Rohde & Schwarz introduces signalling tests for 5G NR in FR1 and FR2 mode

Signalling tests for FR1 and FR2 in non-standalone mode can now be performed with the R&S CMX500. To test 5G NR products which use a much higher bandwidth, and active antennae, over-the-air (OTA) measurements are necessary. Rohde & Schwarz has created a portfolio for 5G NR device testing, based on the CMX500 radio communication tester enabling non-standalone (NSA) and standalone (SA) signalling tests in both FR1 and FR2 frequency ranges.

To allow developers to test their mobile devices in 5G NR NSA and SA mode in line with 3GPP specifications, the test must accurately simulate both LTE and 5G NR networks. The CMX500 radio communication tester adds 5G capability to the company’s LTE test systems (CMW500 or CMWflexx), to allow testing from 2G to 5G on one platform. The extension box R&S CMX500 handles various FR1 and FR2, signalling and non-signalling as well as SA and NSA test scenarios, from R&D to certification testing, confirms Rohde & Schwarz.

A key functionality of the R&S CMX500 is signalling tests in FR2 with support for signalling tests in FR1. The tests performed in NSA mode feature both LTE and 5G connections. They verify LTE/5G signalling protocol behaviour, OTA RF/TX measurements, end-to-end data testing with LTE and 5G bearers as well as mmWave OTA signalling and RF measurements.

Signalling test in the new mmWave-based 5G frequency of FR2 requires an OTA test set up or environment. The test set up features the R&S ATS800R CATR rack- based antenna test system with OTA functionalities. Designed for FR2 R&D measurements, it optimises the available lab space by combining a, compact shielding chamber with T&M equipment in the same set up, to minimise footprint. The integrated reflector surface precision provides a sufficiently large quiet zone with high accuracy, says Rohde & Schwarz.

To control the 5G radio communication testers, the test set up includes the newly developed R&S CMsquares unified test software. This integrates the mobile network simulation with test configuration, parameterisation, real time measurements and test result management in a single environment for all relevant use cases from RF parametric testing over protocol analysis to data end-to-end throughput tests.

It provides easiest user guidance via dashboards and customisable workspaces which allow quick access to the various types of 5G measurements. It also has a built-in sequencer to run pre-configured 5G NR test scripts or to create 5G NR test scripts from scratch using a simple drag-and-drop workflow.

http://www.rohde-schwarz.com

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Simpleware ScanIP software enhances its machine learning operation

Synopsys introduces a machine learning (ML) -based auto segmentation module for 3D image processing in the Simpleware ScanIP software. The ML-based option speeds up operation by up to a factor of 20 to 50, says the company and precisely automates segmentation for medical device design and pre-surgical planning.

The new ScanIP software module, Simpleware AS Ortho, uses automated algorithms to shorten segmentation time and produce accurate results significantly faster for medical image data, says the company.

The ML-based auto segmentation module builds on Synopsys’ ScanIP software, a comprehensive solution for 3D image processing and segmenting images generated by computed tomography (CT) or magnetic resonance imaging (MRI) scanners.

The Simpleware AS Ortho module is specifically designed for segmentation needs in patients’ hips and knees. When applying this automated option with Synopsys’ ScanIP software to run analysis, users will easily see a 20 to 50 times faster rate of segmentation for clinical images, Synopsys reports.

The technology is scalable and helps to achieve more consistency and increased reliability in biomechanical compatibility. It can also dramatically streamline the workflow process in both pre-surgical planning and medical device design.

“Image segmentation of MRI and CT scans presents a significant challenge for our surgical and engineering multidisciplinary teams. We’re excited to collaborate with the Simpleware product group at Synopsys for solutions to this challenge,” said  Johann Henckel, MD orthopedic surgeon at the Royal National Orthopaedic Hospital, in the UK. “What is currently a laborious process that occupies significant engineering resources and time can now be completed quickly, accurately and with less variability, promising a scalable solution for generating high-fidelity patient specific models, surgical tools and bespoke implants,” he said.

“The demand for image-based modeling of human anatomy tools with ML-enabled intelligence is rapidly growing, especially in markets that include patient specific workflows for medical devices, surgical guides and planning, and in silico clinical trials,” said Terry Ma, vice president of engineering at Synopsys.

Synopsys’ Simpleware AS Ortho (Auto Segmenter for Orthopedics) launches in March 2020 as a Simpleware ScanIP software add-on module for hips and knees. Synopsys plans further modules to provide automated segmentation options for other anatomical regions. For users wanting any customisation or workflows applied to different anatomies, Synopsys’ Simpleware Custom Modeler option is also available as a tailored and automated software option.

http://www.synopsys.com

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Infineon and Qualcomm enable standard solution for 3D authentication

A reference design developed by Infineon Technologies, working with Qualcomm Technologies is for 3D authentication based on the Qualcomm Snapdragon 865 mobile platform.

The reference design uses the REAL3 3D time of flight (ToF) sensor and enables a standardised integration for smartphone manufacturers.

At CES 2020, Infineon introduced the 4.4 x 5.1mm ToF sensor, describing it as the world’s smallest yet most powerful 3D image sensor with VGA resolution. It can be used for face authentication, enhanced photo features and authentic augmented

Andreas Urschitz, division president power management and multimarket at Infineon, commented: “3D sensors enable new uses and additional applications such as secured authentication or payment by facial recognition. We continue to focus on this market and have clear growth targets”.

Infineon develops the 3D ToF sensor technology in co-operation with the software and 3D time-of-flight system specialist pmdtechnologies.

From this month, Infineon’s REAL3 ToF sensor will enable the video bokeh function for the first time in a 5G-capable smartphone for optimal image effects even in moving images. Using the precise 3D point cloud algorithm and software, the received 3D image data is processed for the application. The 3D image sensor captures 940nm infrared light reflected from the user and the scanned objects. It also uses high-level data processing to achieve accurate depth measurements. The patented SBI (Suppression of Background Illumination) technology offers a wide dynamic measuring range from bright sunlight to dimly lit rooms for robust operation without loss of data processing quality.

pmdtechnologies is a fabless IC company headquartered in Siegen, Dresden and Ulm with subsidiaries in the USA, China and Korea. It claims to be the leading 3D ToF CMOS-based digital imaging technology supplier. Founded in 2002, the company owns over 350 worldwide patents concerning pmd-based applications, the pmd measurement principle and its realisation. The company operates in industrial applications.

http://www.infineon.com

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Flat connectors withstand higher operating temperatures

Flat flexible cable/flat printed circuit (FFC/FPC) connectors from Hirose Electric can withstand higher operating temperatures than standard FFC/FPC connectors. The FH67 series withstand temperatures ranging from -55 to +125 degrees C. This heat resistance capability enables the connector to be used in harsh automotive environments.

The FH67 0.5mm pitch connectors are characterised by a single action lock and a vertical connection design. 

The robust FFC/FPC connectors’ one-action lock allows an FFC/FPC to be inserted into the connector without opening the actuator. This can be done with one hand or by automated machinery, says Hirose, saving valuable assembly time and reducing the rates of mating failure. Removing the connector is also easy and can be done by one hand or by robot.

The FH67 series is reliable with an independent two-point spring contact design, which includes a wiping element that reduces contact failure due to dust intrusion.

The ground contacts allow a shielded FFC to be used which prevents EMI. The FH67 series has a height of just 5.2mm, making it suitable for space-constrained design for use in automotive equipment, smart home devices, medical equipment and other portable devices.

Hirose Electric is a Japanese manufacturer of high-quality connectors. It was established in 1937 and uses advanced engineering services, customer service and worldwide manufacturing capabilities to provide technically advanced connector products for many industries including industrial, automotive, consumer, testing, broadcasting, and telecommunications.

Hirose established European offices over 30 years ago to compete internationally in Europe. In 2010, the European offices were merged together to form Hirose Electric Europe. The European headquarters is based in Amsterdam, The Netherlands. Other European branches are located in Germany, UK, France and Italy.

http://www.hirose.com/eu

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