BeagleBoard Wi-Fi 6 Bluetooth LE wireless modules now at Mouser

Mouser is now shipping the CC33 wireless modules from BeagleBoard. The BM3301 modules are high-performance 2.4GHz Wi-Fi® 6 and Bluetooth Low Energy 5.4 combo wireless modules for industrial IoT, automotive, smart home, consumer electronics, healthcare, and embedded systems applications.

The BeagleBoard CC33 wireless modules, available from Mouser, are powered by TI’s 10th-generation connectivity chip (CC3301), delivering application throughput of up to 50 Mbps and are designed for reliable performance in extreme conditions (-40°C to +85°C), making them ideal for diverse applications requiring robust wireless connectivity. There are two variants to this module: The BeagleMod BM3301-1313 is a 13mm × 13mm BGA module, footprint-compatible with the TI WL18xxMOD series for easy drop-in design upgrades. The BeagleMod BM3301-1216 is a 12mm × 16mm M.2 1216 LGA module that includes an IPEX Gen 4 connector, and a u.FL antenna connector to simplify board layout, with both featuring Wi-Fi 6, Bluetooth LE 5.4, and integrated 2.4 GHz PA for complete wireless solutions with up to +20.5 dBm output power.

Mouser also stocks the BeagleY-AI single-board computer (SBC), a low-cost, open-source, community-supported development platform in a familiar form factor compatible with other popular SBC accessories. It was developed to streamline the process of building smart human-machine interfaces (HMI), incorporating cameras and high-speed connectivity into a reliable embedded system. The BeagleY-AI SBC features a powerful 64-bit, quad-core A53 processor and numerous powerful AI accelerators paired with C7x DSPs capable of 4 TOPS (trillion-operations per second) combined (2 TOPS each), an integrated 50GFLOP GPU supporting up to three concurrent display outputs and modern connectivity with USB 3.1 and PCIe Gen 3. An onboard BeagleMod CC33 module (BM3301- 1313) provides Wi-Fi 6 and BLE 5.4 connectivity.

https://www.mouser.com

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Rutronik offers USB Type-C connectors from Molex for industrial and consumer applications

With USB Type-C connectors from Molex, Rutronik offers future-proof interface solutions for industrial and consumer electronics applications. The connectors support data rates of up to 40 Gbit/s (USB4), currents of up to 5.0 A and power delivery of up to 100 W – ideal for applications with high power requirements and limited space, such as portable medical devices, industrial electronics, AR / VR systems and smart home appliances.

Thanks to their compact design, IPX8-certified variants and high mechanical robustness (up to 10,000 mating cycles), the components are particularly suitable for applications where reliability and continuous operation are key. Various mounting options – including vertical, top and mid-mount versions – offer maximum design flexibility in a small space.

Benefits at a glance:
• USB4-compatible: data transfer rates up to 40 Gbit / s
• Power delivery capable: Up to 100 W charging power (5.0 A / 20 V)
• Metal-reinforced mating area for high mating cycles (up to 10,000 mating cycles)
• Mating force on PCB: 0
• Mating force: 5 to 20 N
• Unmating force: 8 to 20 N (1 to 30 cycles); 6 to 20 N (after 10,000 cycles)
• Sockets with liquid protection according to IPX8, thanks to LSR moulding (liquid silicone rubber) ·
• Variants with 6, 14, 16 or 24 contacts available

Application examples:
• Portable medical devices (e.g. glucose meters, inhalers)
• Smart home and (I)IoT components
• AR/VR end devices and wearables
• Industrial electronics, measuring and testing devices
• Cash register systems and projectors

https://www.rutronik.com/

 

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Integrated matching filters from ST now available for long-range wireless MCUs

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to simplify the development of IoT, smart-metering, and remote-monitoring applications.

The new MLPF-WL-01D3/02D3/04D3 ICs combine impedance matching and harmonic filtering on a single glass substrate to optimise the main radio’s RF performance, leveraging proprietary integrated passive device (IPD) technology. Precision engineered and housed in an ultra-compact package, the highly integrated devices ensure right-first-time design while saving development time, bill-of-materials costs, and board space.

Integrating antenna protection, the new devices substantially simplify the RF connection to the MCU. In addition to ensuring optimal performance, integrated matching and filtering also increases reliability and reduces overall cost by eliminating the need to combine multiple discrete components.

In total, there will be seven variants, letting designers optimise for radio operation in high-band (826-958MHz) or low-band (413-479MHz), high-power (16dBm/20dBm) or low-power (10dBm), and for 4-layer or 2-layer PCB designs. The non-conductive glass substrate ensures outstanding performance with minimal temperature drift, and the chip-scale package has extremely compact dimensions, measuring just 1.47mm x 1.87mm and 630µm high after reflow.

The long-range sub-GHz radio of ST’s STM32WL33 wireless MCUs can operate in either of the 413-479MHz and 826-958MHz license-free bands and with up to 20dBm output power where local regulations permit. With an Arm® Cortex®-M0+ core and selected peripherals also on-chip, the highly integrated wireless MCUs simplify the design of remote-monitoring equipment for smart city, smart agriculture, and smart industry. Applications include smart meters, and safety systems, asset-trackers, and proximity detection. A set of reference designs (STDES-WL3xxxx), pre-certified and fine-tuned for STM32WL33 MCUs, is also available.

https://www.st.com

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ST combines activity tracking and high-impact sensing in miniature AI-enabled sensor

ST has revealed an inertial measurement unit that combines sensors tuned for activity tracking and high-g impact measurement in a single, space-saving package. Devices equipped with this module can allow applications to fully reconstruct any event with high accuracy and so provide more features and superior user experiences. Now that it’s here, markets can expect powerful new capabilities to emerge in mobiles, wearables, and consumer medical products, as well as equipment for smart homes, smart industry, and smart driving.

The new LSM6DSV320X sensor is an industry first in a regular-sized module (3mm x 2.5mm) with embedded AI processing and continuous registration of movements and impacts. Leveraging ST’s sustained investment in micro-electromechanical systems (MEMS) design, the innovative dual-accelerometer device ensures high accuracy for activity tracking up to 16g and impact detection up to 320g.

The LSM6DSV320X extends the family of sensors that contain ST’s machine-learning core (MLC), the embedded AI processor that handles inference directly in the sensor to lower system power consumption and enhance application performance. It features two accelerometers, designed for coexistence and optimal performance using advanced techniques unique to ST. One of these accelerometers is optimised for best resolution in activity tracking, with maximum range of ±16g, while the other can measure up to ±320g to quantify severe shocks such as collisions or high-impact events.

By covering an extremely wide sensing range with uncompromised accuracy throughout, all in one tiny device, ST’s new AI MEMS sensor will let consumer and IoT devices provide even more features while retaining a stylish or wearable form factor. An activity tracker can provide performance monitoring within normal ranges, as well as measuring high impacts for safety in contact sports, adding value for consumers and professional/semi-pro athletes. Other consumer-market opportunities include gaming controllers, enhancing the user’s experience by detecting rapid movements and impacts, as well as smart tags for attaching to items and recording movement, vibrations, and shocks to ensure their safety, security, and integrity.

With its wide acceleration measurement range, ST’s sensor will also enable new generations of smart devices for sectors such as consumer healthcare and industrial safety. Potential applications include personal protection devices for workers in hazardous environments, assessing the severity of falls or impacts. Other uses include equipment for accurately assessing the health of structures such as buildings and bridges.

The sensor’s high integration simplifies product design and manufacture, enabling advanced monitors to enter their target markets. Designers can create slim, lightweight form factors that are easy to wear or attach to equipment.

https://www.st.com

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