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Renesas and LUPA develop open automotive smart camera

Thu, Feb 25, 2021

Partners in the development of the EagleCAM module, Renesas Electronics and LUPA-Electronics, describe it as an open turnkey solution, delivering flexible, high-performance perception.

The open front camera solution features Renesas’ R-Car V3H and R-Car V3M SoCs and supports low- to high-end front camera applications with extensions for surround view, driver monitoring, and augmented reality. It also includes Renesas’ automotive power management ICs (PMICs). The update of the R-Car V3H microcontroller means that new turnkey solutions will benefit from the improved CNN performance of up to 3.7 trillion operations per second, ASIL-C capability of the real-time domain and camera support of up to 8Mpixels. EagleCAM features a pre-validated hardware design, shortening the time required to reach mass production. Customers can access best-in-class perception stacks that offer shorter turnaround time or stacks based on emerging technologies, allowing them to achieve the best fit for their application needs.

The scalable camera platform targets the latest Euro NCAP and C-NCAP safety requirements, such as automatic emergency braking, forward collision warning, lane keeping assist, and traffic sign recognition. EagleCan enables OEMs and Tier 1s to differentiate and extend their offering by integrating their proprietary or third-party software to add driving features, explains Renesas.

Instead of the conventional ‘black box’ approach, Renesas and LUPA say the EagleCAM delivers flexible, high-performance perception while shortening time to market and reducing the bill of materials (BOM) costs.

“The combination of LUPA’s EagleCAM and Renesas R-Car SoCs delivers scalable and functional safety-compliant, open advanced driver assistance systems (ADAS) solutions that enables flexible feature integration, allowing customers to achieve quicker time to production,” said Naoki Yoshida, vice president, Automotive Digital Products Marketing Division, Automotive Solution Business Unit, at Renesas. “We are excited that our collaboration will make it easier for our joint customers to develop smart camera applications and bring NCAP and L2+ functionality to their vehicles more quickly and confidently,” he added.

The EagleCAM camera featuring R-Car SoCs are available now from LUPA.

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https://www.renesas.com

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Predictive maintenance evaluation kit monitors smart buildings

Thu, Feb 25, 2021

Sensors, microcontroller and embedded security hardware, software and CloudFormation templates are gathered together in the Xensiv predictive maintenance evaluation kit which has been developed by Infineon Technologies with Klika Tech, the IoT service provider.

The evaluation kit is powered by the cloud service provider AWS.

The kit is intended to be a starting point for quick and easy evaluation of sensor-based condition monitoring and predictive maintenance. Target applications include heating, ventilation and air conditioning (HVAC) equipment as well as motors, fans, drives, compressors, refrigeration and other components of smart buildings.

“Together with AWS and Infineon we assembled an end-to-end HVACR [HVAC and refrigeration] predictive maintenance evaluation kit and anomaly detection solution that enables building operators to evaluate features to proactively respond to issues before they become costly failures,” said Gennadiy Borisov, president and co-CEO of Klika Tech. “

The Xensiv predictive maintenance evaluation kit is an extension for the XMC4700 XMC Relax kit. It can be equipped with Xensiv sensor satellite boards with a range of sensors for data collection and condition monitoring. Sensor options include an airflow measurement based on the Xensiv DPS368 barometric pressure sensor, current measurement at the fan and compressor based on the Xensiv TLI4971 current sensor, position sensing of the motor with the Xensiv TLI493D-W2BW 3D magnetic sensor or sound anomaly detection with the Xensiv IM69D130 MEMS microphone.

There is also the option for linear movement vibration measurement with the Xensiv TLE4997E linear Hall sensor, open and closed lid detection with the Xensiv TLE4964-3M Hall sensor, speed and direction measurement with the Xensiv TLI4966G double Hall sensor or data processing with the XMC industrial microcontroller XMC4700 powered by the Arm Cortex-M4. There is also the option for secured connection and authentication and multi-account registration with Optiga Trust M embedded security.

The software provided in the kit supports the FreeRTOS kernel. AWS Cloud integration is completed by full AWS CloudFormation templates and a software application stack. A graphic user interface (GUI) and basic anomaly detection are also included.

For connectivity, Wi-Fi and Ethernet are integrated on-board, as well as a mikroBUS ClickBoard interface for extended connectivity.

The Xensiv predictive maintenance evaluation kit will be available for selected customers at Infineon’s virtual Embedded Solutions Conference 2021. It will be available to order from distributors in the first half of 2021, says Infineon. A quick start guide, as well as Github and CloudFormation templates will be available for easy and quick set-up.

http://www.infineon.com

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Low power chipset address narrowband/2G applications

Thu, Feb 25, 2021

Completing Sony’ Semiconductor Israel’s Altair cellular IoT portfolio, the ALT1255 is a low power chipset for narrowband IoT (NB-IoT) networks. It is designed to address NB and NB/2G applications.

The NB2 chipset is 5G-ready and designed with an integrated SIM (iSIM), user microcontroller, application layer, and GSM/GPRS fallback modem.

The ALT1255 chipset can be used to develop low-power, cost-sensitive connected devices at a global scale to monitor, manage, and control critical infrastructure, medical devices, logistic trackers, and a large variety of low power, wide area (LPWA) applications.

It was developed in-house and based on the LTE-M/NB ALT1250 chipset, leveraging globally certified NB/2G technology. The chipsets share software architecture, modem application and networking layer, and application programming interfaces (APIs) for integration within the Altair product family.

“Module designs based on the ALT1255 will provide reliable connectivity for smart meters, logistics, telematics, and smart cities applications,” commented Dima Feldman, vice president of product management and marketing at Sony Semiconductor Israel.

The iSIM removes barriers related to cost, size, and power, and adds an additional layer of security, says the company. The GSM/GPRS modem fills the gaps in LPWA network coverage and allows future-proof technology deployment in countries with mixed 2G/NB coverage.

The ALT1255 also integrates a low power Arm Cortex-M4 microcontroller. This is separated from the modem functionality and designed to run a variety of IoT and sensing applications. An adaptation layer interconnects within the existing ecosystem.

The chipset provides secure cloud connectivity, using communication protocols such as the power-efficient constrained application protocol (CoAP) and the lightweight machine to machine (LWM2M) protocol.

The ALT1255 is commercially available now. It has received the Global Certification Forum (GCF) certification, which allows customers to accelerate module and device certification.

Sony Semiconductor Israel Ltd. (formerly known as Altair Semiconductor) provides small, highly integrated LTE CAT-M and NB-IoT chipsets, featuring low power consumption, hardware-based security, and a carrier-grade integrated SIM (iSIM), all 5G ready.

Its low power and cost-efficient chipsets are for a range of industrial and consumer IoT applications such as trackers, smart meters, smart labels, wearables, and vehicle telematics. The Altair chipsets are commercially deployed on the world’s most advanced LTE networks, including AT&T, Deutsche Telekom, Docomo, KDDI, SoftBank, Telstra, Verizon, and Vodafone.

https://altair-semi.com

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Xilinx tackles data centre evolution with SmartNICs

Wed, Feb 24, 2021

Addressing the demands of the modern data centre, Xilinx has introduced a family of Alveo SmartNICs.

The Alveo SN1000 is the industry’s first composable SmartNIC offering software-defined hardware acceleration for all function offloads, says Xilinx. They are designed to optimise networking performance by directly offloading CPU intensive tasks. They have an open architecture and use the Vitis Networking platform and industry standard, high-level programming languages such as P4, C, and C++. Software developers can create network functions, protocols, and applications that operate in hardware and quickly compose or adapt existing, network functions to accommodate new protocols and applications without the expenditure incurred with hardware replacements.

The SN1000 SmartNICs provide software-defined hardware acceleration for networking, security, and storage offloads, such as Open vSwitch and virtualisation acceleration (Virtio.net). Security offloads include IPsec, kTLS and SSL/TLS and accelerated storage applications including Virtio.blk, NVMe™ over TCP, Ceph, and compression and crypto services.

The SmartNICs are based on the Xilinx 16nm UltraScale+ architecture and powered by the low-latency Xilinx XCU26 FPGA and a 16-core Arm processor. SN1000 SmartNICs deliver dual-QSFP ports for 10/25/100Gbits per second connectivity with what is claimed to be leading small packet performance and a PCIe Gen 4 interconnect. The SN1000 is offered in a full height, half length (FHHL) form factor in a 75W power envelope.

The Alveo SN1000 SmartNIC will be generally available in March 2021.

At the same time as introducing the SmartNIC family, Xilinx also introduced Smart World AI video analytics applications, an accelerated algorithmic trading reference design and the Xilinx App Store.

The AI video analytics platform is supported by an ecosystem of partner solutions for complex, latency-sensitive AI video inferencing applications. The Xilinx Smart World platform is powered by the Video Machine-learning Streaming Server (VMSS) and delivers whole application acceleration to support multiple neural networks on a single Alveo accelerator card at deterministic sub-100ms pipeline latency.

Today, the Xilinx Smart World ecosystem solutions available include a smart city and smart retail solution by Aupera which combines Aupera’s intelligent, video processing with Alveo accelerators. There is also Mipsology’s toolset for easy migration of existing AI applications from GPU-based architectures to the Alveo platform. A third partner, DeepAI, offers AI training at the edge on Alveo accelerators with up to a 10x performance per cost advantage compared to GPU-based solutions.

The Vitis development platform now includes an accelerated algorithmic trading (AAT) reference design which gives software developers the ability to quickly and cost-effectively deliver sub-microsecond trading performance without the need for custom hardware development.

AAT, implemented on Alveo accelerator cards, provides a modular design that includes all the necessary components for an end-to-end, low-latency trading solution. Each module can be customised using C and C++ in the Vitis platform to meet each firm’s specific needs.

The AAT reference design is available today at no cost for Alveo accelerator card customers.

The first FPGA app store has been announced by Xilinx. It has ready-to-deploy accelerated applications from Smart World AI video analytics to anti-money laundering and live video transcoding. Developed by Xilinx ecosystem partners, the containerised pre-built applications provide an easy way to evaluate, purchase and deploy accelerated applications in minutes, says Xilinx.

http://www.xilinx.com

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Renesas and LUPA develop open automotive smart camera

Predictive maintenance evaluation kit monitors smart buildings

Low power chipset address narrowband/2G applications

Xilinx tackles data centre evolution with SmartNICs

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