Sensor hub DSP architecture makes sense of surroundings

Claimed to be the industry’s first high performance sensor hub DSP architecture, SensPro is configurable for parallel processing floating point and integer data types, as well as deep learning training and inferencing.

Ceva has designed it to handle the sensor processing and sensor fusion workloads for contextually-aware devices.

It addresses the need for specialised processors to efficiently handle the proliferation of different types of sensors that are required in smartphones, robotics, automotive, AR/VR headsets, voice assistants, smart home devices and for industrial and medical applications. These camera, radar, lidar, time of flight (ToF) sensors, microphones and inertial measurement units (IMUs) generate data types and bit-rates derived from imaging, sound, RF and motion, which can be used to create a full 3D contextually-aware device, says CEVA.

The SensPro architecture is built from the ground up to maximise performance per Watt for multi-sensor processing use cases. It combines high performance single and half precision floating-point maths required for high dynamic range signal processing, point cloud creation and deep neural network (DNN) training. It also has 8-bit and 16-bit parallel processing capacity for voice, imaging, DNN inference processing and simultaneous localisation and mapping (SLAM). SensPro incorporates the Ceva-BX scalar DSP, which offers a seamless migration path from single sensory system designs to multi-sensor, contextual-aware designs.

Dimitrios Damianos, technology and market analyst of the sensing division at Yole Développement (Yole) commented: “The proliferation of sensors in intelligent systems continues to increase, providing more precise modelling of the environment and context. Sensors are becoming smarter, and the goal is not to get more and more data from them, but higher quality of data especially in cases of environment/surround perception. . . .  where many sensors . . . must work together to make sense of their surroundings”.

Yohann Tschudi, technology & market analyst, computing and software, at Yole continued: “The challenge is to process and fuse different types of data from different types of sensors. Using a mix of scalar and vector processing, floating and fixed point math coupled with an advanced micro-architecture, SensPro offers system and SoC designers a unified processor architecture to address the needs of any contextually-aware multi-sensor device.”

SensPro uses a configurable eight-way VLIW architecture, allowing it to be easily tuned to address a range of applications. Its micro-architecture combines scalar and vector processing units and incorporates an advanced, deep pipeline enabling operating speeds of 1.6GHz at a 7nm process node.

A Ceva-BX2 scalar processor for control code execution has a 4.3 CoreMark/MHz score. It adopts a wide SIMD scalable processor architecture for parallel processing and is configurable for up to 1024 8×8 MACs, 256 16×16 MACs, dedicated 8×2 binary neural networks support, as well as 64 single precision and 128 half precision floating point MACs. This allows it to deliver 3TOPS for 8×8 networks inferencing, 20TOPS for binary neural networks inferencing, and 400GFLOPS for floating point arithmetic. Additionally, a memory architecture provides a bandwidth of 400Gbyte per second, four-way instruction cache, two-way vector data cache, DMA, and queue and buffer managers for offloading the DSP from data transactions.

Ceva also offers software and development tools, including an LLVM C/C++ compiler, Eclipse based integrated development environment (IDE), OpenVX API, software libraries for OpenCL, Ceva deep neural network (CDNN) graph compiler including the CDNN-Invite API for inclusion of custom AI engines, Ceva-CV imaging functions, Ceva-SLAM software development kit and vision libraries, ClearVox noise reduction, WhisPro speech recognition, MotionEngine sensor fusion, and the SenslinQ software framework.

Initially, SensPro DSPs will be available in three configurations:  SP250 (single vector unit with 256 8×8 MACs targeting imaging, vision, and sound centric applications), SP500F (single vector unit with 512 8×8 MACs and 64 single precision floating point MACs targeting SLAM applications) and SP1000 (dual vector units with 1024 8×8 MACs and binary networks support targeting AI applications).

The SensPro architecture and cores will be made available for general licensing from Q3 2020.

https://www.ceva-dsp.com

> Read More

IO-Link IC connects industry 4.0 devices

The CCE4503 is the latest member of the IO-Link family from Dialog Semiconductor.  It is the first to be launched by the company since it bought Creative Chips at the end of last year. The IC connects the smallest and most price-sensitive IO-Link device sensors and actuators for the industrial IoT (IIoT).

IO-Link is the first globally standardised, serial bi-directional point-to-point communication technology (IEC 61131-9) for an industrial automation network, providing data access to the cloud. It provides robust communications for the last stretch between sensors, actuators and any fieldbus within a network.

The CCE4503 is a robust device-side IO-Link-compliant transceiver that combines IO-Link standard communications with advanced protection circuitry and low power dissipation. It is packaged in a tiny DFN10 (3.0 x 3.0mm). Its size enables it to be used to add IO-Link connectivity to the most space-constricted industrial sensor and actuator devices, says Dialog.

“Industrial sensors and actuators are integrating more functionality in smaller form factors with greater demands for cloud connectivity,” said Dr Lutz Porombka, vice president of Dialog’s Industrial Mixed Signal business unit.

The CCE4503 is sampling now and is supported by a comprehensive set of development support tools, industry standard IO-Link software and a full-featured customer evaluation board.

https://www.dialog-semiconductor.com

> Read More

DRAM modules are designed for edge computing

The advent of 5G and the exponential growth of connected devices, mean that more data is generated and processed at the edge. To help businesses keep up with this quantity of data, Innodisk has introduced DDR4-3200 modules which are optimised for edge computing.

Gartner predicts that enterprise-generated data created and processed outside centralised data centres will reach 75 per cent by 2025, up from 10 per cent in 2018.

Edge computing requires high-performance memory modules optimised for processing enormous amounts of data quickly. The DDR4-3200 range of modules is available in a choice of form factors and capacities, namely 4Gbyte, 8Gbyte and 16Gbyte across SODIMM, UDIMM and RDIMM form factors including optional error code correction (ECC).

Innodisk says it is the first company to pack this level of performance into a 4Gbyte module.

Innodisk provides flash memory, DRAM modules and embedded peripheral products for industrial and enterprise applications.

https://www.innodisk.com

> Read More

Aetina integrates InnoAge to Jetson edge computing

World-leading out-band management for edge artificial intelligence (AI) devices, is claimed by Aetina as it unveils how it has integrated Innodisk’s InnoAge into its Jetson edge computing platform.

Management is critical in edge devices used in vertical applications, says Aetina.

It has integrated what is believed to be the industry’s first out-of-band management solid state device (SSD) InnoAge with the Aetina Jetson edge computing platform. The result reduces the cost of manually repairing the edge device and primarily reduces the downtime of the equipment, says Aetina, for convenient control of edge devices.

The integrated system effortlessly restarts and restored in the event of the edge device crashing, reports Aetina.

Its Jetson edge computing platform has a small form factor and low power consumption, making it suitable for embedded edge devices.

To maintain numerous edge devices, in-band management could be limited if an unpredictable issue occurs which makes it more expensive in terms of labour costs as well as possibly extending the downtime of edge devices.

InnoAge SSD equipped with an Azure Sphere chip can cut a separate space in the solid state hard disk and install a separate operating system. InnoAge connected with Azure Cloud and the system of the device can automatically be stored in the solid state hard disk. Once the operating system or software of the edge device crashes, the user can reset or restore the system of edge devices through the management platform on Azure Cloud. The real-time status of edge devices can also monitor the cloud management platform, which facilitates remote control and management of many edge devices.

Aetina says that the Azure Sphere provides the world’s premier data security ability, making the inference results of edge AI computing secure for uploading to the cloud database without security risks.

Aetina was founded in Taiwan in 2012. It provides support for general purpose graphics processing units (GPGPU) and Jetson edge AI computing solutions for embedded applications.

http://www.aetina.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration