Nvidia offers tools for data centre computing escalation

Following the acquisition of Mellonix, Nvidia is driving data centre changes as they become computing units. In what should have been a keynote at the company’s conference but which was altered to a virtual presentation due to the Covid-19 pandemic, CEO Jensen Huang introduced a GPU architecuture optimised for the new scale of data centre computing.

He announced the Nvidia A100 GPU, based on the Nvidia Ampere architecture, which is claimed to provide “the greatest generational performance leap” of Nvidia’s eight generations of GPUs. It is built for data analytics, scientific computing and cloud graphics, and is in full production and shipping to customers worldwide.

The A100 and the Nvidia Ampere architecture on which it is built, boosts performance by up to 20x over its predecessors. It is claimed to be the world’s largest 7nm processor with over 54bn transistors.

It also features third-generation Tensor Cores with TF32, a new math format that accelerates single-precision artificial intelligence (AI) training, and structural sparsity acceleration, an efficiency technique for AI maths. Another feature is multi-instance GPU (MIG), which allows a single A100 processor to be partitioned into up to seven independent GPUs, each with its own resources.

Also contributing to the increased performance is the third-generation NVLink technology, doubling high-speed connectivity between GPUs. The result is that A100 servers can act as one giant GPU, says Nvidia.

In the same announcement, Nvidia also announced a third generation of its Nvidia DGX AI system based on the A100. The Nvidia DGX A100 is believed to be the world’s first 5PetaFLOPS server. Each DGX A100 can be divided into as many as 56 applications, all running independently.

It allows a single server to either scale up to race through computationally intensive tasks such as AI training, or scale out, for AI deployment, or inference, Huang said.

The A100 will also be available for cloud and partner server makers as HGX A100.

A data centre powered by five DGX A100 systems for AI training and inference running on just 28kW can do the work of a typical data centre with 50 DGX-1 systems for AI training and 600 CPU systems consuming 630kW, Huang explained.

Another announcement was the next-generation DGX SuperPOD, powered by 140 DGX A100 systems and Mellanox networking technology. It offers 700PetaFLOPS of AI performance, the equivalent of one of the 20 fastest computers in the world.

The next-generation DGX SuperPOD delivers 700PetaFLOPS of AI performance.

http://www.nvidia.com

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Vicor’s latest ChiP-set addresses AI accelerator cards

Designed for high performance graphics processing units (GPUs), central processing units (CPUs) and application specific integrated circuit (ASIC) or XPU processors powered directly from 48V, the 4609 ChiP-set has been added to Vicor’s Power-on-Package portfolio.

A driver, MCD4609, and a pair of MCM4609 current multiplier modules supply up to 650A continuous and 1,200A peak. Vicor reports that the small footprint and low profile (45.7 x 8.6 x 3.2mm) enable the current multipliers to be placed close to the processor, enabling reduced power distribution network (PDN) losses and higher power system efficiency.

Powering GPU and Open Compute Project (OCP) accelerator module (OAM) artificial intelligent (AI) cards, the 4609 ChiP-set is in mass production and available on Vicor’s Hydra II evaluation board.    

The 4609 ChiP-set is part of Vicor’s Power-on-Package portfolio of Lateral Power Delivery (LPD) solutions.

Vicor has also revealed that its Vertical Power Delivery (VPD) will soon enable much higher current density. The VPD system delivers current from power converters vertically stacked under a processor through a capacitor network geared to a processor-specific pin-map. A Geared Current Multiplier (GCM) is a specialised VPD device, incorporating a gearbox capacitor network as a layer in the vertical stack. By supplying current directly under the processor and eliminating PDN losses, GCMs will soon facilitate current densities reaching up to 2A/mm2, says Vicor.

Vicor IP on the critical path to Power-on-Package LPD and VPD is claimed to enable unparalleled current density and efficient current delivery for advanced processors in applications including AI accelerator cards, AI high density clusters and high-speed networking.

Vicor designs, develops, manufactures and markets modular power components and complete power systems based on a portfolio of patented technologies.

The company is headquartered in Andover, Massachusetts, USA and sells its products to the power systems market, including enterprise and high-performance computing, industrial equipment and automation, telecommunications and network infrastructure, vehicles and transportation, aerospace and defence.

http://www.vicorpower.com

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Signal conditioner IC targets industry 4.0, medical and IoT sensor applications

The latest addition to the sensor signal conditioner (SSC) range is the ZSSC3240. According to Renesas, it delivers high accuracy, sensitivity, and flexibility for sensor applications such as resistive pressure sensors and medical infra red thermometers. It is also claimed to deliver best-in-class performance and speed with up to 24 bits analogue to digital conversion (ADC) resolution.

The ZSSC3240 has a flexible sensor front end and a range of output interfaces, enabling the SSC to be used for nearly all types of resistive and absolute voltage sensor elements. Engineers can develop complete sensing platforms from a single SSC device, said Renesas. It is also small in size, for use in a variety of sensor-based devices for the industrial, consumer, and medical markets, including smart meters, continuous smart health monitors, factory automation devices, industrial pressure transmitters, HVAC sensors and weight scales.

Unlike micro-machined and silicon-based sensing elements which provide mostly non-linear and very small signals, which need to be converted into a linearised output, the ZSSC3240 SSC provides programmable, wide gain and quantisation functions, combined with powerful, high-order digital correction and linearisation algorithms, explained Renesas. High performance, and flexible sensor front end configuration and analogue output options enable sensor platform design using a single IC, allowing users to leverage the SSC cost effectively for a wide variety of sensor elements that have different characteristics.

The ZSSC3240 SSC has a high-gain analogue front end supporting up to 540V per Volt (V/V) and an integrated 26bit DSP for high-precision sensor calibration. Current loop output is 4.0 to 20 mA.

The ZSSC3240 SSC is available now in a 4.0 x 4.0mm, 24-lead QFN package. The SSC is also available in bare die format.

 http://www.renesas.com

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Foxconn, Socionext and Hailo collaborate for edge video analytics

Smart manufacturing specialist, Foxconn, video and imaging SoC company, Socionext and artificial intelligence (AI) chip manufacturer, Hailo, have partnered to introduce Boxiedge AI edge computing for energy-efficient, standalone, AI inference nodes.

Foxconn’s high-density, fanless Boxiedge edge computer is combined with Socionext’s SynQuacer SC2A11, high-efficiency parallel processor and the Hailo-8 deep learning processor. According to the trio, the combination provides market-leading energy efficiency for standalone AI inference nodes, in smart cities, smart medical, smart retail applications and the industrial IoT.

It is designed to address the need for cost-effective multi-processing capabilities required in video analytics, image classifications and object segmentation in these compute-intensive applications. The robust, Boxiedge AI edge computing product is capable of processing and analysing over 20 streaming camera input feeds in real-time, at the edge. The result is a high-density, low-power, local video management system (VMS) server, ensuring top performance for video analytics and privacy, including image classification, detection, pose estimation, and various other AI-powered applications – all in real time.

Hailo’s specialised Hailo-8 deep learning processor features up to 26 Tera operations per second (TOPS). Its architecture enables edge devices to run sophisticated deep learning applications that could previously only run on the cloud. Its structure translates into higher performance, lower power and minimal latency, enabling enhanced privacy and better reliability for smart devices operating at the edge, said the company.

Gene Liu, VP of semiconductor sub group at Foxconn Technology, said: “We recognise the great potential in adopting AI solutions for a multitude of applications, such as tumor detection and robotic navigation. . . our edge computing solution combined with Hailo’s deep learning processor will create even better energy efficiency for standalone AI inference nodes to positively impact rapidly evolving [market] sectors.”

“We are very pleased with this joint effort by the companies, and to officially announce our strategic partnership with Hailo,” said Noriaki Kubo, executive VP at Socionext. “This collaboration will lead to more innovative solutions that specifically address the growing demand from our AI customers in multiple sectors. We are confident that this product will enable endpoint devices to operate with better performance, lower power, more flexibility, and minimal latency.”

The next generation of the Boxiedge AI computing is equipped with applications for a broader market relying on low latency, a high data rate, high reliability and quick processing at the edge. Smart retail and smart cities, for instance, require hundreds of cameras – either in-store or in traffic monitoring – to generate video streams that need to be processed locally, quickly, and efficiently with minimal latency.

Similarly, for industrial IoT, data acquiring, processing, inferencing, and presenting on the production floor rather than in the cloud translates into significant cost savings along with more efficient processing for tasks such as inspection and quality assurance.

http://www.socionext.com

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