IoT Archives - Page 385 of 453 - SmartCitiesElectronics.com

RS Components introduces compact IR temperature sensor for smart factories

Wed, Sep 25, 2019

Designed for space-sensitive factory maintenance, repair and operations (MRO) in smart manufacturing environments, the RS Pro infra red temperature sensor by RS Components is a low-cost non-contact voltage-output temperature sensor.

It has been designed to fit into tight spaces and show the measured temperature in- situ, so maintenance engineers do not have to return to the control room to check it.

The RS Pro infra red temperature sensor measures just 30mm deep and 31mm in diameter. It has a side-entry cable making it easy to mount in small spaces. The temperature is displayed on a built-in backlit OLED display, without the need for contact with the target surface. The sensor can be used where it is not possible to use contact probes, for example when the target is moving or inaccessible; it will fit between a wheel and the rim or hub of a disc brake.

The RS Pro infra red temperature sensor can measure surface temperatures from 0 to 1,000 degrees C to an accuracy of ±1.5 per cent of reading or ±1.5 degrees C, whichever is greater, and repeatability of ±0.5 per cent of reading or ±0.5 degrees C. Response time is just 250ms, allowing continuous monitoring by industrial process instrumentation via the DC voltage output.

The sensor provides simultaneous voltage and alarm outputs. The voltage output can be configured as 0 to 5V DC, 1.0 to 5V DC or 0 to 10V DC, with adjustable temperature range scaling, configured using built-in controls on the sensor. The open-collector alarm output offers adjustable temperature threshold and hysteresis.

The sensor is supplied set up to measure non-reflective surfaces such as paper, plastics, rubber, wood, tarmac, food, pharmaceuticals, organic materials and painted metal. To measure the temperature of reflective solid or liquid surfaces, the user can adjust emissivity settings between 0.20 and 1.00.

The RS PRO infra red temperature sensor is fitted with a 1m long cable, as standard. This can be extended using terminal blocks or connectors. An optional air purge collar helps keep the lens clean from smoke, fumes, dust, steam or other potential contaminants.

The device is IP65-rated.

https://uk.rs-online.com

> Read More

HBI+ PHY supports 2.5D interconnect for SoC partitioning

Wed, Sep 25, 2019

7nm high bandwidth interconnect (HBI+) PHY for die-to-die interconnects from eSilicon supports 2.5D applications such as silicon interposers and silicon bridges for system on chip (SoC) to chiplets and SoC partitioning.

The 7nm HBI+ physical interface (PHY) IP is available for license for customer designs. The hard IP block delivers a high-bandwidth, low-power and low-latency wide-parallel, clock-forwarded PHY interface for 2.5D applications including SoC to chiplets and SoC partitioning for complex sub-systems. Silicon interposer and silicon bridge technologies are supported, adds eSilicon.

The HBI+ PHY delivers a data rate of up to 4.0Gbits per second per pin. Flexible configurations include up to 80 receive and 80 transmit connections per channel and up to 24 channels per PHY, with one redundant lane per channel to improve production yields. The part also supports built-in self-test (BIST), internal loopback and external PHY-to-PHY link tests. It supports IEEE 1149.1 (JTAG) and 1149.6 (AC JTAG) boundary scan standards.

Hugh Durdan, vice president, strategy and products at eSilicon, said: “This new HBI+ PHY will help to enable a growing chiplet ecosystem that is supported by many new and innovative technologies.”

The earlier version of this PHY (HBI, 2.5 Gbits per second per pin) was used successfully on a customer ASIC at 14nm. eSilicon is currently in design with a major customer ASIC in 7nm using the HBI+ PHY.

eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Its ASIC-proven, differentiating IP includes configurable 7nm 56G/112G SerDes plus networking-optimised 16, 14 or 7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialised memory compilers and I/O libraries. The company’s neuASIC platform provides AI-specific IP and a modular design methodology to create adaptable, efficient artificial intelligence (AI) ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets.

http://www.esilicon.com

> Read More

Clock generators, buffers and PCIe clocks and buffers are AEC-Q100-qualified

Tue, Sep 24, 2019

To meet the demanding clocking needs of in-vehicle systems, Silicon Labs believes it now offers the industry’s broadest portfolio of automotive grade timing solutions, as it introduces AEC-Q100-qualified timing devices, the Si5332 any-frequency programmable clock generators, Si5225x PCIe Gen1/2/3/4/5 clocks, Si5325x PCIe buffers and Si5335x fanout clock buffers.

These timing devices help automotive OEMs and Tier 1 suppliers simplify clock tree design, reduce system points of failure, increase system reliability and optimise the performance of high-speed serial data transfer. The timing devices target automotive camera sub-systems, radar and lidar sensors, advanced driver assistance systems (ADAS), autonomous driving control units, driver monitoring cameras, infotainment systems, Ethernet switches, and GPS and 5G connectivity.

Rather than using more quartz-based components to satisfy a growing list of timing requirements, developers now have the option to simplify their clock tree designs and increase system reliability using the company’s automotive-grade low-jitter, any-frequency clock generators and buffers.

Quartz crystal and oscillator timing devices can be prone to shock and vibration failure as well as start-up issues, explains Silicon Labs. Clocking requirements increase in demand as automotive infotainment platforms continue to adopt new features and ADAS systems increase complexity and data acquisition rates.

Automotive in-vehicle applications require a higher operating temperature range (Automotive Grade 2, -40 to +105 degrees C) and qualification to AEC-Q100 automotive standards.

The Si5332 clock leverages Silicon Labs’ MultiSynth technology to provide any-frequency, any-output clock synthesis with more than 60 per cent lower jitter than competing automotive clocks, says the company. Supporting up to eight clock outputs, selectable signal formats per output clock (LVDS, LVPECL, HCSL, LVCMOS) and independent 1.8-3.3V VDDO, the Si5332 clock interfaces to a range of FPGAs, ASICs, Ethernet switches/PHYs, processors, GPUs, SoCs, and PCIe Gen1/2/3/4/5 and NVLink SerDes. Clock synthesis, clock distribution and format/level translation are consolidated on-chip, enabling optimised single-IC clock tree solutions for automotive designs.

The Si5332 clock generators and Si5335x clock buffers are configurable and customisable using Silicon Labs’ flexible ClockBuilder Pro software, enabling developers to create optimised solutions that exactly match specific clock tree requirements, with samples shipping in less than two weeks.

Samples and production quantities of automotive grade Si5332 clock generators, Si5225x PCIe clocks, Si5325x PCIe buffers and Si5335x clock buffers are available now in 32-QFN and 40-QFN package options.

Evaluation boards (EVBs) for automotive grade timing devices are also available. The EVBs work seamlessly with ClockBuilder Pro, enabling developers to quickly customize a device and evaluate performance.

http://www.silabs.com

> Read More

NFC tags can be used on metallic surfaces

Mon, Sep 23, 2019

Flexible, ferrite-based NFC inlays and tags in the Block On-Metal range by Smartrac Technology group are suitable for items with metallic surfaces need to be identified or interacted with.

The tags can be used on industrial, retail and business to consumer (B2C) applications where metallic surfaces need to be identified or interacted with.

The Block On-Metal tags combine an antenna design with a thin layer of flexible ferrite material, which isolates the magnetic field from the metal surface. Ferrite redirects the reader’s inductive field and prevents energy from being wasted as heat within the metallic surface.

They can be used for industrial, retail and consumer, asset management, brand protection, secure product authentication, and payment. They can also be used for the identification and provision of a digital identity to many items – from metallic components to spare parts, signs, tools, even machines and domestic items. The tags have a die cut size of 50 x 50mm (1.96 x 1.96-inches) for the standard tag. Block On-Metal tags are suitable for roll-to-roll manufacturing processes, which makes onward processing much easier and more cost-effective, and allows converters to overprint the inlays if required.

Block On-Metal tags are equipped with the newest member of NXP’s Slix product family, the ICode Slix2 IC. This chip complies with the NFC Forum Type 5 standard, is backwards-compatible to Slix and offers an increased user memory size. It also has NXP originality signature, increased speed for inventory management, and increased read range due to superior resistance to detuning effects. Additional notable features of the ICode Slix2 IC are flexible user memory segmentation with separate access conditions, a password-protected on-chip service cycle counter and a 2.5kbit user memory size.

Block On-Metal will become available in high volumes from Q4 2019.

Smartrac provides both ready-made and customised offerings. Its portfolio is used in an array of applications such as animal identification, automation, automotive, brand protection, customer experience, industry, library and media management, logistics, retail and supply chain management.

http://www.smartrac-group.com

> Read More

RS Components introduces compact IR temperature sensor for smart factories

HBI+ PHY supports 2.5D interconnect for SoC partitioning

Clock generators, buffers and PCIe clocks and buffers are AEC-Q100-qualified

NFC tags can be used on metallic surfaces

About Smart Cities