Market leaders collaborate with Synopsys to realize gains of Generative AI

Synopsys aims to revolutionise the industry with generative AI capabilities, starting with Synopsys.ai Copilot, across the Synopsys.ai suite, building on its AI-driven optimisation and data analytics solutions.

Expansion of Synopsys.ai with generative AI capabilities will include collaborative, generative, and autonomous design to significantly boost productivity and accelerate innovation.

Synopsys have announced the expansion of its leading Synopsys.ai™ EDA suite, to bring the power of generative artificial intelligence (GenAI) across the full stack in order to dramatically improve engineering productivity for the semiconductor industry. This expands upon Synopsys’ recent announcement to deliver Synopsys.ai Copilot, the first in a series of GenAI capabilities for chip design.

The integration of GenAI across the Synopsys.ai suite will provide chip designers with collaborative capabilities that offer expert tool guidance; generative capabilities for RTL, verification, and other collateral creation; and autonomous capabilities for workflow creation from natural language. Synopsys is engaging early with leading chip makers including AMD, Intel, and Microsoft to leverage the value of GenAI across the Synopsys.ai full EDA stack, from design and verification to test and manufacturing.

“For 37 years, Synopsys has helped chipmakers solve their toughest design challenges and continues to be a catalyst for semiconductor progress,” said Shankar Krishnamoorthy, general manager, Synopsys EDA Group. “As the pioneer of AI-driven chip design, Synopsys is directly addressing engineering productivity during a period of talent shortages by expanding our leading Synopsys.ai suite to include generative AI capabilities across the full stack. This is an exciting time in the semiconductor industry and Synopsys continues to innovate relentlessly to enable the industry to meet stringent compute and performance-per-watt requirements of end markets.”

Synopsys is addressing the engineering productivity gap by delivering production-proven, AI-driven optimisation and data analytics capabilities across all stages of IC chip development. The Synopsys.ai EDA suite accelerates the chip design workflow by enabling companies to build more chips faster with a workforce that is not growing at the same pace as the industry demands.

https://www.synopsys.ai.

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Novocomms launches ‘game-changing’ L Band antenna.

Novocomms has unveiled NovoSat, a new lightweight dual port product with high performance GNSS capability and offering the full L Band frequency band for other devices.

Developed specifically for use within high density environments, urban canyons and extremely rugged terrains, the new antenna also performs well in poor weather conditions, thanks to its high gain, giving unrivalled performance quality and positional accuracy whilst supporting dual port operation. Designed at Novocomms’ global headquarters in Birmingham, the NovoSat antenna is mechanically rugged, jam resistant and custom manufactured in the UK to maintain product integrity and security.

Ideal for use in satellite phones or global satellite positioning systems, Novocomm’s new antenna weighs just 5g, much lighter than comparable products on the market, due to the innovative use of plastics within the manufacturing process. Traditionally, ceramics have been used in the manufacture of L Band antennas, making them heavier and more expensive than Novocomm’s latest model.

Commenting on the performance of the prototype, Sampson Hu, CEO and founder of Novocomms, said: “Our new NovoSat product really does represent the next generation of L Band antenna, out-performing the competition when it comes to frequency, gain, form factor, efficiency and even price. We’re very excited about the doors that this new product can open for electronic manufacturers working the fields of automotive, mobile devices, AUVs, wearables and also those innovating in the IoT. space.”

The company’s cutting-edge antenna technology is used in a wide range of wireless devices, including laptops, tablets and smartwatches. By offering smaller, more efficient antennas with better performance and lower power consumption, Novocomms is revolutionising the wireless communication industry.

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Microchip unveils new standard of enhanced code security with the PIC18-Q24 family of MCUs

More and more everyday items are connected to the cloud—from cellphones and vehicles to smart thermostats and home appliances. With this rise in connectivity, the need for advanced security measures at the chip level, protecting both firmware and data, is critical. To defend against current and ever-expanding security threats, Microchip has launched the PIC18-Q24 family of MCUs.

To counter the threat of maliciously reprogramming a device in an embedded system, PIC18-Q24 MCUs introduce the programming and debugging interface disable (PDID) feature. When enabled, this enhanced code protection feature is designed to lock out access to the programming/debugging interface and block unauthorised attempts to read, modify or erase firmware.

“System security is only as strong as its weakest link. Any programmable component can be vulnerable, and it is essential to implement enhanced protection features to prevent potential hacks,” said Greg Robinson, corporate vice president of Microchip’s 8-bit MCU business unit. “The PIC18-Q24 family of MCUs from Microchip are designed with advanced security in the forefront, to help customers combat threats at the system’s foundation.”

Because many secure systems often connect and communicate with a wide variety of sensors, memory chips and processors, the PIC18-Q24 MCUs feature Multi-Voltage I/O (MVIO). This feature eliminates the need for external level shifters and allows the MCUs to interface with digital inputs or outputs at different operating voltages. In addition to reducing board complexity and Bill of Material (BOM) cost, MVIO makes PIC18-Q24 MCUs especially well-suited as system management processors, performing monitoring and telemetry for a larger processor. These seemingly routine tasks are typically most vulnerable to potential hackers as they try to gain access to embedded systems.

The PIC18-Q24 family is also enabled with the option to have an immutable bootloader for applications that want a secure way to upgrade firmware.

https://www.microchip.com

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Snapdragon 7-Series mobile platform provides performance and power efficiency with First-in-Tier features

Qualcomm Technologies have announced the Snapdragon® 7 Gen 3 Mobile Platform to amplify immersive experiences and bring premium performance to consumers’ everyday life. The upgraded platform delivers across-the-board advancements to ignite on-device AI, fan-favorite mobile gaming, a creativity-charged camera and powerful 5G connectivity. The new platform is fully equipped to enable exciting new use-cases including up to 2.63GHz peak CPU speeds, over 50% faster GPU performance, and 60% improved AI performance per watt while still delivering incredible power efficiency.

“Intelligently designed to balance performance and power efficiency, the Snapdragon 7 Gen 3 Mobile Platform delivers a selection of premium experiences that are brand new to the Snapdragon 7-series,” said Christopher Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. “By working closely with our OEM partners, we’re able to help make the next generation of in-demand features, such as enhanced AI and extraordinary camera capabilities, more widely accessible to consumers.”

Snapdragon 7 Gen 3 will first be adopted by key OEMs including HONOR and vivo with the first device expected to be announced this month. For more information about Snapdragon 7 Gen 3 visit website and specification sheet.

About Qualcomm
Qualcomm is enabling a world where everyone and everything can be intelligently connected. Our one technology roadmap allows us to efficiently scale the technologies that launched the mobile revolution – including advanced connectivity, high-performance, low-power compute, on-device intelligence and more – to the next generation of connected smart devices across industries. Innovations from Qualcomm and our family of Snapdragon platforms will help enable cloud-edge convergence, transform industries, accelerate the digital economy, and revolutionise how we experience the world, for the greater good.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.

https://Qualcomm.com

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