IoT

3D flash memory boosts capacity and adds design flexibility, says Kioxia

Mon, Feb 03, 2020

Kioxia Europe has developed its fifth-generation BiCS FLASH, three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Samples of the 512Gbit (64Gbyte) capacity devices with three-bit-per-cell (triple-level cell, TLC) technology, for specific applications will begin shipping Q1 2020.

The memory addresses a variety of applications, including traditional mobile devices, consumer and enterprise SSDs as well as emerging applications enabled by the new 5G networks, artificial intelligence and autonomous vehicles.

The process technology will be applied to larger capacity devices, such as 1Tbit (128Gbytes) TLC and 1.33Tbit four-bit-per-cell (quadruple-level cell, QLC) devices in due course, confirms Kioxia.

The company’s 112-layer stacking process technology combines with its circuit and manufacturing process technology to increase cell array density by approximately 20 per cent over the 96-layer stacking process. The technology reduces the cost per bit and increases the manufacturability of memory capacity per silicon wafer, adds Kioxia. It also improves interface speed by 50 per cent and offers higher programming performance and shorter read latency.

Fifth-generation BiCS FLASH was developed jointly with technology and manufacturing partner Western Digital Corporation. It will be manufactured at Kioxia’s Yokkaichi plant and the newly built Kitakami plant.

Kioxia Europe (formerly Toshiba Memory Europe) is the European subsidiary of Kioxia, a supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH 3D technology, Kioxia says it continues to pioneer memory solutions and services. The company’s 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, says Kioxia, including advanced smartphones, PCs, SSDs, automotive and data centres.

http://www.kioxia.com

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CommAgility and NXP collaborate to accelerate 5G New Radio

Mon, Feb 03, 2020

Wireless Telecom company, CommAgility has collaborated with NXP Semiconductors to develop the Layerscape Access LA12XX programmable baseband processors for 5G New Radio (NR) processing. The collaboration enables CommAgility to accelerate 5G hardware and software development and enhance the performance of its 5G platform, reports the company. It will use its 5G platform to create private and specialised network solutions based on NXP programmable baseband processors.

CommAgility is already implementing its 5G NR PHY and protocol stack software on the NXP processors, initially supporting sub-6GHz bands and mmWave frequencies. The software and processors available enable CommAgility to design and deploy a complete, optimised 5G software and hardware portfolio for access points, small cells and specialised networks, to be available this year.

Edward Young, VP and general manager at CommAgility, said that basing its 5G portfolio on NXP’s new family of baseband processors will “enable us to create cost-effective, power-efficient solutions with high data throughput”. He continued: “Our 4G software and hardware has already been deployed in a wide range of LTE applications from commercial to specialised networks and we look forward to continued growth with our new 5G New Radio product line.”

CommAgility is part of the Wireless Telecom Group company. It develops embedded signal processing and RF modules and LTE PHY/stack software, for 4G and 5G mobile network and related applications. CommAgility designs the latest DSP, FPGA and RF technologies into compact products based on industry standard architectures. CommAgility’s LTE software for mobile devices and wireless infrastructure includes physical layer and protocol stack for small cells, physical layer and protocol stack for terminals, an advanced scheduler for small cells, and IP development in the areas of advanced PHY algorithms in multi-core SDR platforms.

 Wireless Telecom Group consists of Boonton Electronics, CommAgility, Microlab and Noisecom. It designs and manufactures advanced RF and microwave components, modules, systems and instruments for the wireless, telecommunication, satellite, military, aerospace, semiconductor and medical industries. Wireless Telecom Group’s products include peak power meters, signal analysers, signal processing modules, LTE PHY and stack software, power splitters and combiners, GPS repeaters, public safety monitors, noise sources, and programmable noise generators. The company also supports the development, testing, and deployment of wireless technologies around the globe.

http://www.commagility.com

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Richardson RFPD offers NXP’s RF circuit library

Fri, Jan 31, 2020

A library of radio frequency (RF) power amplifier (PA) designs for 5G communication infrastructure, smart industrial applications and other markets is now available from Richardson RFPD, an Arrow Electronics company.

The distributor has announced immediate availability and full design support capabilities for a NXP Semiconductors’ library.

Users can browse multiple design ideas at once in the RF circuits’ library, including discrete RF transistor evaluation boards for ISM, FM radio and 3T MRI, and RF PA IC evaluation boards for 5G/mMIMO and ISM.

Products are available today.

Richardson RFPD, an Arrow Electronics company, specialises in the RF, wireless, IoT and power technologies markets. It includes many of the industry’s top radio frequency and power component suppliers in its linecard. From designing components to engineering complete solutions, Richardson RFPD’s design centres and technical sales team provide comprehensive support from prototype to production.

http://www.richardsonrfpd.com

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LoRa-based module is world’s smallest, claims Murata 

Thu, Jan 30, 2020

Measuring 10 x 8.0 x 1.6mm, the Type 1SJ module is the smallest LoRa-based module available today, claims Murata. It is suitable for a range of high-volume applications which require small size, long range, extended battery life, security and a competitive price point, advises the company.

It is based upon a second-generation Semtech SX1262 radio frequency IC (RFIC) and features an open STM32L0 microcontroller from STMicroelectronics, an RF switch, 192kbyte of flash memory and 20kbyte of RAM. The memory allows sufficient resources to be available for the application layers, says Murata. The module also houses a temperature-controlled crystal oscillator (TXCO) and multiple communication interfaces including UART, I2C, SPI, ADC, USB and general purpose I/Os.

The Type 1SJ module supports ISM bands from 868 to 916MHz, including those used in Europe, the USA, India, China and the Pacific Rim. To simplify customer supply chains, Murata uses a single part number globally for this device.

The module operates from a single supply rail (up to 3.9V DC) and incorporates several low power modes that allow the real time clock (RTC) to operate while drawing a typical current of just 1.3 microA. This enhanced current consumption allows devices based upon the module to operate for years from a single battery.

Pedro Pachuca, director of Wireless Products, Murata, believes that the module will “develop and expand . . . IoT solutions in a variety of industries, including asset tracking smart buildings and utilities”.

The open microcontroller allows the module to be easily flashed with code from trusted objects that ensure the flash memory is secure and encrypted. This protects the end system against the threat of malicious tampering. The resin mould package is rugged and allows the module to operate across the temperature range -40 to +85 degrees C.

The Type 1SJ LoRa-based module will help designers to develop solutions that meet the most demanding requirements, especially in, smart buildings, industrial and other IoT applications, says Murata.

Sample quantities of the Type 1SJ module and an evaluation kit are available now.

http://www.murata.com

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