Ericsson aims for customised 5G with RAN Slicing software

Software released by Ericsson enables communications service providers to deliver innovative 5G use cases to consumers and enterprises. The Ericsson 5G RAN Slicing software is built on the company’s radio expertise and a scalable and flexible architecture, explained the company. It will support customised business models and growth with end-to-end network slicing capabilities needed to deliver different services over a common infrastructure.

The commercially available 5G RAN Slicing allocates radio resources at 1ms scheduling and supports multi-dimensional service differentiation handling across slices. This strengthens end-to-end slicing capabilities for dynamic resource management and orchestration, says Ericsson.

Network slicing supports multiple logical networks for different service types over one common infrastructure. It is a key enabler for unlocking 5G revenue opportunities such as enhanced video, and in-car connectivity, and extended reality. A report by Ericsson estimates $712billion in an addressable consumer market for service providers by 2030. The addressable market for network slicing alone in the enterprise segment is projected to be $300billion by 2025. Service providers are looking to maximise returns on investments by targeting innovative use cases such as cloud gaming, smart factories and smart healthcare.

Per Narvinger, head of Product Area Networks at Ericsson said: “Ericsson 5G RAN Slicing dynamically optimises radio resources to deliver significantly more spectrum-efficient radio access network slicing. . . It boosts end-to-end management and orchestration support for fast and efficient service delivery. This gives service providers the differentiation and guaranteed performance needed to monetise 5G investments with diverse use cases.”

Network slicing is one of the major 5G deployment models. Ericsson has ongoing 5G network slicing engagements for RAN, transport, core network and orchestration across the globe involving use cases for the consumer segment and enterprises/industry verticals such as video-assisted remote operations, AR/VR, TV/media for sports event streaming, cloud gaming, smart city, and applications for Industry 4.0 and public safety.

The Ericsson 5G RAN Slicing software offers a multi-dimensional service differentiation handling that allows for the effective use of dynamic radio resource partitioning, slice-aware quality of service (QoS) enforcement, and slice orchestration functionality for service-level agreement (SLA) fulfilment. It dynamically shares radio resources at 1ms scheduling for best spectrum efficiency and ensures end-to-end network slice management and orchestration support for fast service delivery and supports business models for virtual, hybrid and dedicated private networks​.

The solution can also power use cases for mission-critical and time-critical communication services.

http://www.ericsson.com

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STMicroelectronics simplifies portable GNSS receiver design

Claimed to simplify design and save real estate in global navigation satellite system (GNSS) receivers, the BPF8089-01SC6 RF is an integrated impedance-matching and protection IC from STMicroelectronics.

Integrating the impedance-matching and electrostatic discharge (ESD) protection circuitry, typically implemented using discrete components, results in a much smaller footprint, says STMicroelectronics.

The BPF8089-01SC6 provides a 50 Ohm matched interface between the receiver’s antenna and low noise amplifier (LNA), and is ready to use with ST’s STA8089 and STA8090 LNAs. The compact, integrated device typically replaces a matching network containing up to five capacitors, resistors, and inductors, as well as two discrete protection devices. Designers can also leverage PCB-track specifications provided in the device datasheet for optimal performance.

The ESD protection provided complies with IEC 61000-4-2 (C = 150pF, R = 330Ω) and exceeds level 4: 8kV for contact discharge and 15kV for air discharge. The device also withstands 2kV pulse voltage in accordance with MIL STD 883C (C = 100pF, R = 1.5 kOhm).

The BPF8089-01SC6 is suitable for use in portable satellite receivers for GPS, Galileo, GLONASS, BeiDou, and QZSS constellations, which may be used in a number of applications including consumer satellite navigation, radio base stations, drones, and tracking of assets or livestock.

The IC is part of ST’s ASIP (Application Specific Integrated Passives) product range. It is housed in a SOT23-6L package that is compatible with automatic optical inspection. It is in production now.

http://www.st.com

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Mini-ITX motherboard is based on 10th generation Intel Core processor

At the heart of the Wade-8212 Mini-ITX motherboard is Intel’s 10th generation Core processor (formerly known as Comet Lake S), and the Intel Q470E chipset.

Portwell says that the processor combination provides enhanced CPU and graphic performance and has the capability for flexible I/O expansion.

The Wade-8212 is the latest addition to Portwell’s family of Mini-ITX form factor embedded system boards. According to Brian Lai, Portwell’s product manager, it is designed to provide powerful multi-tasking function and enhanced high-definition imaging capability with fast network connectivity of 2.5Gbit. I/O and expansion ports support multiple peripheral devices for industrial automation, robotic manufacturing, automated test equipment, semiconductor equipment, factory process control, automated guide vehicle (AGV), medical equipment, communications appliances, IoT gateway and smart transportation applications, says Portwell.

In addition to the Intel Q470E chipset and the latest 10th Intel Core i9 / i7 / i5 / i3 / Pentium / Celeron processor, there are up to 10 cores/20 threads (35W to 80W) in the LGA1200 socket. Wade-8212 also features dual-channel DDR4 2400 / 2666 / 2933MHz non-ECC SDRAM on two SO-DIMM sockets up to 64Gbyte. There is 1.0 and 2.5Gbit Ethernet (Intel I219LM and I225LM) and five COM ports – two of which are BIOS-configurable. The Mini-ITX embedded board also has six USB 3.2 Gen 1, four USB 2.0, four SATA III ports, as well as general purpose I/O and an audio jack. For expansion, the Wade-8212 offers one PCIe Gen 3 x16, one M.2 key E 2230 for wireless modules (Bluetooth/Wi-Fi), one M.2. key M 2242 / 2260 / 2280 for SSD, one M.2 key B 3042 and SIM card socket for 4G / 5G interfaces. The triple display interfaces include one DP 1.2 (4K resolution), one HDMI 2.0a (4K resolution), one VGA (resolution up to 1920×1200), one LVDS (resolution up to 1920 x 1200) connector on board, ATX power and onboard TPM 2.0 for security.

The Wade-8212 offers more than 20 per cent more cores than previous generation processors, up to 31 per cent better performance on multi-tasking compute-intensive applications, and as much as 11 per cent improved performance on single-task compute-intensive applications, said Brian Lai, product manager, at Portwell.

http://www.portwell.eu

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Renesas boosts AI with Arm Cortex-A55 on RZ/G2L microprocessors

Renesas has announced the expansion of its RZ/G2 general-purpose 64-bit microprocessors, with improved artificial intelligence (AI) processing.

The company has added three entry level microprocessor models built around the Arm Cortex-A55 core. The RZ/G2L, RZ/G2LC, and RZ/G2UL join the mid- to high-end RZ/G2E, RZ/G2N, RZ/G2M, and RZ/G2H microprocessors. Renesas adds that the seven RZ/G2 microprocessors provide scalability from entry-level to high-end design.

The RZ/G2Lx microprocessors’ Arm Cortex-A55 CPU core delivers approximately 20 per cent improved processing performance compared with the previous Cortex-A53 core. It also provides approximately six times faster essential processing for AI applications, says the company.

The latest microprocessors integrate camera input interfaces, a 3D graphics engine, and a video codec, for human machine interface (HMI) applications, such as multimedia processing, graphical user interface (GUI) rendering and AI image processing. The microprocessors also feature the Cortex-M33 core, to perform real-time processing for tasks such as sensor data collection without the need for external microcontrollers.

Hiroto Nitta, senior vice president and head of SoC Business, IoT and Infrastructure business unit at Renesas, explained that, with the entry-level products, Renesas is accelerating adoption of the Linux OS on high-performance microprocessors, for innovation to improve performance and enhance functionality in HMI devices, while driving down the overall cost.

“With AI transforming our daily lives, greater on-device compute capabilities are required to provide real-time insights for billions of IoT endpoints,” said Dipti Vachani, senior vice president and general manager, of Automotive and IoT at Arm. “By incorporating Arm technology in its latest 64-bit microprocessors, Renesas is accelerating the adoption of endpoint AI by enabling higher-performance IoT devices capable of processing more intelligence on the device,” he added.

The new entry-level RZ/G2L microprocessors feature error checking and correction (ECC) protection for both on-chip memory and external DDR memory. There is also a Verified Linux Package (VLP) featuring a Civil Infrastructure Platform (CIP) Linux – an industrial-grade Linux offering guaranteed support and security maintenance for more than 10 years. This makes it possible to reduce future maintenance costs, says Renesas. Additionally, support for security functions means that customers can also confidently adopt the RZ/G2L microprocessors for industrial applications requiring high reliability and extended service life, making it possible to bring products to market quicker.

For cases where more sophisticated AI functionality may be required, Renesas plans to enhance the functions and performance of the RZ/G2L microprocessors with its DRP-AI, AI accelerator.

Samples of the new microprocessors MPUs are shipping today, with mass production scheduled to commence sequentially beginning in August 2021.

An evaluation board can be reserved to get an early start evaluating applications for RZ/G2L microprocessors. Reference designs (circuit diagrams and board layout data) are available now.

Renesas is currently developing power management IC (PMIC) products optimised for the RZ/G2L Group. These are scheduled for release later this year.

 http://www.renesas.com

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