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Infineon advances Edge AI computing on PSOC Edge with NVIDIA TAO toolkit integration

Wed, Mar 12, 2025

Microcontrollers (MCU) are at the heart of modern electronics, and integrating the latest AI development and deployment workflows at the edge poses a major challenge for developers. The combination of a high-performance MCU with NPU hardware acceleration and an advanced AI fine-tuning workflows will enable developers to accelerate the deployment of AI models in low-power MCUs: Infineon has today announced support for NVIDIA TAO models on the PSOC Edge MCU family.

Infineon’s PSOC Edge MCU family features Arm Cortex-M55 processors and Ethos-U55 microNPU and enhances energy-efficient machine learning capabilities at the edge. The combination of these versatile microcontrollers with the powerful NVIDIA TAO models and fine-tuning toolkit greatly simplifies the creation, customisation, optimisation, and deployment of high accuracy vision AI models.

“NVIDIA is a key player in the AI/ML space, so we and our lead customers engaged in vision, audio and voice applications are very excited about this effort,” said Steve Tateosian, Senior Vice President IoT Compute & Wireless at Infineon. “By integrating NVIDIA TAO in our PSOC Edge portfolio, we empower developers to create smarter and more efficient systems that work at the edge of the network and solve real-world challenges with speed and precision. This significantly speeds up time-to-market for ML enabled applications in industrial automation, medical, automotive, and smart IoT solutions.”

“NVIDIA TAO brings the latest advances in computer vision models and fine-tuning workflows to the far edge”, said Deepu Talla, Vice President of Robotics and Edge Computing at NVIDIA. “Infineon PSOC Edge’s integration of NVIDIA TAO greatly simplifies the development and deployment of customised AI across a range of devices.”

The integration of NVIDIA TAO features will become available for the entire PSOC Edge family along with a comprehensive development ecosystem, including tools, libraries, and documentation, to accelerate innovation and reduce time-to-market for AI-enabled applications.

https://www.infineon.com

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New module series from Panasonic equipped with Wi-Fi 6 from TI

Wed, Mar 12, 2025

Panasonic has announced their cost-effective Wi-Fi 6 & Bluetooth LE Combo module series PAN W602, based on the Texas Instruments (TI) SimpleLink WiFi CC3301 companion IC and CC3351 Companion IC.

The PAN W602 will be available in a single band (PAN W602-1) and dual-band variant (PAN W602-2) and will be equipped with an integrated antenna for easy hardware design and easy end-certification. Alternatively, Panasonic Industry also offers a variant with available bottom pad for applications that require an external antenna.
The module series is suitable for low-cost Wi-Fi 6 applications that require low data rates, for example inverters, medical devices, heat pumps, or EV chargers.

TI’s CC3301 and CC3351 devices stand out in particular with Wi-Fi 6 and Bluetooth LE 5.4 support at an affordable price. They feature robust security, including WPA3 and firmware authentication capabilities. The versatile architecture of these chipsets allows seamless integration with processors running Linux/Android or capable microcontrollers (MCU) running RTOS and networking stack, addressing a wide range of industrial and Internet of Things (IoT) applications that require affordable, secure and reliable wireless communication.

Tomislav Tipura, Product Manager at Panasonic Industry comments: “We are proud to continue our decade-long collaboration with Texas Instruments, and we are excited to introduce this new module series, built on their advanced CC3301 and CC3351 chipsets. This collaboration allows us to deliver high-performance solutions that meet the evolving needs of our customers at a competitive price point.”

“In today’s fast-paced IoT landscape, companies designing innovative Wi-Fi 6-enabled applications are focused on reducing time to market for new products while keeping costs low. The PAN W602 family of modules from Panasonic, based on our SimpleLink wireless products, are helping to meet this need, and expand the capabilities of Wi-Fi and cloud-based ecosystems. We look forward to seeing these modules further unlock the potential of our increasingly connected world.” adds Shmulik Elgavi, Product Line Manager, Wi-Fi Connectivity Solutions at Texas Instruments.

The PAN W602 Series Wi-Fi 6 and Bluetooth module will be certified for CE RED, FCC, ISED, MIC, and NZ/AUS. Samples are already available now and the start of mass production is scheduled for end of year 2025.

https://industry.panasonic.eu

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Taoglas expands TFM series of multi-band GNSS front-end modules

Tue, Mar 11, 2025

Taoglas has announced the expansion of its TFM series of multi-band GNSS front-end modules. Building upon the existing product range, the expanded series offers design engineers more options for simplifying and accelerating product development for high-precision GNSS applications.

TFM modules comprise a two-stage cascaded filter and low noise amplifier (LNA) topology encapsulated within a shielded, robust, compact, low-profile surface mount package. This design ensures streamlined integration with any multi-band antenna or GNSS receiver, acting as a bridge between the antenna and RF module to facilitate the addition of active electronics to GNSS designs.

The TFM series simplifies integration by combining impedance matching, filters, and low noise amplifiers (LNAs) into a single package. The integrated pre-filters attenuate out-of-band signals, while the LNAs ensure an optimal noise figure across the entire signal chain. Furthermore, high-gain architecture, featuring cascaded LNAs with pre-filters and optimised impedance matching, provides at least 25 dB gain to the GNSS receiver. The 1 dB compression points of the modules are -31 dBm or better, depending on the model and frequency. All TFM modules operate from a DC input voltage of 1.8 to 5.5 VDC, providing maximum design flexibility. The compact footprint and low-profile design, housed in a shielded, surface mount package measuring from 15 mm x 15 mm x 2.7 mm, conserves space without the need for external components.

“Using TFM modules typically saves designers at least six months of development time compared to designing active circuitry on the PCB themselves,” said Taoglas CEO, Dermot O’Shea. “It not only speeds things up and enables them to focus on the rest of their design, but because of our many years of experience designing such circuits for our own antennas, you know you are getting best in class and can be confident in the reliability and accuracy of your GNSS data.”

The expanded TFM series now includes:

TFM.100A – Multi-Band GNSS Front End Module covering L1+B1+G1/L2
TFM.100B – Multi-Band GNSS Front End Module covering L1+B1+G1/L5
TFM.110A – Multi-Band GNSS Front End Module covering L1/L2/L5
TFM.120A – Multi-Band GNSS Front End Module covering L1+B1+G1/L2/L5+L-band
TFM.112A – Multi-Band GNSS Front End Module covering L1+B1+G1/L2/L5+L-band
TFM.115A – Multi-Band GNSS Front End Module for Bands L1, B1, G1, L Band and L5

TFM modules are designed for high-precision, multi-band GNSS applications, including navigation, transportation, robotics, precision agriculture, and autonomous vehicles.

Evaluation boards for the TFM series are now available, allowing engineers to quickly integrate and test these high-performing GNSS modules in their product designs. https://www.taoglas.com/

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Synaptics launches ultra-low-power Wi-Fi/Bluetooth SoC family for embedded Edge AI IoT

Mon, Mar 10, 2025

Synaptics has extended its Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for the embedded Edge AI Internet of Things (IoT), the SYN461x is optimised for power, system integration, size, and rapid time to market while delivering rate-over-range performance and seamless interoperability. The versatile Matter-compliant SoCs offer advanced Bluetooth features, such as Channel Sounding and LE Audio—including Auracast. The SYN461x specifically targets consumer and industrial applications and is tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, security cameras, asset trackers, and factory automation.

Launched in 2024, Veros encompasses Synaptics’ entire wireless portfolio of solutions characterised by performance, interoperability, coexistence, power efficiency, and bill of materials integration. Veros features built-in support for Synaptics Astra, the AI-Native compute platform for the IoT.

“The SYN461x family is a breakthrough addition to our Veros portfolio,” said Vineet Ganju, VP of Wireless Product Marketing at Synaptics. “The SoCs are our first in a series designed from the ground up for ULP embedded Edge AI IoT applications. We believe their low-power architecture, software support, and low-density packaging extend our broad-market reach and position us to share in a ~$3.2 billion market opportunity.

“The degree of versatility required to meet the unique connectivity needs of the diaspora of diverse low-power IoT applications demands a high degree of domain expertise,” said Phil Solis, Research Director at IDC. “Ultra-low-power and highly flexible solutions such as the SYN461x make a solid case for discrete, targeted, wireless SoCs in markets where more options are needed.”

The SYN461x family extends Synaptics’ Triple Combo series into ULP, highly optimised IoT applications where it delivers reliable connectivity of up to 50 Mbps while extending battery life and maximising range. Features include:

● Up to tri-band 1×1 Wi-Fi support across 2.4, 5, and 6 GHz with power-optimised architecture
● Low-power Bluetooth/BLE—with Channel Sounding for precise distance measurement
● IEEE 802.15.4 (Thread/Zigbee) with Matter support for seamless interoperability across popular low-power networks
● Integrated Tx/Rx switch, LNAs, and PAs that reduce area BOM and system cost while simplifying design by only requiring a direct antenna connection
● Low-pin-count WLBGA package option for low-cost, plated-through-hole (PTH) PCBs (25% reduction in typical board cost)
● An integrated processor that offloads the host application processor to help minimise system power consumption
● Secure Boot to help ensure system integrity

https://www.synaptics.com

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Infineon advances Edge AI computing on PSOC Edge with NVIDIA TAO toolkit integration

New module series from Panasonic equipped with Wi-Fi 6 from TI

Taoglas expands TFM series of multi-band GNSS front-end modules

Synaptics launches ultra-low-power Wi-Fi/Bluetooth SoC family for embedded Edge AI IoT

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