Renesas unveils powerful single-chip MPU for next-gen robotics

Renesas Electronics Corporation, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications, the RZ/V2H enables both vision AI and real-time control capabilities.

The device comes with a new generation of Renesas proprietary AI accelerator, DRP (Dynamically Reconfigurable Processor)-AI3, delivering 10 TOPS/W power efficiency, a 10-fold improvement over previous models. Additionally, pruning technology employed in the DRP-AI3 accelerator significantly improves AI computing efficiency, boosting AI inference performance up to 80 TOPS. This performance boost allows engineers to process vision AI applications directly at edge AI devices without relying on cloud computing platforms.

The RZ/V2H incorporates four Arm Cortex-A55 CPU cores with a maximum operating frequency of 1.8 GHz for Linux application processing, two Cortex-R8 cores running at 800 MHz for high-performance real-time processing, and one Cortex-M33 as a sub core. By integrating these cores into a single chip, the device can effectively manage both vision AI and real-time control tasks, making it ideal for demanding robotics applications of the future. Since the RZ/V2H consumes less power, it eliminates the need for cooling fans and other heat-dissipating components. This means engineers can design systems that are smaller in size, less expensive, and more reliable.

Renesas has applied its proprietary DRP technology to develop the OpenCV Accelerator that speeds up the processing of OpenCV, an open-source industry standard library for computer vision processing. The resulting speed improvement is up to 16 times faster compared to CPU processing. The combination of the DRP-AI3 and the OpenCV Accelerator enhances both AI computing and image processing algorithms, enabling the power-efficient, real-time execution of Visual SLAM used in applications such as robot vacuum cleaners.

To accelerate development, Renesas also released AI Applications, a library of pre-trained models for various use cases, and the AI SDK (Software Development Kit) for rapid development of AI applications. By running these software on the RZ/V2H’s evaluation board, engineers can evaluate AI applications easily and earlier in the design process, even if they do not have extensive knowledge of AI.

https://www.renesas.com/rzv2h

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Nexperia broadens its range of discrete FET solutions at APEC 2024

Nexperia bringing its product innovations to APEC and has announced the release of several new MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets. This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance.

PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging. A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in RDS(on). These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example.

EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower RDS(on) (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count. Nexperia has optimised its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.

To learn more about Nexperia’s PoE ASFETs visit: https://nexperia.com/asfets-for-poe
To learn more about Nexperia’s NextPowerS3 MOSFETs visit: https://nexperia.com/nextpowers3

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u-blox releases versatile Wi-Fi 6 module for the mass market

u-blox has announced its new NORA-W4 module. With a range of wireless technologies (Wi-Fi 6, Bluetooth LE 5.3, Thread, and Zigbee), compact form factor (10.4 x 14.3 x 1.9 mm), and affordability, NORA-W4 is ideal for IoT applications such as smart home, asset tracking, healthcare, and industrial automation.

NORA-W4 is a single-band tri-radio Wi-Fi 6 module built on the Espressif ESP32-C6 System-on-Chip. It enables battery-powered IoT nodes to operate directly over Wi-Fi. This simplifies implementation and reduces system-level costs by limiting the need for a Bluetooth gateway, making it a perfect match for applications like wireless battery-operated sensors.

NORA-W4 uses Wi-Fi 6 technology that is optimized for IoT and significantly reduces network congestion in environments such as factories, workplaces, or warehouses, thereby improving throughput and reducing latency. Fully backward compatible with Wi-Fi 4, the module can also be used in cases where the Wi-Fi infrastructure has not been upgraded.

The u-blox NORA-W4 module supports Matter protocol, Thread, and Zigbee technologies that are designed for new applications in the smart home environment. Consequently, it allows interoperability with other Matter smart home devices.

NORA-W4’s small form factor permits designers to adapt to device size constraints. Its compatibility with other u-blox NORA modules is key to effortless technology migration, such as transitioning from Wi-Fi 4 to Wi-Fi 6. In addition, the module is packed with enhanced security features, including secure boot, trusted execution environment, and flash encryption, to name a few.

NORA-W4 is available in 6 different variants: open CPU or u-connectXpress, antenna pin or PCB antenna, and with either 4MB or 8MB flash memory. Early samples are available now, with volume production scheduled for H2 2024.

https://www.u-blox.com

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ST expands into 3D depth sensing with latest time-of-flight sensors

ST has announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR module with market-leading 2.3k resolution, and revealed an early design win for the world’s smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.

The VL53L9 is a new direct ToF 3D LiDAR device with a resolution of up to 2.3k zones. Integrating a dual scan flood illumination, unique in the market, the LiDAR can detect small objects and edges and captures both 2D infrared (IR) images and 3D depth map information. It comes as a ready-to-use low power module with its on-chip dToF processing, requiring no extra external components or calibration. Additionally, the device delivers state-of-the-art ranging performance from 5cm to 10 meters.

VL53L9’s suite of features elevates camera-assist performance, supporting macro up to telephoto photography. It enables features such as laser autofocus, bokeh, and cinematic effects for still and video at 60fps (frame per second). Virtual reality (VR) systems can leverage accurate depth and 2D images to enhance spatial mapping for more immersive gaming and other VR experiences like virtual visits or 3D avatars. In addition, the sensor’s ability to detect the edges of small objects at short and ultra-long ranges makes it suitable for applications such as virtual reality or SLAM (simultaneous localisation and mapping).

ST is also announcing news of its VD55H1 ToF sensor, including the start of volume production and an early design win with Lanxin Technology, a China-based company focusing on mobile-robot deep-vision systems. MRDVS, a subsidiary company, has chosen the VD55H1 to add high-accuracy depth-sensing to its 3D cameras. The high-performance, ultra-compact cameras with ST’s sensor inside combine the power of 3D vision and edge AI, delivering intelligent obstacle avoidance and high-precision docking in mobile robots.

In addition to machine vision, the VD55H1 is ideal for 3D webcams and PC applications, 3D reconstruction for VR headsets, people counting and activity detection in smart homes and buildings. It packs 672 x 804 sensing pixels in a tiny chip size and can accurately map a three-dimensional surface by measuring distance to over half a million points. ST’s stacked-wafer manufacturing process with backside illumination enables unparalleled resolution with smaller die size and lower power consumption than alternative iToF sensors in the market. These characteristics give the sensors their excellent credentials in 3D content creation for webcams and VR applications including virtual avatars, hand modelling and gaming.

First samples of the VL53L9 are already available for lead customers and mass production is scheduled for early 2025. The VD55H1 is in full production now.

ST will showcase a range of ToF sensors including the VL53L9 and explain more about its technologies at Mobile World Congress 2024, in Barcelona, February 26-29, at booth 7A61.

https://www.st.com

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