STMicroelectronics adds wireless support to smart meter chipset

The ST8500 smart-meter chipset from STMicroelectronics now integrates both RF and PLC communication. At this week’s European Utility Week 2019, ADD Grup, a European smart-metering, announces hybrid PLC/wireless products that contain the enhanced ST8500 chipset.

ST’s ST8500 powerline communication (PLC) chipset now enables smart meters to communicate through existing power cables or radio frequency (RF) waves, combining the strengths of both types of connection.

Where power lines may be too noisy for PLC, or where local regulations dictate, equipment makers can now implement wireless and PLC quickly and efficiently using the ST8500, explains ST. In addition, the built-in RF capability lets equipment designers leverage the ST8500’s feature integration and ease of use in smart devices such as gas and water smart meters, environmental monitors, lighting controllers, and industrial sensors.

By embedding support for RF Mesh at the physical (PHY) layer and in the data-link layer (media access control, MAC, and 6LoWPAN) firmware, the ST8500 allows developers to leverage the strengths of combined powerline and wireless mesh networking for communication between smart nodes and data collectors. Unlike simple point-to-point links, hybrid mesh networking interconnects nodes extensively to create more reliable and fault-tolerant connections and extend communication distances, adds ST.

“With wireless support now fully integrated in the ST8500 firmware, ST’s chipset . . . .[will] enhance network performance, reliability, capacity, and scalability for our innovative electricity meters,” said Ruslan Casico, head of sales and marketing at ADD Grup. “The hybrid PLC/wireless connectivity is credited for ADD Grup winning “important metering projects” in EMEA, Russia, and Asia.

Domenico Arrigo, general manager, industrial and power conversion, STMicroelectronics, added, “By supporting RF communication alongside the leading PLC protocols, our market-proven chipset enables smart city and industry infrastructures worldwide to deliver more of their potential for saving the planet’s resources and enhancing control and efficiency.”

ST will exhibit its ST8500 chipset and demonstrate smart-meter, smart-home and -building, and smart-infrastructure customer solutions at European Utility Week in Paris, France (12 to 14 November) Stand J160.

http://www.st.com

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Xilinx adds MPSoCs for ADAS and autonomous driving

The Xilinix Automotive (XA) Zynq UltraScale+ MPSoC 7EV and 11EG have been added to the company’s automotive portfolio. According to the company, the programmable capacity, performance and I/O capabilities enable high-speed, data aggregation, pre-processing, and distribution (DAPD) as well as compute acceleration for L2+ to L4 advanced driver assistance systems (ADAS) and autonomous driving applications.

The XA Zynq UltraScale+ MPSoC 7EV and 11EG offer over 650,000 programmable logic cells and nearly 3,000 DSP slices, representing a 2.5-fold increase compared with the previous largest device.

The XA 7EV contains a video codec unit for h.264/h.265 encode and decode; the XA 11EG includes 32 12.5Gbits per second transceivers and provides four PCIe Gen3x16 blocks. At the launch, Xilinx said the devices provide the performance required by carmakers, robotaxi developers and Tier-1 suppliers to perform power-efficient DAPD and compute acceleration that allows for scalable production deployments for autonomous driving vehicles.

The XA Zynq UltraScale+ MPSoC portfolio is qualified to AEC-Q100 and integrates both Xilinx programmable logic and a feature-rich 64-bit quad-core Arm Cortex-A53 and dual-core Arm Cortex-R5-based processing system that is certified to ASIL-C level in the low power domain. These characteristics and the high data throughput capability of the XA 7EV and XA 11EG accelerate the deployment of autonomous.

The XA 7EV and XA 11EG are available for order today.  Both are supported by Vitis and Vitis AI software.

Xilinx develops adaptive processing platforms that enable rapid innovation from the endpoint to the edge to the cloud. Xilinx invented the FPGA, hardware programmable SoCs, and the ACAP.

http://www.xilinx.com

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Low-latency PHY technology prepares for industry 4.0

Industrial Ethernet physical layer (PHY) products released by Analog Devices help manufacturers address industry 4.0 and smart factory communication challenges around data integration, synchronisation, edge connectivity, and system interoperability.

At SPS later this month, the company will be showcasing the ADIN1300 low-power, single port Ethernet transceiver. It has industry leading power and latency specifications, claims the company and is primarily designed for time-critical industrial Ethernet applications up to Gigabit speeds.

It has 10BASE-Te/100BASE-TX/1000BASE-T IEEE 802.3-compliant MII, RMII and RGMII MAC interfaces with 330mW consumption (1000BASE-T) and 290 nano second 1000BASE-T RGMII latency (receive and transmit). It complies to several EMC test standards, including IEC 61000-4-5 surge (±4kV), IEC 61000-4-2 ESD (±6kV contact discharge), IEC 61000-4-6 conducted immunity (10V) and EN55032 radiated emissions (Class A) and EN55032 conducted emissions (Class A). It is packaged in a 40-lead, 6.0 x 6.0mm LFCSP.

The ADIN1300 is designed to operate in harsh industrial conditions and over extended ambient temperature ranges, mirroring the trend for industrial automation to increasingly adopt the Ethernet and increase data rates.

ADIN1300 is the latest technology developed for the Analog Devices’ Chronous industrial Ethernet solutions. The Chronous portfolio includes the ADIN1200, a low-power single port 10/100 robust Ethernet PHY for real-time industrial Ethernet networks. Other products include a range of advanced industrial Ethernet technologies from real-time Ethernet switches, PHY transceivers and protocol processing to complete network interface products.

ADIN1300 targets industrial Ethernet applications as motion control, factory automation, building automation, test and measurement and the IIoT.

ADI will be exhibiting ADIN1300 and other ADI Chronous Ethernet portfolio solutions at SPS ( 26 to 28 November) in Nuremberg, Germany, Hall 5, 129.

http://www.analog.com

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Renesas and Altair bring best-in-class solutions to the cellular IoT market

Renesas Electronics, and Altair Semiconductor, jointly announced a partnership aimed at bringing ultra-small and ultra-low-power cellular IoT solutions to the global IoT market. Cellular IoT device makers will be able to use this combination of best-in-class solutions to create highly differentiated IoT products and services that offer much greater efficiencies and faster time to market. These integrated solutions will be delivered through Renesas’ sales channels, enabling cellular connectivity to all of its markets.

“We are delighted to collaborate with Altair to deliver the industry’s best cellular IoT solutions to the booming IoT market,” said Sailesh Chittipeddi, Executive Vice President and General Manager of Renesas’ IoT and Infrastructure Business Unit. “Our combined technical excellence and differentiated IP will allow us to design the smallest and lowest power multi-protocol cellular chip-to-cloud solution for Industrial IoT applications desired by our customers for their next-generation products.”

With billions of devices expected to be deployed by 2024, the IoT market demands products that operate seamlessly out of the box. Sensors, cameras, metering, tracking, and smart devices all rely on ultra-low power consumption, offering the potential for a sensor to operate in the field for 10 to 20 years without requiring any hardware maintenance.

“This collaboration makes Altair’s technology accessible to the full breadth of Renesas customers and partners ecosystem,” said Oded Melamed, CEO of Altair Semiconductor. “The Integration of Altair’s differentiated cellular IoT technology with Renesas’ industry-leading MCUs will make this great technology immediately accessible to the mass market of IoT devices and service providers.”

As a first step of this collaboration, Renesas and Altair plan to develop cellular IoT solutions with CAT-M and NB-IoT dual mode chipsets and technologies. They will also design a variety of development tools and software to further streamline the adoption of cellular IoT solutions for industrial and consumer applications. This partnership aims to achieve technical leadership in size reduction, power consumption, and IoT security.

Altair Semiconductor

Altair Semiconductor, a Sony Group Company, is a leading provider of Cellular IoT chipsets. The company’s flagship ALT1250 is the smallest and most highly integrated LTE CAT-M and NB-IoT chipset, featuring ultra-low power consumption, hardware-based security, and a carrier-grade integrated SIM (iUICC), all 5G ready.

Altair partners with leading global vendors, including G+D (Giesecke+Devrient), HERE Technologies, Murata, Sierra Wireless and WNC, to provide low-power and cost-efficient modules for a range of industrial and consumer IoT applications such as trackers, smart meters, wearables, and vehicle telematics. Altair’s chipsets have been commercially deployed on the world’s most advanced LTE networks, including AT&T, China Mobile, KDDI, SoftBank Corp., Verizon, and Vodafone.

For more information, visit www.altair-semi.com. Follow Altair on Twitter: @AltairSemi and LinkedIn: Altair Semiconductor

Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, home electronics, office automation, and information communication technology applications that help shape a limitless future. Learn more at renesas.com.

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