PCIe board brings AI to the edge

Combining the Flex Logix InferX X1 edge inference accelerator chip with Winbond Electronics’ LPDDR4X DRAM, the former’s half-height, half-length PCIe embedded processor board is designed for demanding artificial intelligence (AI) applications, such as object recognition delivered via edge servers and gateways.

The Winbond LPDDR4X chip is paired with Flex Logix’s InferX X1 edge inference accelerator chip, which is based on an architecture that features arrays of reconfigurable Tensor processors. According to the company, this provides higher throughput and lower latency at lower cost than any other existing AI edge computing when processing complex neural networking algorithms such as YOLOv3 or Full Accuracy Winograd.

To support the InferX X1’s 7.5Terra operations per second (maximum) performance, the W66CQ2NQUAHJ 4Gbit LPDDR4X DRAM offers a maximum data rate of 4267Mbits per second at a maximum clock rate of 2133MHz. To enable use in battery-powered systems and other power-constrained applications, the W66 series device operates in active mode from 1.8V or 1.1V power rails, and from a 0.6V supply in quiescent mode. It offers power saving features including partial array self-refresh.

The 4Gbit W66CQ2NQUAHJ is comprised of two 2Gbit dies in a two-channel configuration. Each die is organised into eight internal banks which support concurrent operation.

Flex Logix’s half-height, half-length PCIe embedded processor board takes advantage of Flex Logix’s architecture which includes reconfigurable optimised data paths which reduce the traffic between the processor and DRAM, to increase throughput and reduce latency.

According to Robert Chang, technology executive of DRAM product marketing at Winbond:  “The price/performance advantage of using InferX with our LPDDR4X chip has the potential to significantly expand AI applications by finally bringing inference capabilities to the mass market.”

Dana McCarty, vice president of sales and marketing for Flex Logix’s AI inference products agreed: “The combination of the unique InferX X1 processor and Winbond’s high-bandwidth LPDDR4X chip sets a new benchmark in edge AI performance. Now for the first time, affordable edge computing systems can implement complex neural networking algorithms to achieve high accuracy in object detection and image recognition even when processing data-intensive high-definition video streams.”

https://flex-logix.com

http://www.winbond.com

> Read More

SiP integrates cellular and GNSS technology

Swiss positioning and wireless communication specialist, u-blox, has integrated low power wide area (LPWA) connectivity and a global navigation satellite system (GNSS) technology into a small system in package (SiP) form factor. The Alex-R5 is a miniature cellular module designed for size-constrained asset tracking, wearable and healthcare applications.

It features the secure u-blox UBX-R5 LTE-M / NB-IoT chipset with Secure Cloud functionality and the u-blox M8 GNSS chip for location accuracy.

Alex-R5 has a small footprint of 14 x 14mm footprint. The SiP design reduces its size by half, compared to the functionally equivalent u-blox SARA-R5 module.

Its 23dBm cellular transmission power guarantees that end devices operate effectively in all signal conditions, even at cell edges, underground, or in other challenging scenarios. A dedicated GNSS antenna interface enables fully independent, simultaneous operation of the u-blox M8 GNSS chip, matching the performance of a stand-alone u-blox M8 module. To further enhance positioning, there is the u-blox IoT Location-as-a-Service with CellLocate and AssistNow (online, offline, and autonomous).

Alex-R5 is optimised for power-sensitive and battery-dependent applications, says u-blox, including wearables and connected medical devices. The lower power modes of the u-blox UBX-R5 and UBX-M8 chipsets give users options to balance power consumption and performance using GNSS Super-E mode.

The rugged SiP construction is suitable for harsh environments, where moisture or vibration would be a concern for conventional modules, says u-blox. Alex-R5 is rated at moisture sensitivity level 3 (MSL 3), offering reduced handling and device production complexity.

u-blox guarantees long-term device availability and provides lifetime support for the entire platform, down to the chipset level. Secure Cloud functionality supporting IoT-Security-as-a-Service based on an internal, hardware-based secure element enables a pre-shared key management system specifically designed for LPWA devices.

In addition, Alex-R5 futureproofs IoT devices and networks by enabling customers to software upgrade deployed devices for compatibility with 5G networks in a seamless transition as 5G networks are rolled out by mobile operators.

Engineering samples of the Alex-R5 SiP will be available by Q1, 2021.

http://www.u-blox.com

> Read More

Ericsson aims for customised 5G with RAN Slicing software

Software released by Ericsson enables communications service providers to deliver innovative 5G use cases to consumers and enterprises. The Ericsson 5G RAN Slicing software is built on the company’s radio expertise and a scalable and flexible architecture, explained the company. It will support customised business models and growth with end-to-end network slicing capabilities needed to deliver different services over a common infrastructure.

The commercially available 5G RAN Slicing allocates radio resources at 1ms scheduling and supports multi-dimensional service differentiation handling across slices. This strengthens end-to-end slicing capabilities for dynamic resource management and orchestration, says Ericsson.

Network slicing supports multiple logical networks for different service types over one common infrastructure. It is a key enabler for unlocking 5G revenue opportunities such as enhanced video, and in-car connectivity, and extended reality. A report by Ericsson estimates $712billion in an addressable consumer market for service providers by 2030. The addressable market for network slicing alone in the enterprise segment is projected to be $300billion by 2025. Service providers are looking to maximise returns on investments by targeting innovative use cases such as cloud gaming, smart factories and smart healthcare.

Per Narvinger, head of Product Area Networks at Ericsson said: “Ericsson 5G RAN Slicing dynamically optimises radio resources to deliver significantly more spectrum-efficient radio access network slicing. . . It boosts end-to-end management and orchestration support for fast and efficient service delivery. This gives service providers the differentiation and guaranteed performance needed to monetise 5G investments with diverse use cases.”

Network slicing is one of the major 5G deployment models. Ericsson has ongoing 5G network slicing engagements for RAN, transport, core network and orchestration across the globe involving use cases for the consumer segment and enterprises/industry verticals such as video-assisted remote operations, AR/VR, TV/media for sports event streaming, cloud gaming, smart city, and applications for Industry 4.0 and public safety.

The Ericsson 5G RAN Slicing software offers a multi-dimensional service differentiation handling that allows for the effective use of dynamic radio resource partitioning, slice-aware quality of service (QoS) enforcement, and slice orchestration functionality for service-level agreement (SLA) fulfilment. It dynamically shares radio resources at 1ms scheduling for best spectrum efficiency and ensures end-to-end network slice management and orchestration support for fast service delivery and supports business models for virtual, hybrid and dedicated private networks​.

The solution can also power use cases for mission-critical and time-critical communication services.

http://www.ericsson.com

> Read More

STMicroelectronics simplifies portable GNSS receiver design

Claimed to simplify design and save real estate in global navigation satellite system (GNSS) receivers, the BPF8089-01SC6 RF is an integrated impedance-matching and protection IC from STMicroelectronics.

Integrating the impedance-matching and electrostatic discharge (ESD) protection circuitry, typically implemented using discrete components, results in a much smaller footprint, says STMicroelectronics.

The BPF8089-01SC6 provides a 50 Ohm matched interface between the receiver’s antenna and low noise amplifier (LNA), and is ready to use with ST’s STA8089 and STA8090 LNAs. The compact, integrated device typically replaces a matching network containing up to five capacitors, resistors, and inductors, as well as two discrete protection devices. Designers can also leverage PCB-track specifications provided in the device datasheet for optimal performance.

The ESD protection provided complies with IEC 61000-4-2 (C = 150pF, R = 330Ω) and exceeds level 4: 8kV for contact discharge and 15kV for air discharge. The device also withstands 2kV pulse voltage in accordance with MIL STD 883C (C = 100pF, R = 1.5 kOhm).

The BPF8089-01SC6 is suitable for use in portable satellite receivers for GPS, Galileo, GLONASS, BeiDou, and QZSS constellations, which may be used in a number of applications including consumer satellite navigation, radio base stations, drones, and tracking of assets or livestock.

The IC is part of ST’s ASIP (Application Specific Integrated Passives) product range. It is housed in a SOT23-6L package that is compatible with automatic optical inspection. It is in production now.

http://www.st.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration