IoT

Harting snaps into Rinspeed concept car for power, data and signals

Fri, Jan 10, 2020

Swiss automotive manufacturer, Rinspeed is presenting its metroSnap concept vehicle at CES this week, and Harting has designed an interface that supplies the vehicle with power, data and signals.

The module helps the driver use the vehicle for a wide range of tasks. It is divided into the Skateboard, which serves as an optimised electric vehicle (EV), and the Pod, which can be switched to accommodate different tasks. Communication, signal transmission and the power supply must all work smoothly between these two elements. Connectivity is automatically established as soon as the Pod and the Skateboard are securely connected.

The two companies have partnered before, with a fast charger from Harting Automotive, Harting’s subsidiary which reported a sharp increase in demand for e-mobility solutions. The company leverages its decades of experience in the field of connection and transmission technology to develop and produce charging equipment for electric and plug-in hybrid vehicles (PHEVs).

In 2016, Harting’s Mica was integrated into Rinspeed’s Etos vehicle for autonomous emission and condition monitoring. In 2017, Harting its miniMICA to support Rinspeed’s Oasis car. The following year, Harting provided the fast-charging technology for the Snap and in 2019, the microSnap was charged using the fast-charging push.

http://www.harting.com

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NIR sensor saves power for mobile 3D optical sensing systems

Thu, Jan 09, 2020

3D optical sensing applications such as face recognition, payment authentication can operate at much lower power than alternative implementations, using the CGSS130, CMOS global shutter sensor (CGSS) near infra red (NIR) image sensor by ams.

The CGSS130 enables battery-powered devices to run for longer between charges while supporting sophisticated sensor functions.

According to ams, the CGSS130 sensor is four times more sensitive to NIR wavelengths than other image sensors on the market today, and detects reflections from very low power IR emitters in 3D sensing systems. It is the IR emitter that consumes most of the power in face recognition and other 3D sensing applications, says ams, which means using the CGSS130 sensor will enable manufacturers to extend battery runtime in mobile devices.

The 1.3Mpixel sensor also creates the opportunity to implement face recognition in wearable devices and in other products which are powered by a very small battery, or to enable a new range of applications beyond face recognition as the increased sensitivity extends the measurement range for the same power budget.

Following ams’ partnership with CMOS image sensor supplier, SmartSens Technology, the first 3D active stereo vision (ASV) reference design based on the CGSS130 was produced. The 1.3Mpixel stacked BSI sensor offers the highest quantum efficiency at 940nm, claims ams and, by supplying all main parts of the 3D system (illumination, receiver, software) it enables superior system performance with lower costs and a faster time to market.

The stacked BSI process used to fabricate the CGSS global shutter image sensors, results in a small footprint of 3.8 x 4.2mm. The sensor produces monochrome images with an effective pixel array of 1080 x 1280 at a maximum frame rate of 120 frames per second. The high frame rate and global shutter operation produce clean images free of blur or other motion artefacts, says ams.

The sensor also offers a high dynamic range (HDR) mode in which it achieves dynamic range of more than 100dB. It also implements advanced functions such as external triggering, windowing, and horizontal or vertical mirroring.

The CGSS130 is available for sampling.

ams is demonstrating the CGSS130 at CES, in the Venetian Tower, Suite 236 / 30th floor.

https://ams.com

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STM32 SoC connects smart devices to the IoT using LoRa

Thu, Jan 09, 2020

STM32 microcontroller IP and enhanced Semtech radio are integrated on a single chip, the STM32WLE5. STMicroelectronics claims that this is the first LoRa SoC available for connecting smart devices to the IoT using long-distance wireless connections.

The STM32WLE5 SoC lets product developers create devices such as remote environmental sensors, meters, trackers, and process controllers that help efficiently manage energy and resources, continues the company.

The STM32WLE5 has multiple combines the low-power STM32 microcontroller design with a LoRa-compliant radio in one single-die and easy-to-use device. It has multiple ST patents pending, namely for radio power management architecture, and ST’s LoRaWAN software for wireless network communications has passed all regional certifications for use worldwide.

The SoC is available in a 5.0 x 5.0mm UFBGA73 package. It is fully integrated into the STM32 ecosystem, including STM32Cube software support, as well as a LoRaWAN stack certified for all regions and available in source-code format.

The integrated radio is based on Semtech SX126x IP and engineered with dual high-power and low-power transmitter modes that cover the sub-1GHz unlicensed frequency range from 150 to 960MHz, ensuring compatibility with LoRa networks around the world and in all territories.

Sensitivity down to -148dBm and two embedded power amplifiers with up to 15dBm and up to 22dBm maximum transmit power are available in the same package to maximise RF range.

In addition to embedded LoRa modulation, the STM32WLE5 is also capable of (G)FSK, (G)MSK, and BPSK modulation, allowing alternative protocols including proprietary protocols. High RF performance with low power consumption ensures reliable wireless connectivity and which includes dynamic voltage scaling and ST’s adaptive real-time ART Accelerator for zero-wait execution from flash.

Flash options are 64, 128 and 256kbyte for a choice of optimal code and data storage density.

Users also benefit from the built-in cyber-security features of STM32L4 microcontrollers, including hardware public key accelerator (PKA), true random number generator (TRNG), sector protection against read/write operation (PCROP), and support for the latest cryptographic algorithms including RSA.

http://www.st.com

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Sensor does not need soldering or programming says TDK

Thu, Jan 09, 2020

For intelligent multi-sensor monitoring and remote data collection, SmartSense from TDK can be used in a diverse range of IoT applications outputs via Bluetooth Low Energy and wi-fi.

The sensor module can be used ‘out-of-the-box’ and with no need for soldering, programming or mechanical modifications, to deliver sensor data (both raw and intelligent) wirelessly in smart homes and appliances and wellness monitoring, says TDK.

SmartSense can be used in smart doors, robotic vacuums, asset monitoring, patient activity monitoring, HVAC filtering and air mouse monitoring. SmartSense integrates TDK’s IMU, magnetometer, pressure, temperature, and ultrasonic sensors with high-precision algorithms. The module also provides autonomous SD Card data logging for applications deriving value from large data volumes.

SmartSense integrates TDK’s inertia measurement unit (IMU), magnetometer, pressure, temperature, and ultrasonic sensors with high-precision algorithms. The list of algorithms will be expanded in the coming months, based on emerging market requirements, confirms TDK.

The module serves as a prototyping platform by enabling OEMs to gain application insights, signatures and environment variations. For example, a company manufacturing patient activity monitors needs both high-resolution and low-noise IMU data, as well as meaningful algorithmic information about patients’ gait, body posture and balance. SmartSense provides all this information, enabling OEMs to quickly prototype their products while working closely with TDK to get secure access to medical algorithms and IMUs.

TDK will demonstrate SmartSense at CES booth 11448 at CES, Central Hall (LVCC), Las Vegas Convention Center, 7 to 10 January 2020.

http://www.invensense.tdk.com/smartsense/

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