IoT

The new µATX server carrier board offers scalability across the entire Intel Ice Lake D processor range

Thu, Mar 21, 2024

congatec has expanded its ecosystem for modular edge servers. New products include a server carrier board in µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake). The new µATX server board for COM-HPC modules was developed for compact real-time servers that are used in edge applications and critical infrastructures. The board can be flexibly scaled with the latest high-end COM-HPC Server modules from congatec. Together with the updated modules, which are equipped with the latest Intel Xeon D-1800 and D-2800 processors, customers receive a ready-to-use µATX platform for applications with high performance requirements in a space-saving, robust design.

The ecosystem of COM-HPC modules and µATX carrier board offers OEMs a wide range of customisation options at module, board and system level from which developers can freely choose according to their needs. The ecosystem package is tailored to the stringent requirements of edge computing and offers powerful, reliable and ready-to-use building blocks for industrial environments. The modular approach shortens the time to market for new designs and also makes them future-proof.

The new µATX carrier board conga-HPC/uATX server offers maximum I/O and expansion options in a compact standard form factor. This makes the board an ideal solution for numerous applications, such as consolidating servers for virtual machines (VM) or edge servers for energy microgrids, video processing, facial recognition, security applications, smart city infrastructures and many other applications. The conga-HPC/uATX server offers multiple features to drive such applications, including robust communication options with up to 100 GbE and bandwidth, x8 and x16 PCIe expansion for processing AI-intensive workloads via GPGPUs or other compute accelerators, 2x M.2 Key M slots for NVMe SSDs and a M.2 Key B slot for compact AI accelerators or communication modules for WiFi or LTE/5G.

The new conga-HPC/sILL and conga-HPC/sILH Server-on-Modules take advantage of the latest Intel Ice Lake D-1800 LCC and D-2800 HCC processor series, which offers up to 15% more performance at the same TDP compared to the previous D-1700/D-2700 series 8. The improved performance per watt of the COM-HPC modules is ideal for high-performance applications that were previously limited by their thermal budget. They also benefit from Intel Speed Select technology, which makes it easier to balance the computing performance and maximum TDP of the system design. The latest processors have up to 22 cores with higher clock speeds to support next-generation edge applications with more performance per watt for more energy-efficient and therefore more reliable designs. Scalable edge performance and the modular approach increase the flexibility and future-proofing of designs, reduce total cost of ownership and shorten time to market.

The new COM-HPC server modules with their firmware-integrated hypervisor makes the evaluation of consolidating servers with virtual machines particularly easy. Also with full real-time capability, which is provided by TCC, TCN and optional SyncE support. This is particularly ideal for all networked 5G solutions that require very low latencies and strict frequency/clock synchronisation.

For the new COM-HPC Server-on-Modules based µATX solution platform, congatec also offers various cooling solutions, including passive cooling for small chassis. In addition to customising the conga-HPC/uATX server carrier board, the service package also includes customer-specific BIOS/UEFI and real-time hypervisor implementations as well as expansion with additional IIoT functionalities for digitisation purposes.

https://www.congatec.com

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Harwin launches floating connectors to support high-speed automated manufacture and reliability

Wed, Mar 20, 2024

Harwin has launched a range of board-to-board connectors that address the data and power transfer demands of high-performance applications while accommodating small movements in multiple axes to support high-speed automated assembly and enhance resistance to shock and vibration during operational life.

Offering up to 160 contacts in a symmetrical double row layout, the new Flecto floating connector family is available with three choices of miniature pitches: 0.5mm (.0197”), 0.635mm (.025”) and 0.8mm (0.0315”). By accommodating movement of up to ±0.5 mm in both the X and Y axes, Flecto allows for accurate placement of multiple connectors between the same two PCBs where the sum of misalignments might, otherwise, present challenges for high-speed, high-precision mating.

The positional tolerance flexibility of Flecto connectors also enhances system reliability by maintaining connection integrity during shock and vibration events and reducing the possibility of degradation or failure from ‘fretting’ – a situation that occurs when long-term vibration causes plating to wear from rigid mating pins, exposing the underlying alloy to potential oxidation.

Flecto connectors support board-to-board mating heights as low as 7.2mm and data rates as high as 12Gbit/s. Additional power pins available with the 0.5mm pitch options are rated for currents up to 3A. Vertical and horizontal female connectors allow boards to be connected in parallel or at right angles to each other, while Flecto signal-only connectors feature either location pegs or posts to eliminate movement during solder reflow. On the mixed signal and power connectors, through-board solderable posts are provided for location accuracy and enhanced mechanical strength. A number of the connectors feature shrouded contacts to prevent accidental damage when no mating connector is present, while others offer polarisation within the shroud to ensure uni-directional mating.

Target applications for the new range include factory automation, electric vehicles, LED displays, security cameras, IoT devices, data communications and a wide variety of embedded systems.

https://www.harwin.com/flecto

Written by Annie Shinn

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ST reveals advanced ultra-low-power microcontrollers for industrial, medical, smart-metering, and consumer applications

Wed, Mar 20, 2024

ST has introduced a new generation of energy-conscious and cost-effective microcontrollers (MCUs) that can reduce energy consumption by up to 50% compared to previous product generations. This enables less frequent battery replacements, minimises the impact of discarded batteries, and allows more designs to go battery free running solely from an energy-harvesting system such as a small photovoltaic cell.

In the global pursuit of sustainability, technologies deployed in smart buildings and Internet of Things (IoT) applications are critical tools for managing energy and resources efficiently. At the heart of the smart sensors and actuators making them possible, ST’s microcontrollers manage the processes that collect, filter, analyse, and act, communicating with high-level applications in the cloud. There are billions of these MCUs in action already and the expansion of smart living and working will demand billions more.

“It’s vital that these pervasive devices consume as little energy as possible as they help to minimise waste elsewhere. The new STM32U0 microcontroller series we are introducing today takes this notion to a new level, building on our proven ultra-low-power technologies,” explained Patrick Aidoune, General Purpose MCU Division General Manager, STMicroelectronics. “In fact, our new MCUs consume so little power that small devices in some dedicated applications like industrial sensor management can run for twice as long from the same size battery. This comes with the opportunity to add more advanced features and deliver cost-effective solutions for a variety of industrial, medical and consumer devices.”

The new STM32U0 MCUs enable this great leap in energy efficiency through a combination of their state-of-the-art design techniques and advanced manufacturing process. These include extremely low static power consumption in standby mode and superior wake-up performance, enabling the MCU to spend more time in power-saving sleep modes to minimise average energy demand.

One lead customer, in the security-systems market, is using the STM32U0 in security cameras to wake the device when motion is detected and thus enhance surveillance while saving energy. Another has created ultra-long-lasting smoke detectors, while a further application, by Ascoel, is using the STM32U0 to manage power-conscious functions of a water meter.

The STM32U0 enhances cost-effectiveness by providing an LCD segment display controller. Devices with an LCD, like Ascoel’s water meter as well as thermostats, smart retail labels, access-control panels, and factory automation can take advantage of this to reduce the cost of their PCB. Additional value-added features of STM32U0 MCUs include numerous analog peripherals like analog-to-digital converters (ADC), digital-to-analog converters (DAC), operational amplifiers, and comparators. There is also an on-chip system oscillator that helps cut the bill of materials to save costs and PCB space.

STM32U0 devices are the first MCUs running on Arm Cortex-M0+ targeting SESIP Level 3 and PSA level 1 focusing on firmware code protection. Certification provides an independent assurance of the STM32U0 security capabilities that product manufacturers can leverage to comply with the coming voluntary US Cyber Trust Mark and mandatory EU Radio Equipment Directive (RED).

Developers can also take advantage of up to 256KB of Flash, package options up to 81 pins, and 56MHz core speed, which are generous specifications for this class of device.

https://www.st.com

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Integrated LQ050XX load switch ICs from Littelfuse now at Rutronik

Tue, Mar 19, 2024

Equipped with state-of-the-art technology, Littelfuse’s LQ050XX integrated load switch ICs offer the industry’s highest performance with ultra-low power consumption. They make it possible to reduce parasitic leakage currents, improve system efficiency, and extend battery life. That means a real upgrade for a wide range of applications, e.g. in wearables, smart homes, or IoT devices.

The integrated load switch ICs are available in different housing sizes from 0.77 mm x 0.77 mm x 0.46 mm to 0.97 mm x 1.47 mm x 0.55 mm. Their small size makes them particularly suitable for applications with limited space. The switches are robust, particularly power-saving and, thanks to the cutting-edge technology they contain, can deliver market-leading performance in terms of low quiescent current and switch-off current. In addition, they impress with low power losses and reduced leakage currents for extremely convincing efficiency.

The ICs are available in the following versions:
LQ05021QCS4:
The load switch delivers 2 A rated power. The integrated slew rate control improves system reliability and reduces voltage fluctuations on the bus. Together with its outstanding efficiency, this makes it the ideal solution for applications such as IoT or wearables.
LQ05021RCS4:
The IC has a high efficiency and the leading True Reverse Current Blocking (TRCB) technology. Together with a particularly low threshold voltage, the LQ05021RCS4 prevents reverse current when Vout exceeds Vin, minimises power loss during operation, and offers an extremely low switch-off current. The switch is predestined for wearables, portable electrical devices, or IoT applications.
LQ05022QCS4:
This switch is also equipped with slew rate control, which limits the inrush current and thus minimises the voltage drop. The LQ05022QCS4 supports a wide input voltage range, which optimises both the service life and the reliability of a system. The component can also be used in different voltage rails. Preferred applications include data storage, IoT devices, or low-power subsystems.
LQ05041QCS6
The LQ05041QCS6 has a rated power of 4 A. It has an integrated slew rate control and also a slew rate control. With six bumps and a size of 0.97 mm x 1.47 mm x 0.55 mm, it is particularly small and is primarily used in data storage, or the medical sector.
LQ05041RCS6
With its leading TRCB technology and extremely low threshold voltage, the switch prevents reverse currents and minimises power loss during operation. Its main areas of application include portable devices and power-saving subsystems.

https://www.rutronik24.de/

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