Temperature sensors boast ‘smallest five-channel’ model

Five 1.8V temperature sensors released by Microchip include what the company claims is the industry’s smallest five-channel temperature sensor with standard lead spacing.

The EMC181x temperature sensor family also introduces system temperature rate-of-change reporting, a feature that provides advanced warning on how the temperature of a system is fluctuating.

The temperature sensors enable designers to reduce power consumption and lower system voltage in applications such as the internet of things (IoT) and personal computing devices in which temperature measurement is central to functionality.

The ability to monitor temperature at multiple locations with a single, integrated temperature sensor reduces board complexity and simplifies design. The EMC181x temperature sensor family offers a variety of remote channels at 1.8V operation to fit different design needs, ranging from two to five channels. The family is suitable for applications migrating from 3.3V systems to lower voltage rails, such as battery-operated IoT applications, personal computing devices, field programmable gate arrays (FPGAs) and graphics processing units (GPUs). The EMC181x family is register- and voltage-compatible with Microchip’s popular 3.3V EMC14xx temperature sensors for migration to 1.8V. The three-channel sensor is available in an eight-pin 2.0 x 2.0mm footprint and the five-channel in a 10-pin 2.0 x 2.5mm footprint. The sensors can also reduce the number of devices needed for remote temperature monitoring.

The sensors can measure the system temperature rate-of-change, making the EMC181x devices the industry’s first to offer two-dimensional temperature sensing. As well as reporting on the regular temperature, 2D sensing notifies user of the rate of temperature change in a system and shares data that can help to better regulate applications.

The sensors are suitable for closed control loop systems and other applications that prioritise lower voltage rails. The system provides an early notification of rising or falling temperatures, protecting against potential system failure.

The ADM00773 evaluation board provides everything needed to demonstrate the 1.8V three-channel two-wire EMC1833 temperature sensor. The EMC181xx sensors evaluate programmable features such as rate-of-change, temperature alert limits and resistance error correction (REC), in addition to providing off-board temperature measurements and data logging. The evaluation board connects to a PC through a USB interface board and is supplied with the Microchip Thermal Management Software graphical user interface (GUI).

The five devices in the EMC181x family are all available today for sampling and volume production.

http://www.microchip.com

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Renesas Synergy delivers dev kit to speed LTE IoT connectivity

Hardware and software make up the Renesas Synergy AE-Cloud2 kit, which allows embedded developers to quickly evaluate cellular connectivity options and build low power wide area (LPWA) cellular internet of things (IoT) applications.

According to Renesas, the AE-Cloud2 kit, used with the new Synergy Software Package (SSP) version 1.5.0 simplifies connecting IoT sensor devices to enterprise cloud services using 4G/LTE Cat-M1 and Cat-NB1, also called NB-IoT, with backwards compatability to 2G/EGPRS cellular networks. The kit’s functionality is claimed to accelerate prototyping cellular-enabled IoT devices for asset tracking, retail and agriculture monitoring, smart cities/utilities, mobile healthcare, and industrial automation.

Each AE-Cloud2 hardware kit includes a Synergy S5D9 microcontroller baseboard, tri-mode cellular modem with cellular and GPS antennae, Wi-Fi, Ethernet, and a variety of sensors such as lighting, microphone, temperature, humidity, pressure, air quality, geomagnetic, accelerometer, and gyroscope.

For cellular access, developers insert a SIM card with a data plan purchased from a local cellular carrier. The hardware kit’s software allows developers to provision the kit to connect to a 4G/LTE IoT cellular network and their preferred cloud service provider. Users can visualise their sensor data on a customisable, password-protected dashboard.

The AE-Cloud2 hardware kit has passed global RF emissions tests for EMC performance. The kit also complies with global regulatory certifications for FCC, CE, RoHs, WEEE and Japan MIC. The optimised hardware/software saves developers months of design time and resources, says Renesas, as it allows them to create a scalable, energy efficient and secure end-to-end LPWA cellular IoT application that can be used anywhere in the world.

Renesas is demonstrating the AE-Cloud2 kit at Arm TechCon (17 and 18 October, 2018, San Jose Convention Center, booth 727).

The AE-Cloud2 kit is available now from Renesas Electronics’ distributors around the world. The SSP version 1.5.0 can be downloaded, free of charge,  from the company website.

http://renesassynergy.com/ae-cloud2

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Modules help to develop and run IoT applications in one day

Help for developers to get IoT applications connected and running in a day, with no software development necessary is provided by Silicon Labs’ Wireless Xpress Modules. They deliver Bluetooth and Wi-Fi connectivity with zero programming, says the company.

Silicon Labs’ Wireless Xpress includes certified Bluetooth 5 Low Energy and Wi-Fi modules, integrated protocol stacks and tools.

On-board wireless stacks are controlled through a high-level Xpress Command application programming interface (API) for set-up and control. Wireless Xpress devices require only modest resources from a host processor, says Silicon Labs, enabling developers to add wireless connectivity to any microcontroller.

By using Bluetooth and Wi-Fi Wireless Xpress, developers can move from product concept to prototyping in a matter of hours instead of weeks,” said Matt Johnson, senior vice president and general manager of IoT products at Silicon Labs. He continues to explain that as Wireless Xpress reduces the design learning curve without compromising Bluetooth or Wi-Fi functionality, developers will spend less time learning how to add wireless connectivity to IoT devices and more time designing innovative products and getting them to market in good time.

Bluetooth and Wi-Fi IoT products based on Wireless Xpress can be remotely managed and updated over the air (OTA) using native device management features. Using Silicon Labs’ Zentri device management service (DMS), end users can install and update firmware, view real-time device health metrics and adjust product settings through mobile apps.

To add Bluetooth or Wi-Fi connectivity to mobile applications, Wireless Xpress includes a mobile app software development kit (SDK) for Android and iOS. The mobile app framework comprises examples and libraries and offers simple communications and OTA APIs to accelerate app development and simplify wireless design for mobile platforms.

Silicon Labs’ Gecko OS is an intuitive IoT operating system to accelerate the development of market-ready connected products. The company says it plans to offer additional Gecko OS-based products and solutions.

http://www.silabs.com

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H-bridge motor driver IC meets demand for low voltage, high current drive

For DC brushed motors and stepping motors, the TC78H651FNG is a dual H-bridge driver IC announced by Toshiba Electronics Europe.

The TC78H651FNG delivers performance at a low voltage (down to 1.8V) and high current (up to 1.6A) for equipment powered by dry-cell batteries. It is suitable for motor applications such as cameras and compact printers using 3.7V lithium-ion batteries, toys and home appliances, smart meters, and electronic locks using two 1.5V dry batteries, and devices using 5V USB power supplies.

IoT advances and wireless technologies are driving demand for applications that can be remotely controlled by smartphones and tablets, in turn stimulating demand for battery-powered motor control, argues Toshiba. Existing H-bridge driver ICs use bipolar technology which is stable at low voltage. However, the associated high levels of current consumption shorten battery life and increase losses leading to reduced motor torque.

The TC78H651FNG uses Toshiba’s DMOS process that is suitable for low voltage drives to reduce losses and current consumption, ICC is around 0.6mA in operating mode and virtually zero when in standby mode, claims Toshiba. This achieves a longer battery life and stable low voltage operation. The reduced on resistance of 0.22 Ohm for the high and low sides combined reduces IC losses and improves torque in the motor, even when powered at 1.8V.

The device is housed in a 5.0 x 6.4mm, 0.65mm pitch TSSOP16 package and supports forward, reverse and stop rotation modes. Inbuilt error detection functions for over-current protection, thermal shutdown and under-voltage lockout all contribute to ensuring a safe system.

http://toshiba.semicon-storage.com

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