Renesas adds multi-phase controller and smart power stage for IoT infrastructure

There are 15 digital multi-phase controllers and six smart power stages in the second generation suite of products for the IoT infrastructure, released by Renesas Electronics.

The digital multiphase controllers and smart power stages support 10A to over 1000A digital computing loads for advanced CPUs, FPGAs, GPUs and AI ASICs for the IoT infrastructure. The ISL6822x, ISL6823x, RAA2282xx digital multi-phase controllers and ISL993xx, RAA2213xx smart power stages have been added to the company’s 41 devices already in its digital multi-phase platform to increase power densities in data centre servers, storage, optical transport, routers, switches, as well as computing and 5G wireless infrastructure equipment.

Renesas believes it is the only supplier with 20-phase controllers for high current 1000A+ GPUs and AI ASICs. Andrew Cowell, vice president of Mobility, Infrastructure and IoT Power business division at Renesas, said that the patented synthetic current control architecture delivers the fastest transient response, reduced output capacitance and lower system cost. “In addition, the digital multiphase controllers significantly reduce time to market with solder-free tuning of any application using Renesas’ PowerNavigator software,” he added. It is claimed to be the first for digital multiphase controllers.

The digital multi-phase controllers enable greater scalability and flexibility to adapt to any system requirement without requiring phase doublers, says the company. From two phases to 20 native phases, the choice of controllers can be configured for a range of applications, depending on output current requirements. Individual points can be set for adding/dropping phases to maximise efficiency across the entire load range. Each controller’s on-chip non-volatile memory allows the configuration to be saved to the device. This eliminates the need for discrete components for set up and tuning. A black box captures fault events, allowing faster diagnostics and debugging.

The controllers’ digital engine features a patented synthetic current control architecture that tracks each phase current with zero latency. As a result, the device can respond to any load transient with precise current and voltage positioning, and 30 per cent less capacitance than competitive devices, according to Renesas. Synthetic current control also makes it possible to develop high reliability systems using all ceramic capacitors.

Full digital control of the power supply enables the entire system to be monitored and controlled via PMBus and AVSBus interfaces to the system managers. The AVSBus interface allows connection to any ASIC or processor for monitoring and adaptive voltage positioning. This adjusts the power supply to the load requirements for energy efficiency. The PMBus interface provides full monitoring of I/O voltages and currents, temperature and fault reporting. Combining the digital multi-phase controllers with various smart power stages allows each individual phase to accurately monitor its current.

The ISL993xx and RAA2213xx smart power stages provide 20A to 90A of maximum continuous current. They have an integrated driver and FETs in compact packages for space-constrained designs. The level of integration coupled with current sense capability delivers at least 30 per cent board space savings over traditional power solutions, which typically employ separate drivers and discrete FETs, reports Renesas. The smart power stage devices have a smart driver, which can provide a reconstruction of the inductor current by sensing the FETs within the device.

The smart power stages also integrate precise current sense and reporting, simplifying power designs by eliminating the need for complex temperature and inductor DCR compensation. The current reporting is guaranteed at two per cent accuracy over line, load and temperature. This is a significant improvement over DCR sensing which suffers from lack of temperature compensation, inductor DCR variance and time constant error with load, claims Renesas.

The PowerNavigator software provides configurability and debugging tools in a single graphical user interface (GUI). Power designers can configure the controller, set the parameters to tune the system and debug/monitor using the black box, high speed command logging, and digital test bus features.

The 15 new digital multiphase controllers are available now in 4.0 x 4.0mm to 8.0 x 8.0mm QFN packages and the new smart power stages are available in 4.0 x 5.0mm to 5.0 x 6.0mm QFN packages.

http://www.renesas.com

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Comms module supports V2X smart transportation

Supporting the domains of intelligent transportation, smart cities and autonomous driving, the UMCC1 Series cellular V2X communication module has been announced by Alps Alpine.

Cellular vehicle to everything (V2X), or C-V2X is already deployed using 4G mobile communications (4G LTE) in anticipation of 5G-based services. Alps Alpine has developed the UMCC1 Series Cellular V2X All In One Communication Module. It is compliant with 3GPP1 Release 14 and includes an application processor and V2X protocol stack, to reduce the load on the host CPU for the onboard unit. The UMCC1 Series also has its own built in power circuit (PMIC2), allowing for system expansion of on board units.

A Cellular V2X Communication Module evaluation board and kit is also available for manufacturers of end products.

The module has been jointly developed with Gohigh Data Networks Technology. It has undergone IMT-20203 demonstration testing, where it realised high interconnectivity and reliability, reports Alps Alpine.

The modules is intended to speed up development of 5G modules, initially in China, and to further enhance product capabilities for connectivity. Alps Alpine will also concentrate development efforts on integrating this core technology for the digital cabin framework with human machine interface (HMI) and sensing technology.

Alps Alpine, Alps Electric and Alpine Electronics integrated their businesses and became Alps Alpine, drawing on combined expertise in core devices, system design and software development. The company serves the automotive, mobile devices and consumer electronics markets, as well as energy, healthcare and industry sectors.

Alps Alpine Europe is a subsidiary of Alps Alpine. Since 2013 the European head office has been located in Munich from where it co-ordinates the sales, marketing and product engineering activities of offices in Dusseldorf, Stuttgart, Wolfsburg, Paris, Milton Keynes, Coventry, Gothenburg, Frolunda and Milan. The manufacturing site is in Dortmund, Germany.

https://www.alpsalpine.com/e/

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Trust&GO Wi-Fi module is ready for cloud platforms

The single 32-bit microcontroller module from Microchip, the WFI32E01PC Trust&GO is pre-provisioned for market-leading cloud platforms.

It is the first Wi-Fi microcontroller module with Microchip’s Trust&GO-enabled unique, verifiable identity. It can be integrated into secure industrial IoT (IIoT) systems, as it complies to the Wi-Fi Alliance (WFA) specification and is fully certified with the Federal Communications Commission (FCC), Industry Canada (IC) and European Radio Equipment Directive (RED).

Microchip’s Trust&GO platform inside the WFI32E01PC streamlines the process of network authentication using secure element technology, which is pre-configured and pre-provisioned for cloud authentication.

The PIC32 MCU core, rich peripherals and proven hardware security platform enable it to provide Wi-Fi but also to serve as a powerful microcontroller (MCU) core for an entire IIoT system.

“With increasing attacks, traditional software data encryption is no longer sufficient to protect transmitted data. Devices need a hardcoded, verifiable, trustable identity to securely connect to the cloud,” said Steve Caldwell, vice president of Microchip’s wireless solutions business unit. “This is the first secure, pre-provisioned MCU with Wi-Fi that is shipped factory direct or through distribution.”

Advantages over discrete designs include no need to develop drivers and circuits for multiple chips, especially when the chips are from different vendors. It may also be difficult to receive system-level support from vendors as their expertise is only in products they produce, continues Microchip. Embedded designers need a highly integrated module solution providing industrial-grade MCU functionality, robust Wi-Fi connection and hardware security and authentication. The WFI32E01PC module is also claimed to improve RF power and provide a higher level of security.

In addition to industrial applications, the WFI32E01PC is designed for home automation devices, computing and consumer devices.

The WFI32E01PC module can be paired with Microchip’s KSZ8081 family of Ethernet PHYs, its MCP2542WFD family of CAN transceivers, sensors and radio technologies including Bluetooth Low Energy (BLE), Long Range (LoRa) and IEEE 802.15.4. Microchip also provides ready-to-use software drivers and hardware reference designs, significantly reducing project risk and time-to-market.    

For example, the WFI32E01PC is supported by the PIC32MZW1 Curiosity Board. Microchip offers several options for software and hardware support, including MPLAB X integrated development environment (IDE) and MPLAB Harmony v3 embedded software development framework. Supporting tools include the on-board debugger and in-circuit serial programming header for MPLAB Snap, MPLAB PICkit 4 or MPLAB ICD 4 external programmer/debuggers.

The WFI32E01PC-I 54-pin SMD device measures 24.5 x 20.5 x 2.5mm. It is available now in volume production. There are also module options with external antenna, and without Trust&GO security.

http://www.microchip.com

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Imagination expands GPU IP with multi-core IMG B-Series

A multi-core architecture is featured in the IMG B-Series of GPU IP from Imagination. The IP enables users to reduce power while reaching higher levels of performance than any other GPU IP on the market, claims the company.

It delivers up to 6 TFLOPS of compute, with an up to 30 per cent reduction in power and reduces area by 25 per cent over previous generations and up to 2.5x higher fill rate than competing IP cores, Imagination says.

It provides higher performance per mm2 than the IMG A-Series and offers new configurations for lower power and up to 35 per cent lower bandwidth for a given performance target.

It is intended for the mobile (premium to entry-level), consumer, IoT, microcontrollers, DTV and automotive markets. The multi-core IP also enables IMG BXT to reach data centre levels of performance.

B-Series also contains the first ISO 26262-capable cores with IMG BXS providing a range of options for automotive from small, safety-fallback cores, to multiple TFLOPS of compute for advanced driver assistance systems (ADAS) and high performance autonomy.

The company has built on the investment made to develop the A-Series and has added multi-core technology. The result is 33 new configurations.

IMG B-Series is available today and already has lead licensees for every product family.

The multi-core architecture has been optimised for each of the product families with BXT and BXM cores featuring multi-primary, full-core scaling and combining the power of all of the cores to deliver maximum single-app performance. There is also the option to enable the cores to run independent applications.

BXE cores offer primary-secondary scaling, to optimise area and uses HyperLane technology for multi-tasking.

BXS Automotive cores also feature multi-core with a multi-primary design enabling performance scaling as well as safety checks to be performed across cores to confirm correct execution.

Image compression technology is also included in the B-Series. IMGIC technology provides new bandwidth saving options and offers up to four levels of compression, from pixel-perfect lossless modes to an extreme bandwidth-saving mode. These modes guarantee a 4:1 or better compression rate, Imagination adds and allows SoC designers to optimise either for performance or to reduce system cost.

IMGIC is compatible with every core across the B-Series range, to afford even the smallest cores the company’s advanced image compression.

The IMG B-Series is available in four product families that offer specialised cores for specific market needs. The IMG BXE drives high resolution displays from one to 16 pixels per clock (PPC). The range of GPUs scales from 720p to 8K for UI rendering and entry-level gaming. BXE offers up to 25 per cent area saving compared to previous generation cores and up to 2.5x the fill rate density compared to competing alternatives, says Imagination.

The IMG BXM high efficiency cores provide an optimal balance of fill rate and compute in a compact silicon area for mid-range mobile gaming and complex UI solutions for DTVs, for example.

The IMG BXT can scale from handheld devices to the data centre. The flagship B-Series GPU is a four-core part generating 6.0 TFLOPs of performance, 192 Gigapixels per second and 24 TOPS for artificial intelligence (AI). According to Imagination it delivers the industry’s highest performance per mm2.

The IMG BXS automotive GPUs are ISO 26262-capable GPUs, ranging from entry to premium, for human machine interface (HMI) user interface (UI) displays, infotainment, digital cockpits, surround view, to multi-TFLOP compute-focused configurations for autonomy and ADAS.

http://www.imgtec.com

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