IoT

Farnell Demonstrates Full Range of Artificial Intelligence Products with New Technology Pages

Wed, Mar 13, 2019

Exclusive products including Smartedge Agile and Ultra96 make it easier than ever for users to build intelligence into their designs.

Farnell, the Development Distributor, announces the launch of a dedicated Artificial Intelligence (AI) online resource on the Farnell website. The new pages cover a variety of topics ranging from basic explanations of AI, and different types of AI applications, to descriptions of specific AI products including several ranges that are exclusive to Farnell.

Today, AI-driven analytics and real-time insights are helping industries transform their businesses in diverse sectors from logistics and healthcare to automotive and manufacturing. Farnell’s new AI technology pages will help customers to learn more about AI, explore unique AI-specific product ranges, and access support to choose the best solutions to meet their project requirements.

A key element of the Farnell AI offering is the AI Configurator: an interactive tool that allows engineers to quickly determine the most appropriate products and solutions for their AI projects. It identifies the various development boards, sensors and software that best meet the needs of the inputted application from a wide range of vendors. This enables users to select the most suitable products with confidence and obtain optimum results faster, speeding up development without the need for unnecessary and often time-consuming research.

In addition, new AI products that are exclusively from Farnell include:

  • • Smartedge Agile: Exclusive to Farnell, an end-to-end IoT solution to deliver AI and security at the edge. The Smartedge Agile device is a certified hardware solution embedded with a full software stack featuring edge intelligence.
  • • Ultra 96: Exclusive to Farnell, a platform to simplify machine learning, Ultra96 is an Arm-based Xilinx Zynq UltraScale MPSoc development board based on the Linaro 96 board specification.

“As AI technology is still at a relatively early stage in terms of its potential applications and market penetration, the scope is wide open for customers to explore various possibilities and develop new products and ideas”, says Cliff Ortmeyer, Global Head of Technology Product Marketing and Solutions Development at Farnell. “Our new AI technology pages will provide a valuable resource that users and developers can use as a starting point for their designs.”

AI technology pages and can be found on the Farnell website in EMEA, Newark website in the America and element14 website in Asia Pacific.

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Arrow Electronics has teamed up with Shiratech to create the Body Cam 1.0

Fri, Mar 08, 2019

Arrow Electronics has teamed up with Shiratech to create the Body Cam 1.0 and Icomox development platforms for image streaming and industrial condition monitoring, respectively. .

Body Cam 1.0 is a live-streaming open platform based on a quad-core Arm Cortex-A7 processor with built-in LTE modem based on a Quectel SC20 SoC.

It contains a fully integrated 13Mpixel camera module based on an ON Semiconductor sensor, wi-fi and Bluetooth 4.1 connectivity. GNSS satellite positioning is also included.

Context awareness comes from Analog Devices’ ADUX1020 multifunction photometric sensor with gesture and proximity detection and ADXL343BCCZ 10/13-bit accelerometer. External interfaces include a two-lane MIPI-CSI2 input for a rear-facing camera, micro USB port, analogue microphone input, and Micro SD and Micro SIM slots.

Body Cam 1.0 comes with a simple one-button camera control, plus on/off and audio-volume buttons, for rapid development of smart products for baby monitoring, security surveillance, emergency services, and independent living. It is housed in a plastic enclosure that attaches to clothing for field tests.

The Icomox (Intelligent Condition-Monitoring Box) low-power platform integrates vibration, magnetic-field, temperature and sound sensors for detecting faults in a variety of industrial equipment, assets, and structures.

The selection of integrated sensors includes Analog Devices’ ADXL356 low-power low-noise vibration sensor and ADT7410 16-bit -55 degrees C to +155 degrees C temperature sensor, as well as a magnetic-field sensor and Mems microphone.

Running on the Analog Devices ADuCM4050 application processor, and featuring Analog Devices’ LTC5800-IPM wireless transceiver, Icomox offers an open sensor-to-cloud platform that combines high-performance sensing, embedded software and analytics for early failure detection, and configurable warnings and event timestamping for each sensor.

The LTC5800-IPM is a complete 2.4 GHz, IEEE 802.15.4e SoC with embedded SmartMesh IP networking software for flexible connectivity and high network reliability in challenging RF conditions often encountered in tough industrial environments.

Icomox comes with on-board analytics software for early fault detection.

Optional Cloud applications allow access to other advanced analytics capabilities.

http://www.arrow.com

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STMicroelectronics and Virscient partner for vehicle connectivity

Thu, Feb 28, 2019

Wireless connectivity skills from Virscient are used in STMicroelectronics’  Telemaco3P automotive application processors for connected vehicles.

Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP). MTP is a development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. MTP enables the rapid prototyping and development of smart driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles, explains ST. Virscient brings wireless connectivity technologies and protocols for architecting connected car systems that rely on technologies such as GNSS (precise positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.

The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded hardware security module (HSM), an independent Arm Cortex-M3 subsystem, and a set of connectivity interfaces.

Telemaco3P SoC ensures a secure connection between the vehicle and the Cloud, explains ST. Its asymmetric multi-core architecture provides powerful application processors as well as an independent CAN control subsystem with optimised power management. Its ISO 26262 silicon design, its embedded Hardware Security Module, and automotive-grade qualification up to 105 degrees C ambient temperature allow for the implementation of a range of secure telematics applications supporting high-throughput wireless connectivity and over the air (OTA) firmware upgrades.

ST and Virscient will be exhibiting the Modular Telematics Platform within the ST Automotive Telematics Ecosystem at Embedded World. Visit ST in Hall 4A, stand 4A-138.

Semiconductor supplier, ST provides intelligent and energy-efficient products enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and IoT devices.

Virscient helps the world’s leading semiconductor and product companies get to market faster with quality wireless connectivity solutions for automotive, audio, IoT, and industrial markets. With deep expertise in secure wireless and connected systems, Virscient provides engineering services and intellectual property spanning a range of technologies such as Wi‑Fi, Bluetooth, 5G, GNSS, LoRa, Sigfox and IEEE 802.15.4.

http://www.st.com

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Development board helps developers connect for Cloud IoT Core

Mon, Feb 25, 2019

To help device manufacturers to develop secure IoT products, Microchip Technology introduces the PIC-IoT WG development board for Cloud IoT Core. PIC microcontrollers are used in a wide variety of products, from coffee makers to thermostats and irrigation systems yet as developers migrate next-generation PIC microcontroller-based applications to the cloud, they have to overcome complexities associated with communications protocols, security and hardware compatibility. To accelerate the development of these applications, Microchip has announced an IoT rapid development board for Google Cloud IoT Core that combines a low-power PIC microcontroller, CryptoAuthentication secure element IC and fully certified Wi-Fi network controller. According to Microchip, this provides a simple way to connect and secure PIC microcontroller-based applications, removing the added time, cost and security vulnerabilities that come with large software frameworks and real time operating systems (RTOS). Once connected, Google Cloud IoT Core provides powerful data and analytics to help designers make better, smarter products, explains Microchip.

Microchip Technology has an extended partnership with Google Cloud, which means that the PIC-IoT WG development board enables PIC microcontroller designers to easily add cloud connectivity to next generation products using a free online portal at www.PIC-IoT.com. Once connected, developers can use Microchip’s MPLAB Code Configurator (MCC) development tool to develop, debug and customise an application. The board combines smart, connected and secure devices to enable designers to create connected applications. It includes the eXtreme low-power PIC microcontroller with integrated core independent peripherals. Suitable for battery-operated, real-time sensing and control applications, the PIC24FJ128GA705 microcontroller employs the PIC architecture with added memory and advanced analogue integration explains Microchip. It is supported by the latest Core Independent Peripherals (CIPs) designed to handle complex applications with less code and decreased power consumption.

There are also secure element to protect the root of trust in hardware. The ATECC608A CryptoAuthentication device provides a trusted and protected identity for each device that can be securely authenticated. It is supplied pre-registered on Google Cloud IoT Core. For Wi-Fi connectivity to Google Cloud, the ATWINC1510 is an industrial-grade, fully certified IEEE 802.11 b/g/n IoT network controller that provides an easy connection to a microcontroller via an SPI, with the designer needing networking protocols expertise.

Google Cloud IoT Core provides a managed service that enables designers to easily and securely connect, manage and ingest data from devices at a global scale. The platform collects, processes and analyses data in real time to enable designers to improve operational efficiency in embedded designs.

The PIC-IoT WG development board is supported by the MPLAB X integrated development environment (IDE) and MCC rapid prototyping tool and is compatible with more than 450 MikroElektronika Click boards to expand sensors and actuator options.

http://www.microchip.com

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