Time-of-flight sensor from ST boosts ranging performance and power saving

ST has announced the latest-generation 8×8 multi-zone time-of-flight (ToF) ranging sensor that delivers a range of improvements including greater ambient-light immunity, lower power consumption, and enhanced optics.

ST’s direct-ToF sensors combine a 940nm vertical cavity surface emitting laser (VCSEL), a multi-zone SPAD (single-photon avalanche diode) detector array, and an optical system comprising filters and diffractive optical elements (DOE) in an all-in-one module that outperforms conventional micro lenses typically used with similar alternative sensors. The sensor projects a wide square field of view of 45° x 45° (65° diagonal) and receives reflected light to calculate the distance of objects up to 400cm away, across 64 independent zones, and up to 30 captures per second.

The new VL53L8CX boosts ranging performance with a new-generation VCSEL and advanced silicon-based meta-optics. Compared with the current VL53L5CX, the enhancements increase immunity to interference from ambient light, extending the sensor’s maximum range in daylight from 170cm to 285cm and reducing power consumption from 4.5mW to 1.6mW in low-power mode.

ST released the first multi-zone time-of-flight sensor with the VL53L5CX in 2021. By increasing performance, the new VL53L8CX now further extends the advantages of these sensors over alternatives with conventional optics, which have fewer native zones and lose sensitivity in the outer areas. Thanks to its true 8×8 multi-zone sensing, the VL53L8CX ensures uniform sensitivity and accurate ranging throughout the field of view, with superior range in ambient light.

When used for system activation and human presence detection, the VL53L8CX’s greater ambient-light immunity enables equipment to respond more consistently and quickly. As part of ST’s STGesture platform that also includes the STSW-IMG035 turnkey gesture-recognition software and Gesture EVK development tool, the new sensor delivers the precision needed for repeatable gesture-based interaction. In addition to motion gesture recognition, hand posture recognition is also possible leveraging the latest AI models available in the STM32ai-modelzoo on GitHub.

Moreover, the VL53L8CX provides increased accuracy for monitoring the contents of bins, containers, silos, and tanks, including liquid-level monitoring, in industrial bulk storage and warehousing. The superior accuracy can also enhance the performance of drinks machines such as coffee makers and beverage dispensers.

Mobile robots including autonomous vacuum cleaners can leverage the VL53L8CX to improve guidance capabilities like floor sensing, small object detection, collision avoidance, and cliff detection. Also, the synchronisation pin enables projectors and cameras to benefit from coordinated autofocus. There is also a motion indicator, an auto-stop feature that allows real-time actions, and the sensor is immune to cover-glass crosstalk beyond 60cm. Now supporting SPI connectivity, in addition to the 1MHz I2C interface, the new sensor handles host data transfers at up to 3MHz.

Designers can quickly evaluate the VL53L8CX and jump-start their projects taking advantage of the supporting ecosystem that includes the X-NUCLEO-53L8A1 expansion board and SATEL-VL53L8 breakout boards. The P-NUCLEO-53L8A1 pack is also available, which contains a STM32F401 Nucleo microcontroller board and X-NUCLEO-53L8A1 expansion board ready to power up and start exploring.

 

http://www.st.com/VL53L8CX

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Renesas launches cloud-based environment to accelerate automotive AI software development

Renesas has launched a new cloud-based development environment aimed at streamlining the software design process for automotive AI engineers. The new platform, AI Workbench, is an integrated virtual development environment that empowers automotive AI engineers to design, simulate and fine-tune their automotive software – all within the cloud.

With this environment, engineers can immediately begin designing automotive software by leveraging Microsoft Azure services including Azure Compute, IaaS services, Microsoft Entra ID and Azure Security. Instead of installing tools on a PC or obtaining an evaluation board, they can perform tasks such as performance evaluation, debugging and verification using simulation tools online. This approach aligns with the “Shift-Left” approach, which enables software creation and testing earlier in the design cycle, even before the actual hardware becomes available. For example, it is possible to start developing AI-enabled application software to support ADAS (Advanced Driver Assistance System) and autonomous driving for the upcoming fifth-generation R-Car System on Chip (SoC) prior to the availability of hardware samples. This environment will serve as a unified development platform for designing and testing Renesas’ scalable automotive SoCs and microcontrollers (MCUs), regardless of product type or application.

“Cloud-based development is a secure and cost-effective method to address the increasing complexities of today’s embedded projects. The collaboration between Renesas and Microsoft aims to tackle this challenge and accelerate the digital transformation of the automotive industry,” said Ulrich Homann, Corporate Vice President & Distinguished Architect, Cloud + AI, Microsoft. “With Renesas’ AI Workbench, developers can now efficiently build and test software for a myriad applications using Renesas SoCs in a cloud-based environment powered by Azure.”

The AI Workbench includes the following four functional blocks today. Renesas plans to enhance its offering in the future with additional features such as selected functionality or customisation options tailored to support various development processes.

Availability
The AI Workbench will be available in January 2024 in limited preview. Renesas plans to expand availability of the AI Workbench from Q2 2024 and build similar environments for other major cloud services in the future. Additionally, Renesas will consider integrating tools provided by partners of the R-Car Consortium into the cloud environment for improved efficiency. More information about the AI Workbench is available at: https://renesas.com/ai-workbench.

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Optimising automation with Axiomtek’s new GPU edge system

Axiomtek has unveiled the eBOX671B, a fanless edge computing system that offers optimal data transferring with 2.5GbE LAN ports, cellular 5G module, and Wi-Fi 6 module support for edge computing in industrial automation. With its compatibility with MXM 3.1 Type A GPU cards, the eBOX671B can effectively accommodate up to five display outputs, ensuring optimised performance for various display requirements. Designed to operate reliably in industrial environments, the IP40-rated embedded system features a wide operating temperature of -40°C to +65°C, 3 Grms vibration resistance, and a 9 to 36 VDC power input. The eBOX671B is well-suited for various industrial automation applications such as edge controllers, embedded controllers, machine vision, OT servers, robotics, and more.

The eBOX671B is powered by the 13th/12th gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (codename: Alder Lake S). The reliable eBOX671B comes with two 262-pin DDR5-4800 SO-DIMM slots with up to 64GB of system memory. Two 2.5” SATA HDD/SSD (RAID 0,1 supported) drive bays, one NVMe through M.2 Key M 2280 slot, and one mSATA are available for extensive storage needs. Up to five display outputs are enabled via two HDMI 1.4b, one DisplayPort 1.4a, and two DisplayPort 1.4a via an optional MXM module kit. The eBOX671B also offers great expansion interfaces with one full-size PCI Express Mini Card slot, one M.2 Key M 2280 socket for storage, one M.2 Key E 2230 socket for Wi-Fi 6E, and one M.2 Key B 3052 socket for 5G connectivity. Plus, one front-access SIM slot with cover (through M.2 Key B) and one internal SIM slot for PCIe Mini Card slot are available.

To achieve higher graphics performance, customers can install the MXM GPU onto the eBOX671B within the existing system footprint without increasing the system size, saving time, effort, and money. To optimise system performance and speed up deployment, the rugged eBOX671B can easily enhance its overall efficiency and effectiveness through an optional fan kit and a flexible I/O window supported by mPCIe modules. It is also equipped to facilitate high-speed NVMe storage, leading to a decrease in latency,” said Jason Kao, product manager of AIoT Division at Axiomtek. “Axiomtek’s eBOX671B continues the system design of the series so customers can easily upgrade. In addition, the eBOX671B utilises the Trusted Platform Module 2.0 (TPM 2.0) function onboard to ensure data and network security.”

The edge computing system is equipped with rich I/O interfaces, including two RS-232, two RS-232/422/485 with autoflow, four USB 3.2 Gen2 ports, two USB 3.2 Gen1 ports, three 2.5GbE LAN ports, and one GbE LAN port. Other interfaces include one remote power switch, one grounding screw, and five antenna openings. Besides, this powerful computing embedded system supports Windows 11 IoT, Windows 10 IoT, and Linux.

https://www.axiomtek.com

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Renesas delivers new RA8 MCU group targeting graphic display solutions and voice/vision multi-modal AI applications

Renesas has introduced the RA8D1 microcontroller (MCU) group. The RA8D1 group is the second in Renesas’ RA8 Series, the first MCUs based on the Arm Cortex-M85 processor. RA8D1 MCUs deliver breakthrough performance of over 6.39 CoreMark/MHz EEMBC’s CoreMark benchmark measures performance of MCUs and CPUs used in embedded systems. combined with ample memory, graphics and peripheral functions optimised to address diverse graphics display solutions, and Voice/Vision Multimodal AI requirements for a range of applications in building automation, home appliances, smart home, consumer, and medical market segments.

All RA8 Series MCUs take advantage of the high performance of the Arm Cortex-M85 processor and Arm’s Helium technology with a vector/SIMD instruction set extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations over the Cortex-M7 core. This added performance is ideal for graphics and neural network processing and can eliminate the need for a separate hardware accelerator in some applications. They also offer advanced security including Arm TrustZone technology, Renesas Security IP (RSIP-E51A), Secure Boot with first stage bootloader in immutable storage, Octal SPI interface with Decryption-on-the-fly (DOTF), and Pointer Authentication and Branch Target Identification (PACBTI) security extension.

The new RA8D1 devices include a high-resolution graphics LCD controller with parallel RGB and MIPI-DSI interfaces to LCD display panels, a 2D graphics drawing engine, a 16-bit camera interface (CEU), multiple external memory interfaces for storage of frame buffer and graphics assets, and 176 and 224 pin packages. This feature set is combined with professional quality graphics user interface software solutions from SEGGER emWin and Microsoft GUIX fully integrated into the Renesas Flexible Software Package (FSP). Renesas also provides support for open-source Light and Versatile Graphics Library (LVGL) and a robust network of graphics and AI ecosystem partners. A full-featured graphics evaluation kit with LCD panel and camera module rounds out the solution and provides a robust development platform for graphics applications including. industrial HMI, video doorbells, patient monitors, graphics calculators, security panels, printer display panels, and appliance displays.

“There is growing demand for high-quality displays to improve user experiences. The introduction of the RA8D1 MCUs showcases the design capabilities and market knowledge that have made Renesas the world leader in MCUs,” said Daryl Khoo, Vice President of the IoT Platform Division at Renesas. “These new devices take advantage of the unprecedented performance of the Cortex-M85 core and Helium technology to meet our customers increasing requirements for better display solutions and fast-growing vision AI implementations such as people and object detection, face recognition, image classification, and pose estimation.”

“Plumerai licenses highly accurate AI solutions to customers developing smart home cameras and IoT devices,” said Roeland Nusselder, CEO of Plumerai. “We have ported our Plumerai People Detection AI software to the new RA8D1 MCU that includes the powerful Arm Cortex-M85 CPU with Helium vector extensions. The RA8D1 speeds up our software by 6.5x compared to an Arm Cortex-M7 using Arm’s CMSIS-NN kernels. There’s a big demand for our AI solutions in home security, smart buildings, home appliances and retail. Using the RA8 MCUs from Renesas, we can now fulfil this demand.”

The new RA8D1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

The RA8D1 Group MCUs are available now, along with the FSP software. Renesas is also shipping the RA8D1 Evaluation Kit that includes example projects targeted at graphics applications. Various Renesas Ready ecosystem partners also provide production-ready solutions for the RA8D1 MCUs. Renesas welcomes other partners who would like to port their software solutions to take advantage of the Cortex-M85 core and Helium. Information on all these offerings is available at renesas.com/RA8D1. Samples and kits can be ordered either on the Renesas website or through distributors.

https://renesas.com/MCUs.

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