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Infineon goes beyond standard Wi-Fi with lates AIROC device

Fri, Oct 27, 2023

The latest addition to Infineon Technologies’ AIROC portfolio is the Airoc CYW5551x. This single device combines Wi-Fi 6 / 6E performance and advanced Bluetooth connectivity, making it suitable for a host of IoT applications.

The AIROC CYW5551x Wi-Fi 6/6E and Bluetooth 5.4 family delivers secured, reliable 1×1 Wi-Fi 6 / 6E (802.11ax) connectivity that goes beyond the standard, said Infineon. This is combined with advanced low power Bluetooth connectivity. The optimised CYW55512 is a dual-band Wi-Fi 6 solution and the CYW55513 is a tri-band Wi-Fi 6 / 6E device. Both feature power-efficient designs that are suitable for use in smart homes, industrial applications, wearable devices and equipment and other small factor IoT applications, said the company.

“Infineon’s new CYW5551x family brings the range, reliability, and network robustness from our 2×2 Wi-Fi 6/6E CYW5557x family of devices to an IoT optimised family,” said Sivaram Trikutam, vice president of Wi-Fi Products of Infineon. “As part of the company’s digitalisation and decarbonisation strategy, this family is optimised for very low power consumption, making it ideal for battery-operated devices like wearables and IP cameras,” he said. They are also tuned for best performance across a wide temperature range, enabling them to serve industrial and infrastructure applications such as electric vehicle charging and solar panel controls, logistics.

The AIROC CYW551x family offers support for the 6GHz band for Wi-Fi 6E, delivering lower latency and reduced interference. Bluetooth 5.4 low energy (LE) with Audio is range and power optimised with up to 20dBm transmit power.

Other features include improved multi-layer security (PSA Level 1-certifiable) and design versatility supported by a wide ecosystem of module and platform partners.

The devices feature Linux, RTOS and Android support, and have a fully validated Bluetooth stack and sample code to accelerate development time.

Infineon’s AIROC CYW55512 and CYW55513 are sampling now. The CYW5512 will be commercially available in March 2024, and the CYW55513 will be commercially available in June 2024.

http://www.infineon.com

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Micro-thermal camera module adds wide angle to Lepton camera series

Tue, Oct 24, 2023

Claimed to be the world’s first micro-thermal camera module with a wide 160 degree field of view (FoV), the Lepton UW is small enough to fit on the tip of a finger. Introduced by Teledyne FLIR, part of Teledyne Technologies, the wide module can be used for fire detection, process monitoring, and people counting.

The Lepton UW features a usable 120 x 120 thermal resolution and a scene dynamic range of up to 400 degrees C. It also features thermal sensitivity of less than 50mK and the same integrated digital thermal image signal processing capabilities used in other Lepton microthermal camera modules.

“Offering the ultra-wide field of view in such a compact package will enable smart building system integrators to utilise thermal data within more affordable systems and simplify deployment,” said Mike Walters, vice president, product management, Teledyne FLIR. “Developers can also leverage the Teledyne FLIR
technical service team for assistance along with online resources – from source codes to licenses, to speed the development process,” he added.

For people counting, Lepton UW provides a dataset that is not susceptible to overcounting through glass while also maintaining personal privacy. When combined with building automation software, the Lepton UW can help facility managers better optimize and automate energy usage, occupant comfort, and workspace management, said Teledyne FLIR.

Integrators can leverage the online Lepton integration toolbox with application
notes and source code for testing on Windows, Linux, Raspberry Pi, and BeagleBone. The company’s technical services team is also available to support customer licensing of the MyFLIR application software, MSX, and Vivid-IR to maximise performance and reduce technical risk.

Founded in 1978, Teledyne FLIR, a Teledyne Technologies company, specialises in intelligent sensing solutions for defence and industrial applications.

Teledyne Technologies specialises in digital imaging products and software,
instrumentation, aerospace and defence electronics, and engineered systems. Teledyne’s operations are primarily located in the United States, the United Kingdom, Canada, and Western and Northern Europe.

http://www.teledyneflir.com

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Supermicro announces Nvidia MGX-based servers

Tue, Oct 24, 2023

Based on Nvidia’s GH200 Grace Hopper superchip, GPU systems by Supermicro is claimed to be one of the industry’s broadest portfolios of new GPU systems based on the Nvidia reference architecture, featuring the GH200 Grace Hopper and Grace CPU superchip.

The new modular architecture is designed to standardise AI infrastructure and accelerated computing in compact 1U and 2U form factors. It is also a flexible expansion option for current and future GPUs, DPUs, and CPUs. Supermicro’s liquid cooling technology enables very high density configurations, such as a 1U two-node configuration with two Nvidia GH200 Grace Hopper superchips integrated with a high speed interconnect.

“Charles Liang, president, and CEO of Supermicro, commented “By collaborating with Nvidia, we are helping accelerate time to market for enterprises to develop new AI-enabled applications, simplifying deployment and reducing environmental impact. The range of new servers incorporates the latest industry technology optimised for AI, including Nvidia GH200 Grace Hopper superchips, BlueField, and PCIe 5.0 EDSFF slots”.

Supermicro’s Nvidia MGX platforms are designed to deliver a range of servers that will accommodate future AI technologies. This new product line includes the air cooled ARS-111GL-NHR , with one Nvidia GH200 Grace Hopper superchip, the liquid cooled ARS-111GL-NHR-LCC, also with one GH200, the liquid cooled ARS-111GL-DHNR-LCC with two GH200 and two nodes, the ARS-121L-DNR, with two Grace CPU superchips in each of two nodes and a total of 288 cores, the 2U ARS-221GL-NR with one Grace CPU superchip and the SYS-221GE-NR, dual-socket 4th Gen Intel Xeon Scalable processors with up to four Nvidia H100 Tensor core or four Nvidia PCIe GPUs.

Every MGX platform can be enhanced with Nvidia BlueField-3 DPU and/or Nvidia ConnectX-7 interconnects for high-performance InfiniBand or Ethernet networking.

Supermicro’s 1U Nvidia MGX systems have up to two GH200 Grace Hopper superchips featuring two Nvidia H100 GPUs and two Grace CPUs. Each comes with 480Gbyte LPDDR5X memory for the CPU and 96Gbyte of HBM3 or 144Gbyte of HBM3e memory for the GPU. The memory-coherent, high bandwidth, low latency Nvidia-C2C interconnects the CPU, GPU, and memory at 900Gbytes per second which is seven times faster than PCIe 5.0, said Supermicro. The modular architecture provides multiple PCIe 5.0 x16 FHFL slots to accommodate DPUs for cloud and data management and expandability for additional GPUs, networking, and storage.

The 1U two-node design features two GH200 Grace Hopper superchips, combined with Supermicro’s proven direct-to-chip liquid cooling, which is claimed to reduce opex by more than 40 per cent, while increasing computing density and simplifying rack-scale deployment for large language model (LLM) clusters and HPC applications.

The 2U Supermicro Nvidia MGX platform supports both Nvidia Grace and x86 CPUs with up to four full-size data centre GPUs, such as the Nvidia H100 PCIe, H100 NVL, or L40S. It also provides three additional PCIe 5.0 x16 slots for I/O connectivity, and eight hot-swap EDSFF storage bays.

Supermicro offers Nvidia networking to secure and accelerate AI workloads on the MGX platform. This includes a combination of Nvidia BlueField-3 DPUs, which provide 2x 200Gbits per second connectivity for accelerating user-to-cloud and data storage access, and ConnectX-7 adapters, which provide up to 400Gbits per second InfiniBand or Ethernet connectivity between GPU servers.

Nvidia software includes AI Enterprise, enterprise-grade software that streamlines the development and deployment of production-ready generative AI, computer vision and speech AI, explained the company. The Nvidia HPC software development kit is designed for scientific computing.

Nvidia Grace superchip CPUs feature 144 cores and deliver up to twice the performance per Watt compared to today’s industry-standard x86 CPUs. Specific Supermicro Nvidia MGX systems can be configured with two nodes in 1U, totalling 288 cores on two Grace CPU Superchips to provide “ground-breaking compute densities and energy efficiency in hyperscale and edge data centres” said Supermicro.

http://www.supermicro.com

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Modular chassis is designed for large core networks

Tue, Oct 24, 2023

Alcatel-Lucent Enterprise introduces its OmniSwitch 9912, saying it is the latest high-capacity modular chassis in the OmniSwitch family.

It is designed to provide a robust foundation for high bandwidth autonomous networks and offers seamless integration with the existing OmniSwitch products to support large scale virtualised networks using modern and scalable fabric technologies such as shortest path bridging (SPB).

The OmniSwitch 9912 allows customers to protect their investment by future-proofing the core network build-out using a high-capacity switching fabric and high-density 100G line cards to meet bandwidth requirements. It has a range of port speeds from 1G to 100G and allows networks to be designed to last for years, while growing incrementally as requirements increase, said Alcatel-Lucent.

The OmniSwitch 9912 lets operators build a resilient network core with full redundancy and multiple connectivity options to create large campus networks. Alcatel-Lucent OmniSwitch 9912 with AOS 8.9R3 benefits include high-capacity, modular, flexible 12-slot chassis and high-bandwidth availability with port speeds from 1G to 100G with 51.2Tbits per second switching capacity.

“We are excited to announce the addition of the Alcatel-Lucent OmniSwitch 9912 into the OmniSwitch portfolio. This offering creates new opportunities across all regions and vertical markets for mid to large customers, helping them protect their existing investments with flexible solutions that allow them to grow as needed” says, Stephen Robineau, executive vice president, Network Business Division, Alcatel-Lucent Enterprise and president of ALE USA.

Alcatel-Lucent Enterprise delivers the customised technology to enterprises with digital-age networking, communications and cloud solutions with services tailored to ensure customers’ success, flexible business models in the cloud, on premises, and hybrid. All solutions have built-in security and limited environmental impact.

Alcatel-Lucent Enterprise’s headquarters are in France.

http://www.al-enterprise.com

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Infineon goes beyond standard Wi-Fi with lates AIROC device

Micro-thermal camera module adds wide angle to Lepton camera series

Supermicro announces Nvidia MGX-based servers

Modular chassis is designed for large core networks

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