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IAR Embedded Workbench supports Renesas’ low-power RE MCU family

Wed, Sep 09, 2020

For embedded design using the code optimisations and debugging features in Arm tools, the IAR Embedded Workbench will speed up development of low-power IoT applications based on the Renesas RE microcontroller (MCU) family, says IAR Systems.

The company announced the update of its development toolchain IAR Embedded Workbench for Arm, with coverage for microcontroller family which is built around an Arm Cortex-M0+ core. The RE is suitable for IoT devices that require low power consumption, such as wearables and sensing applications for homes, buildings, factories and farms or agricultural IoT applications. It reduces power consumption via Renesas’ proprietary Silicon-on-Thin-Buried-Oxide (SoTB) process technology, which reduces power consumption in both active and standby mode, thereby eliminating the need for battery replacement or recharging, says Renesas.

IAR Embedded Workbench for Arm is a C/C++ development toolchain for embedded applications. Developers can use it to leverage advanced code optimisation techniques and power debugging for fast, efficient, compact devices. It has integrated static and runtime code analysis tools for code quality. IAR Systems also offers technical support and services, to support developers as they develop IoT applications which may need the energy harvesting capabilities of the RE microcontrollers.

“IAR Embedded Workbench is well-known for its ability to make the most out of the capabilities of an MCU in an embedded application,” said Anders Holmberg, general manager Embedded Development Tools, IAR Systems. “Coupled with Renesas RE MCUs, the toolchain offers a powerful, yet easy-to-use, solution for developing low-power applications for the IoT space.”

Support for Renesas RE is available using IAR Embedded Workbench for Arm, from version 8.50.6.

IAR Systems supplies future-proof software tools and services for embedded development. Since 1983, IAR Systems’ products have been used in the development of over one million embedded applications.

The company is headquartered in Uppsala, Sweden and has sales and support offices all over the world.

In 2018, Secure Thingz, the global domain expert in device security, embedded systems, and lifecycle management, became part of IAR Systems Group.

http://www.iar.com

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SnapDragon and software stack drive ADAS and autonomous systems

Tue, Sep 01, 2020

Automotive software provider, Veoneer and Qualcomm have announced a collaboration to deliver scalable advanced driver assistance systems (ADAS), collaborative and autonomous driving (AD) solutions powered by Veoneer’s next-generation perception and driving policy software stack and Qualcomm’s Snapdragon Ride ADAS/AD scalable SoCs and accelerators. Qualcomm’s portfolio range from L1 to L4 systems designed to create an open platform for Tier-1 suppliers and vehicle manufacturers.

Veoneer’s software stacks are automotive grade solutions designed to meet the requirements of manufacturers, regulators and rating agencies globally. It has received top performance ratings and enabled automakers to achieve five star safety ratings for European New Car Assessment Program (Euro NCAP) in 2018 and 2020.

The companies plan to launch an automotive grade, functional safety compliant and optimised platform which will include a range of optimised NCAP features and up to hands-free driving on highways and slow-moving traffic with over the air updates.

The software stack will be developed in a dedicated organisation within Veoneer.

Designed to address the growing complexities associated with developing ADAS, including safety compliance, the integrated software and SoC platform targets the automotive ecosystem with advanced and power-efficient compute, connectivity and cloud service capabilities across all vehicle tiers with Veoneer’s fifth generation perception software and driving policy software and the Snapdragon Ride portfolio.

Qualcomm Technologies intends to make this integrated SoC and software stack platform available to global manufacturers and Tier 1 suppliers.

Veoneer will serve as a Tier 1 system integrator for the software and SoC platform and will continue to develop ADAS and collaborative driving products and systems.

The company will develop an open and programmable platform to offer more customisation. The companies expect the integrated platform to be available through automotive Tier 1 suppliers or directly to OEMs for 2024 vehicle production.

The Qualcomm Snapdragon Ride platform was introduced earlier this year. It is based on the Snapdragon family of automotive SoC and accelerator products, which are built on scalable and modular heterogenous, multi-core CPUs. This basis makes it suitable for planning and decision making, energy efficient AI and computer vision (CV) engines, graphics processor units (GPUs) for visualisation, image signal processors for camera sensors, and dedicated safety and security subsystems.

The integrated platform with Veoneer’s software stack will be built on the scalable Snapdragon Ride roadmap, offering industry leading scalability from L1 ADAS to L4 autonomous driving SoC and accelerator products.

http://www.veoneer.com

http://www.qualcomm.com

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Cadence digital and custom tool suite is optimised for TSMC’s 3nm process

Fri, Aug 28, 2020

The collaboration between Cadence and TSMC has broadened as the partners announce that the former’s digital full flow and custom tool suite has been optimised for TSMC’s 3nm (N3) process technology.

The Cadence tools have achieved the latest design rule manual (DRM) and Spice certification for the N3 process. These innovations assist in driving and delivering next-generation mobile, artificial intelligence (AI) and high performance computing (HPC) applications, developed on the N3 process technology, says Cadence, with reference flows and methodologies.

Customers can download the corresponding N3 process design kit (PDK) to begin design projects now.

The updated digital full flow for N3, features enhanced physical optimisation and timing signoff closure. It includes the Innovus Implementation System, Liberate Characterisation, Liberate Variety Statistical Characterisation, Quantus Extraction Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity and Pegasus Verification System. In addition, the Genus Synthesis and its predictive iSpatial technology is enabled for these process technologies for mobile, AI and hyperscale designs, adds Cadence.

The digital suite and available reference flows help customers achieve better power, performance and area (PPA) while designing on TSMC’s N3 process. Tool suite enhancements include, improved extraction accuracy, updated routing rules, accurate LVF-generation during characterisation and robust support of advanced colouring.

The certification on TSMC’s N3 process includes the Virtuoso Custom IC design platform, consisting of the Virtuoso Schematic Editor, Virtuoso Layout Suite and Virtuoso ADE Product Suite, the Voltus-Fi Custom Power Integrity Solution, and the Spectre Circuit Simulation Platform, which includes the Spectre X Simulator.

Custom enhancements for TSMC’s N3 process technology include expanded 3nm design rule support, custom digital colour remastering, enhanced analogue cell support, additional productivity improvements with an enhanced device-level place and route flow and a front-to-back legacy-node design migration flow.

Suk Lee, senior director of the Design Infrastructure Management Division at TSMC, commented: “Our latest work enables our customers to design with the tools, benefitting from the significant power and performance boost of TSMC’s 3nm process technology and to quickly launch their new product innovations to market.”

http://www.cadence.com

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Multi-channel RGB-LED driver support MeLiBu interface

Fri, Aug 28, 2020

Support for MeLiBu, the high speed communication interface differentiates the MLX81116 multi-channel RGB LED driver, says Melexis. The high speed communication IP enables automotive manufacturers to provide enhanced features in new models with smart interior lighting and to enable intelligent, automated lighting, continues the company.

MeLiBu is already being leveraged by leading manufacturers to enhance the safety features of their latest models. For example, animated lighting in the vehicle’s cabin can convey important driver assistance prompts and vehicle status information. An RGB LED lightbar communicates to the driver, through colour coding, colour changing, and blinking sequences.

Key engineering challenges for this systems include maintaining consistent colour across all the LEDs in the lightbar and ensuring they all change simultaneously. The MLX81116 addresses this through the high-speed communication interface IP, MeLiBu which controls individual LEDs separately in the lightbar to produce the lighting effects commanded by the vehicle. The intelligent RGB LED controller also provides real time compensation of any LED colour drift caused by environmental changes.

The MeLiBu communication interface uses the CAN-FD physical layer, which ensures robustness, reliability and high speed (up to 2Mbit), explains Melexis. Support for dedicated optical parameters allows colour-mixing accuracy with a delta UV of one per cent to ensure no distinguishable differences between individual LEDs in the lightbar. In addition, intelligent high resolution for temperature-related colour drift helps maintain a consistent and non-distracting user experience under all operating conditions.

The MLX81116 driver IC has a wide dimming range that allows optimal brightness adjustment for daytime and night driving. It also meets automotive ISO 26262 functional safety requirements up to safety integrity level B (ASIL B) and features low EMI emission and high immunity, thanks to the use of the CAN-FD physical layer, which eases compliance with applicable EMC regulations, adds Melexis.

Melexis designs, develops and delivers mixed-signal semiconductor sensor and actuator components for integrating sensing, driving and communication into products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

Melexis has used its core experience in creating chips for vehicle electronics to expand its portfolio of sensors, driver ICs and wireless devices to also meet the needs of smart appliances, home automation, industrial and medical applications. Melexis sensing products include magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and time of flight.

The company’s driver IC portfolio incorporates advanced DC and BLDC motor controllers, LED drivers and FET pre-driver ICs with the expertise to allow components to communicate whether wired or wireless.

Melexis is headquartered in Belgium.

http://www.melexis.com

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IAR Embedded Workbench supports Renesas’ low-power RE MCU family

SnapDragon and software stack drive ADAS and autonomous systems

Cadence digital and custom tool suite is optimised for TSMC’s 3nm process

Multi-channel RGB-LED driver support MeLiBu interface

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