Kontron AIS GmbH. With the latest enhancements to the EquipmentCloud digital transformation solution and KontronGrid IoT device management solution, Kontron AIS offers machine builders and component manufacturers even more security, usability and flexibility.

Single sign-on (SSO) makes the login process much easier to use, and more secure. By linking to external identity providers such as Azure Active Directory, one click is all it takes for secure identification. By integrating multiple identity providers, both, the own employees and those of the system operators can be integrated. SSO can replace traditional login methods using a username and password in both desktop and mobile environments. Sensitive information such as passwords remains protected while administration is handled by the respective domain managers.

In addition, multi-factor authentication (MFA) can be made compulsory by administrators, further increasing the protection of sensitive information. The management of identities always remains in the hands of the local managers to provide a high level of security and control. Facing the prospects of growing cyber threats and legal requirements, Kontron AIS makes a decisive contribution to the secure operation of customer portals and IoT infrastructures.

Using the latest software version of EquipmentCloud, service managers can create custom reports in PDF format. Machine-related data such as master data and outstanding points can be integrated via an API so that customer-specific service processes, tickets and machine configurations can be easily documented. In addition, new CSS customisation features offer more freedom using design elements such as fonts, colours, and formatting. This means machine builders can promote their brand identity while maintaining full user-friendliness.

User statistics, which provide insights into user behaviour, are also new. Portal operators get answers to key questions: How many customers are active? How do KPIs evolve over time?

In addition, the new tracking function makes it easier to evaluate maintenance and machine care processes. Service managers can track and evaluate working hours, costs and spare parts used across systems. This creates transparency and enables more efficient invoicing.

KontronGrid, the IoT device management solution for edge devices, also offers new functionality. Docker Compose is now integrated to make it easy to configure complex Docker environments, including remote files. At the same time, a REST API for device management makes it possible to automate updates and device configurations. This enables companies to seamlessly integrate device management functions into external systems without using the graphical interface.

Further improvements have been made to the onboarding of edge devices: New devices can now be easily registered, configured and then assigned to hierarchies using the Universal ID manually or by scanning a QR code.

KontronGrid also offers the option of connecting IoT devices to machines. This gives machine manufacturers a clear overview of all their systems and the devices connected to them. Relationships can be analysed for each device group or device type, providing an important basis for predictive optimisations.

https://kontron-ais.com

> Read More

Renesas has announced ultra-low-power MCUs with capacitive touch, segment LCD and robust security

Renesas has introduced the RA4L1 microcontroller (MCU) group, including 14 new devices with ultra-low power consumption, advanced security features and segment LCD support. Based on an 80-MHz Arm Cortex M33 processor with TrustZone support, the new MCUs deliver a combination of performance features and power savings that enable designers to address a myriad of applications, including water meter, smart locks, IoT sensors and more.

The RA4L1 MCUs employ proprietary low-power technology that delivers 168 µA/MHz active mode @ 80 MHz and standby current of just 1.70 µA with all the SRAM retained. They also are available in very small packages including a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP), addressing the needs of products such as portable printers, digital cameras and smart labels.

The RA4L1 MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. The FSP eases migration of existing IP to and from either RA6 or RA2 Series devices.

Key Features of the RA4L1 MCUs

Core: 80 MHz Arm Cortex-M33 with TrustZone
Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash

Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, Low Power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, Low Power Timer, Real-Time Clock
Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100

Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash

Wide Ambient Temperature Range: Ta = -40º to +125º C for the QFN, QFP and CSP package options; Ta = -40º to +105º C for the BGA package option

Availability
The RA4L1 MCUs are available now, along with the FSP software. Renesas is also shipping an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK).

https://www.renesas.com

> Read More

NVIDIA Jetson Orin Nano “Super” now available on the Advantech EPC-R7300 Edge AI Box PC

Advantech has announced the release of its EPC-R7300 Orin Nano Super, an industrial embedded AI box PC featuring the NVIDIA Jetson Orin Nano 8GB system-on-module. Leveraging the powerful NVIDIA Jetson Orin platform, the EPC-R7300 delivers up to 67 TOPS of AI performance with ultra-low power consumption (25 watts). Its ultra-compact design (152×173×50 mm) and Ubuntu OS readiness facilitate seamless AI deployment, making it ideal for next-generation applications such as small Large Language Models (LLMs), Vision-Language Models (VLMs), and Vision Transformers (ViTs).

The EPC-R7300 Orin Nano Super, coupled with Jetpack 6.2, introduces advancements in AI performance, making it an ideal platform for deploying small LLMs, VLMs, and ViTs. With enhanced GPU, CPU, and memory capabilities, the Orin Nano Super efficiently supports models with fewer than 10 billion parameters, enabling tasks such as natural language understanding and generation directly on embedded devices. This capability supports diverse embedded applications such as conversational AI in robotics, voice interfaces for IoT, real-time translation, retail analytics, and industrial data and vision processing. By supporting small-scale LLMs, VLMs, and ViTs, the Jetson Orin Nano Super provides developers with a powerful, efficient, and privacy-focused solution, enabling real-time embedded intelligence across industries.

Advantech’s EPC-R7300 industrial-grade AI Box PC is engineered to meet the diverse computing needs of developers with its versatile I/O features, including RS-485, CAN bus, and multiple Ethernet ports. Supported by NVIDIA JetPack, the EPC-R7300 ensures a seamless migration from NVIDIA’s development ecosystem and simplifies integration by automatically enabling I/Os without requiring additional driver installations or configurations. For edge AI applications such as image inferencing, which demand high-quality camera inputs, the EPC-R7300 supports both USB and IP camera interfaces, making it ideal for vision-based systems. Additionally, it offers 4K resolution displays via its HDMI 2.0 port, while ensuring reliable data connectivity with 2 x GbE LAN ports. To expand functionality, the EPC-R7300 includes 2 x USB 3.2 Gen 1 ports, 3 x M.2 slots for wireless modules and storage expansion (1 x 2230 E-Key: Supports Wi-Fi 6 and Bluetooth, 1 x 3042/52 B-Key: Enables 4G/5G connectivity, 1 x 2280 M-Key: Comes pre-installed with a 128GB NVMe SSD, with additional expansion capability). With its robust features and ease of integration, the EPC-R7300 is a powerful and flexible solution for developers building next-generation edge AI systems.

The EPC-R7300 Orin Nano Super AI Box PC is engineered for durability in harsh industrial environments, supporting a wide operating temperature range (-20 ~ 60ºC / -4 ~ 140ºF), wide power input range (9 ~ 36 VDC), and high vibration tolerance (3.0 Grms). This rugged design enables users to quickly prototype field-side applications, streamlining the development process and minimising the time and resources required for system integration, verification, and transformation into a ready-to-use edge AI solution.

Designed to fulfil different application requirements in one kit, the EPC-R7300 provides up to 5 rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a 4-port GbE hub to enable system capacity expansion. The I/O peripheral drivers are all integrated into the board support package (BSP) with NVIDIA Jetpack 6.2, making the EPC-R7300 capable of delivering excellent functionality without additional integration work.
The EPC-R7300 with NVIDIA Jetson Orin Nano Super support will be available starting Q1 2025.

https://www.advantech.com

> Read More

u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments

u-blox has expanded its portfolio by introducing six new variants of the NORA-B2 Bluetooth Low Energy modules. Now integrating the entire range of Nordic Semiconductor’s next-level nRF54L Series of ultra-low power wireless Systems-on-Chip (SoCs), NORA-B2 offers a versatile solution for mass market segments thanks to its choices of antennas, architectures and chipsets.

The wireless modules combine ultra-lower power consumption and high processing efficiency, consuming up to 50% less current than previous-generation devices while doubling process capacity. They also security features, which makes them ideal for a wide range of IoT applications, such as smart home devices, industrial automation, or healthcare.

The entire NORA-B2 series comprises four variants that differ in memory sizes, design architectures and price levels to match almost any device manufacturer’s requirements.

• NORA-B20 features an ultra-low power nRF54L15 SoC with a 128 MHz Arm Cortex-M33, RISC-V co-processor, and 2.4 GHz multiprotocol radio. It includes 1.5 MB NVM and 256 KB RAM.
• NORA-B21, built on the nRF54L10 SoC, supports multiple wireless protocols (Bluetooth LE, Mesh, Thread, Matter, Zigbee, Amazon Sidewalk) with 1.0 MB NVM and 192 KB RAM.
• NORA-B22 is a cost-effective option with up to 31 GPIOs, 0.5 MB NVM, and 96 KB RAM.
• NORA-B26 is pre-flashed with u-blox u-connectXpress, enabling easy Bluetooth integration without prior expertise.

All NORA-B2 modules are designed for PSA Certified Level 3 security. They incorporate features such as secure boot and updates, tamper detection, and secure firmware over-the-air (FOTA) updates. These security measures ensure that IoT devices remain protected against any potential threats, safeguarding both data and functionality. NORA-B2 modules are also qualified against Bluetooth Core 6.0 that includes Channel Sounding, enabling endless cost-effective possibilities in tracking and locating use cases.

NORA-B2 variants either come with an antenna pin for connecting an external antenna of choice or are designed with a patented PCB antenna providing best-in-class RF performance. All module versions come with global certification allowing device manufacturers to launch their products worldwide with minimal effort.
Samples of NORA-B20 are now available. Early samples of NORA-B21 and NORA-B22 are available for evaluation in limited quantities. The pre-release version of u-connectXpress software for NORA-B26 is also available for early adopters.

https://www.u-blox.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration