IoT

Advantech announces innovative solutions for edge computing and industrial applications

Wed, May 08, 2024

Advantech has introduced a new lineup of industrial servers and solutions, harnessing the power of the 14th Generation Intel Core processors. This lineup includes the ASMB-588, ASMB-788, ASMB-610V3, and the Edge Accelerator Server HPC-6120 +ASMB-610V3, all designed to improve industrial and edge computing applications.
Leveraging Intel Core processors, their products are built to handle demanding AI and graphics workloads. These processors merge the performance profile and power ranges of the 13th Gen Intel Core mobile processors with LGA socket flexibility, making them ideal for developers needing high AI and graphics performance.
Support up to DDR5 5600 module, the new range maximises performance and efficiency. The inclusion of PCIe 5.0 and Thunderbolt 4 ensures future-proof connectivity and fast data transfer rates, catering to diverse industrial requirements.

ASMB-588: This micro-ATX server board, ideal for Automated Optical Inspection (AOI) systems, integrates with HPC-5000 or HPC-7120 chassis. It features 1 x PCIe 5.0 x16 and 2 x PCIe 4.0 x4 slots, providing substantial bandwidth and flexibility for various industrial applications. The board’s construction and thermal design ensure reliable performance in demanding environments.

ASMB-788: Tailored for high-end industrial applications requiring exceptional computing power, this ATX server board offers a unique blend of performance and expandability. It includes 1 x PCIe 5.0 x16, 2 x PCIe 4.0 x4, 5 x SATA 3.0, and 1 x M.2 connector (PCIe), making it adaptable for complex tasks like machine learning and data analysis. Compatible with HPC-8208 and HPC-7484 chassis, the ASMB-788 stands out for its high connectivity and storage options, providing industrial systems with the scalability they need for future growth.

Edge Accelerator Server HPC-6120 + ASMB-610V3: This server solution is optimised for tackling the unique challenges of edge computing. Supporting up to 4 expansion cards, it is designed to complete data-intensive tasks efficiently. It’s an ideal fit for AI, industrial broadcasting, and complex computational workloads. This 1U edge accelerator server provides a combination of processing power and storage capacity, enabling rapid data processing and real-time analytics in edge deployments.

http://www.advantech.com

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Panasonic introduces new Amorton indoor solar cell series

Wed, May 01, 2024

Panasonic’s hydrogenated amorphous silicon (a-Si:H) solar cells, known as Amorton, power indoor and outdoor applications like IoT devices, watches, sensor nodes, asset trackers, or remote controls. Amorton can harvest energy reliably and sustainably even in low light and artificial light environments.

Now Panasonic introduces its latest Amorton solar cell series: Named AMG-1401C and AMG-1701C, the new products benefit from a nearly perfect black-reflective surface and much higher efficiency (+20%). These breakthroughs have been made possible thanks to an optimised production process, which significantly increased the active area compared to the previous generation. The result is a 20% increase in efficiency, making the new AMG-series one of the most efficient indoor amorphous solar cells on the market today. The AMG-1401C and AMG-1701C, which are based on glass substrates, are 1.1mm thin, generate approx. 8uW/cm2 at 200lux per active area.

The external dimensions are only slightly larger than the active area, which means the space and material consumption in the final application can be optimized. The AMG-1401C with external dimensions of 41.4mm x 26.1mm generates a maximum of 77.8uW at 200 lux. The cell voltage is 2.2V, which means it can be combined with many power management ICs available in the market.

 https://industry.panasonic.eu/

 

 

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Embedded security using Microchip’s PIC32CK 32-bit MCUs with hardware security module

Tue, Apr 30, 2024

New legislation takes effect in 2024, mandating stricter requirements on cybersecurity on everything from consumer IoT devices to critical infrastructure. Meeting these new security compliance requirements from a product and supply chain perspective can be complex, costly and time-consuming. To provide developers with an embedded security solution that allows them to design applications that comply with these requirements, Microchip has announced the new family of PIC32CK 32-bit microcontrollers (MCUs) with an integrated Hardware Security Module (HSM) subsystem and Arm Cortex-M33 core featuring TrustZone technology to help isolate and secure the device.

The PIC32CK SG is the first 32-bit device on the market that combines the strong security of an HSM with TrustZone technology, a hardware-based secure privilege environment. Microchip’s latest innovation for mid-range MCUs provides designers with a cost-effective embedded security solution for their products that meets the latest cybersecurity mandates. The inclusion of an HSM provides a high level of security for authentication, secure debug, secure boot and secure updates, while TrustZone technology provides an additional level of protection for key software functions. The HSM can accelerate a wide range of symmetric and asymmetric cryptography standards, true random number generation and secure key management.

The PIC32CK MCUs from Microchip are designed to support ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards. For increased flexibility and cost efficiency, the PIC32CK MCU family offers a wide range of options to tune the level of security, memory and connectivity bandwidth based on the end application’s requirements. Options include up to 2 MB dual-panel Flash and 512 KB SRAM, with various connectivity options like 10/100 Ethernet, CAN FD and USB.

For product supply chains that require additional security and safety protection such as in industrial designs, medical devices, home appliances and consumer IoT devices, the PIC32CK will be supported with Microchip’s Trust Platform Design Suite for provisioning as a service. This platform enables the secure factory provisioning of keys, certificates and IP without the need to reveal these secrets within the supply chain.

The 32-bit PIC32CK MCU family is supported by Microchip’s software platforms including MPLAB® Harmony v3 and Trust Platform Design Suite. The PIC32CK family is also supported by the PIC32CK SG and PIC32CK GC Curiosity Ultra Development Boards including the EV33A17A and EV44P93A.

https://www.microchip.com.

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New Qualcomm-built advanced video processor by Teledyne FLIR powers AI at the Edge

Thu, Apr 18, 2024

Teledyne FLIR has announced the Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism AI and computational imaging at the edge.

The AVP incorporates the latest Qualcomm QCS8550, the most advanced mobile processor chip from the leader in mobile, automotive, and robotics system-on-chip (SoC) technology. The AVP provides best-in-class artificial intelligence (AI) performance within a small, lightweight, and low-power module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.

AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson and Neutrino thermal infrared imaging camera modules and a wide range of popular visible cameras. Trained on the world’s largest thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security. Prism ISP is a comprehensive set of image processing algorithms that include super resolution, image fusion, atmospheric turbulence removal, electronic stabilisation, local-contrast enhancement, and noise reduction.

“The new AVP is the most powerful and SWaP-optimised processor on the market today, running AI workloads up to five times faster than competitive offerings,” said Dan Walker, vice president of product management, Teledyne FLIR. “The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.”

The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.

https://www.flir.com/avp.

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