Renesas says RA6M4 MCU family advances security for IoT

RA6 series microcontrollers (MCUs) from Renesas now include nine new RA6M4 group MCUs. These additions bring the RA family up to 42 MCUs. The latest 32-bit MCUs boost operating performance up to 200MHz using the Arm Cortex-M33 core based on Armv8-M architecture with Arm TrustZone technology.

The RA6M4 MCUs are supported by the Flexible Software Package (FSP) and Renesas’ partner ecosystem of software and hardware building blocks for RA6M4 MCUs and FSP to address industry 4.0, building automation, metering, healthcare, and home appliance applications.

The MCUs have large embedded RAM with parity/ECC, low power consumption, and benefit from the Arm developer and tools ecosystem. According to Renesas, the RA6M4 MCUs speed the development of intelligent IoT edge and endpoint devices. Renesas’ enhanced Secure Crypto Engine incorporates multiple symmetric and asymmetric cryptography accelerators, advanced key management, security lifecycle management, tamper detection, and increased resistance to side-channel attack, in addition to Arm TrustZone technology. These integrated security features enable customers to realise lower bill of materials (BoM) cost and secure element functionality in IoT designs, Renesas says.

“[The RA6M4 MCUs] offer customers best-in-class performance and security enhancements built with Arm Cortex-M33 cores that clearly deliver more memory, memory interface expansion, better power efficiency and wake-up time, and more connectivity options,” said Roger Wendelken, senior vice president of Renesas’ IoT and Infrastructure Business Unit. “

“IoT edge and endpoint technologies are opening up new opportunities for developers to build smaller devices, with greater privacy and less dependence on the cloud,” said Dipti Vachani, senior vice president and general manager, Automotive and IoT Line of Business at Arm. “The RA6M4 MCUs move intelligence closer to the data, with Arm TrustZone technology built in to ensure privacy and data integrity, helping securely accelerate the growth of IoT,” he added.

The RA6M4 MCUs are built on an efficient 40nm process, to drive power consumption down to 99 microA/MHz while running the CoreMark algorithm from flash. The MCUs also support fast wakeup times of 30 micro seconds from standby using an on-chip oscillator. The high integration up to 1Mbyte code flash memory and 256kbyte of SRAM (64kbyte with ECC) also make the RA6M4 MCUs well suited for low power and safety applications.

The RA6M4 with Flexible Software Package (FSP) allows customers to re-use their legacy code and combine it with software from partners across the Arm ecosystem to speed implementation of complex connectivity and security functions. The FSP includes FreeRTOS and middleware, offering a premium device-to-cloud option for developers. These out-of-box options can be easily replaced and expanded with any other RTOS or middleware. It also provides a host of efficiency enhancing tools for developing projects targeting the RA6M4 MCUs. The e2 studio integrated development environment  (IDE) provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a GUI to simplify the process and dramatically accelerate the development process.

The RA6M4 MCUs are available now from Renesas’ worldwide distributors.

http://www.renesas.com

> Read More

Data processing units will elevate data centre performance, says Nvidia

At GTC, a virtual, global event hosted by Nvidia, the BlueField-2 family of data processing units (DPUs) was introduced. They are supported by DOCA, a data centre infrastructure on a chip architecture that raises networking, storage and security performance, says the company.

The BlueField-2 DPU can deliver the same data centre services that could consume up to 125 CPU cores, said the company, to free up the CPU cores to run other applications.

The Nvidia BlueField-2 DPU has the same capabilities as the company’s Mellanox ConnectX-6 Dx SmartNIC, with Arm cores. The fully programmable PCIe module delivers data transfer rates of 200Gbits per second and accelerates key data centre security, networking and storage tasks, including isolation, root trust, key management, RDMA/RoCE, GPUDirect, elastic block storage and data compression.

The BlueField-2X DPU, additionally has an Nvidia Ampere GPU with AI capabilities that can be applied to data centre security, networking and storage. Third generation Tensor Cores enable it to use AI for real time security analytics, including identifying abnormal traffic, which could indicate an intruder, together with host introspection to identify malicious activity, and dynamic security orchestration and automated response.

An Nvidia DOCA software development kit is also available to enable developers to build applications on DPU-accelerated data centre infrastructure services.

DOCA provides developers a comprehensive, open platform for building software-defined, hardware-accelerated networking, storage, security and management applications running on the BlueField family of DPUs.

Server manufacturers worldwide including ASUS, Atos, Dell Technologies, Fujitsu, GIGABYTE, H3C, Inspur, Lenovo, Quanta/QCT and Supermicro, have confirmed plans to integrate the DPUs into their enterprise server offerings.

Software support includes VMware (VMware Cloud Foundation), Red Hat (Red Hat Enterprise Linux and Red Hat OpenShift) and Canonical (Ubuntu Linux). Cybersecurity provider, Check Point Software Technologies, is integrating BlueField-2 DPUs into its technologies, which more than 100,000 organisations worldwide.

BlueField-2 DPUs are sampling now and BlueField-2X DPUs are under development and expected to become available in 2021.

DOCA is available for early access partners now.

http://www.nvidia.com

> Read More

Advantech models fanless EPC-C301 on Intel Core for machine vision

Based on the 8th Generation Intel Core processor, the EPC-C301 is a compact fanless box PC from Advantech. Intended for industrial use, it has domain-focused I/O and can operate in a wide temperature range.

The EPC-C301 integrates Intel and Canonical technologies, provides Ubuntu OS and OpenVINO toolkits. It has been developed for machine vision applications, such as biometric artificial intelligence (face recognition), automated optical inspection (AOI) or automated plate number recognition (APNR).

EPC-C301 supports four GbE LAN and four USB 3.2 Gen2 x1 (10Gbits per second) to accommodate the IP/HD camera inputs required for AOI, APNR and other machine vision applications. The compact design measures just 170 x 118 x 70mm and has four USB 2.0 and four UART interfaces to expand performance with card readers, barcode scanners, key pads, fingerprint sensors and other peripherals.

There are also two isolated CANBus ports designed for use in automation and medical applications. Windows and Linux based drivers/APIs are also available for convenience and compatibility, adds Advantech.

The 8th Generation Intel Core processor at the heart of the PC is the first one that doubles the core count to quad-core on a low power 15W CPU, says Advantech. High-bandwidth dual-channel DDR4 supports up to 32Gbyte while satisfying intensive data handling and image processing requirements. The EPC-C301 is equipped with an M.2 M-Key 2280 that accepts both SATA SSD’s and PCIe x4 SSD’s, to advance computing speeds.

To meet artificial intelligence IoT (AIoT) IoT challenges on the edge, the EPC-C301 includes M.2 E-Key for Wi-Fi and Bluetooth, M.2 B-key for LTE and a mini-PCIe, which is compatible with Advantech’s VEGA-330 AI mini-PCIe module. This system has a broad operating temperature (-20 to around 60 degrees C) typically incurred in outdoor applications like passenger information/tracking systems (PIS) or smart parking solutions.

The EPC-C301 also features the Intel OpenVINO developer kit, which is compatible with the VEGA-330 AI acceleration card and Ubuntu 18.04 LTS.

The fanless box PC is available for order now.

http://www.advantech.eu

> Read More

CH201 ToF sensor operates at up to 5m

TDK has extended its ultrasonic time of flight (ToF) sensor platform, with the Chirp CH201 sensor range which includes CH201 MEMS sensors, sensor modules, and developer kits.

The CH201 MEMS sensor, sensor modules, and developer kits joins Chirp’s original CH101 ultrasonic ToF sensor product. While the CH101 provides measurements for use cases scenarios of up to 1.2m, the CH201 provides exact long range measurements to targets at distances up to 5m, says TDK.

Chirp’s MEMS ultrasonic technologies leverage proprietary ToF range sensors in a 3.5 mm x 3.5 mm reflowable system in package (SiP) which combines a MEMS ultrasonic transducer with a power efficient digital signal processor (DSP) on a low power, mixed-signal ASIC.

The CH201 works in any lighting condition, including full sunlight to complete darkness independent of the target’s colour and optical transparency. Like the CH101, the CH201 has a configurable field of view (FoV) and a flexible DSP capable of handling a variety of ultrasonic signal processing algorithms.

The CH201 offers flexible industrial design options for range-finding, presence / proximity sensing and object-detection / avoidance.

A developer kit is also available (DK-CH201) for prototyping with one or more ToF sensors. The kit includes one CH201 with the option to add up to four additional ultrasonic modules.

An evaluation module (EV_MOD_CH201-03-01) is easy to use and designed for rapid integration and evaluation of hardware designs, says TDK. Different acoustic housings available to adjust the FoV.

Sensors, developer kits and evaluation modules are available now through worldwide distribution.

TDK is based in Tokyo, Japan. It was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. TDK’s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices, as well as sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors. In addition, TDK provides power supplies and energy devices and magnetic heads. Products are marketed under the brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda.

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

http://www.tdk.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration