Embedded security using Microchip’s PIC32CK 32-bit MCUs with hardware security module

New legislation takes effect in 2024, mandating stricter requirements on cybersecurity on everything from consumer IoT devices to critical infrastructure. Meeting these new security compliance requirements from a product and supply chain perspective can be complex, costly and time-consuming. To provide developers with an embedded security solution that allows them to design applications that comply with these requirements, Microchip has announced the new family of PIC32CK 32-bit microcontrollers (MCUs) with an integrated Hardware Security Module (HSM) subsystem and Arm Cortex-M33 core featuring TrustZone technology to help isolate and secure the device.

The PIC32CK SG is the first 32-bit device on the market that combines the strong security of an HSM with TrustZone technology, a hardware-based secure privilege environment. Microchip’s latest innovation for mid-range MCUs provides designers with a cost-effective embedded security solution for their products that meets the latest cybersecurity mandates. The inclusion of an HSM provides a high level of security for authentication, secure debug, secure boot and secure updates, while TrustZone technology provides an additional level of protection for key software functions. The HSM can accelerate a wide range of symmetric and asymmetric cryptography standards, true random number generation and secure key management.

The PIC32CK MCUs from Microchip are designed to support ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards. For increased flexibility and cost efficiency, the PIC32CK MCU family offers a wide range of options to tune the level of security, memory and connectivity bandwidth based on the end application’s requirements. Options include up to 2 MB dual-panel Flash and 512 KB SRAM, with various connectivity options like 10/100 Ethernet, CAN FD and USB.

For product supply chains that require additional security and safety protection such as in industrial designs, medical devices, home appliances and consumer IoT devices, the PIC32CK will be supported with Microchip’s Trust Platform Design Suite for provisioning as a service. This platform enables the secure factory provisioning of keys, certificates and IP without the need to reveal these secrets within the supply chain.

The 32-bit PIC32CK MCU family is supported by Microchip’s software platforms including MPLAB® Harmony v3 and Trust Platform Design Suite. The PIC32CK family is also supported by the PIC32CK SG and PIC32CK GC Curiosity Ultra Development Boards including the EV33A17A and EV44P93A.

https://www.microchip.com.

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New Qualcomm-built advanced video processor by Teledyne FLIR powers AI at the Edge

Teledyne FLIR has announced the Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism AI and computational imaging at the edge.

The AVP incorporates the latest Qualcomm QCS8550, the most advanced mobile processor chip from the leader in mobile, automotive, and robotics system-on-chip (SoC) technology. The AVP provides best-in-class artificial intelligence (AI) performance within a small, lightweight, and low-power module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.

AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson and Neutrino thermal infrared imaging camera modules and a wide range of popular visible cameras. Trained on the world’s largest thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security. Prism ISP is a comprehensive set of image processing algorithms that include super resolution, image fusion, atmospheric turbulence removal, electronic stabilisation, local-contrast enhancement, and noise reduction.

“The new AVP is the most powerful and SWaP-optimised processor on the market today, running AI workloads up to five times faster than competitive offerings,” said Dan Walker, vice president of product management, Teledyne FLIR. “The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.”

The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.

https://www.flir.com/avp.

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Advantech launches wireless LoRaWAN sensors

Advantech has announced the launch of its EVA-2000 series, a new line of smart wireless sensors incorporating LoRaWAN technology. This series marks a significant advancement in the field of industrial sensing applications, offering long-range data transmission combined with power efficiency. The EVA-2000 series, comprising of diverse sensor models from temperature and humidity to water leak detection, is designed for the demanding sectors of industrial automation, equipment monitoring, and environmental monitoring.

At the heart of the EVA-2000 series’ functionality lies their ability to efficiently gather and transmit data wirelessly over extended distances through low-power, wide area LoRaWAN technology. This capability is further enhanced by their low power consumption, attributed to their double 3.6v Li-ion batteries, ensuring prolonged battery life. The adherence to LoRaWAN standards not only promises scalability and cost-effectiveness in the deployment of a multitude of devices but also simplifies integration within existing systems. Moreover, each unit in the series uses a built-in embedded antenna in a compact design that facilitates flexible installation across varied environments.

Standout products in this series include the EVA-2210, which is a 3-phase current meter equipped with 3 x 75A clamp-on CT. EVA-2210 is adept at measuring equipment currents up to 75A in diverse applications such as pumps, fan motors, compressors, computers, and servers. Eliminating the need for complex wiring, the EVA-2210 significantly enhances energy management efficiency for distributed devices.

Further enhancing the versatility of the series are the EVA-2310 and EVA-2311 models. The EVA-2310 is a temperature and humidity sensor for monitoring environments in offices, hospitals, classrooms, and warehouses.

The EVA-2311 uses a PT1000 round head heat probe sensor, which extends its utility with a 2m length cable and IP67 rating, making it suitable for extreme temperature detection ranging from -70°C to 200°C.

The EVA-2510 model is a water leakage sensor, which serves as a sensor for use in cooling and water treatment systems, detecting and alerting operators to potential issues before they happen. Such models are indispensable for industrial processes that rely on precise environmental parameter measurements.

All the EVA-2000 series products are seamlessly compatible with the Advantech WISE-6610, industrial LoRaWAN gateway, allowing for easy remote creation, synchronisation of channel settings, and data rate adjustments. Once connected, application settings such as data update cycles and thresholds can be configured via downlink commands from WISE-6610, further streamlining the monitoring and management process.

https://www.advantech.com

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Insight SiP launches miniature Wi-Fi 6 combo module with integrated antennas

Insight SiP has launched its ISP5261 Wi-Fi 6 module at Embedded World 2024. This module acts as a fully functioning Bluetooth LE and Wi-Fi radio node, capable of a long autonomous operation on battery power. It can form the core of an autonomous IOT device requiring Bluetooth LE and Wi-Fi connectivity.

This device offers integration and miniaturisation of RF technologies, using System in Package technology. The device also benefits from Insight SiP’s proprietary “Antenna-in-Package” techniques.

The module is based on NXP Semiconductors RW612 single-chip Wi-Fi/Bluetooth LE/802.15.4 Wireless MCU System on Chip (SoC). The module integrates a 32-bit ARM Cortex-M33 CPU running at 260 MHz, additional 4 MB of QSPI flash memory, 1.2 MB SRAM as well as analog and digital peripherals. Its powerful processor and ample memory permit this module to be used as the core of a sophisticated IOT application.

Despite the small size of 12 x 12 x 1.8 mm, the module integrates decoupling capacitors, 40 MHz crystal for Wi-Fi and Bluetooth LE and 32.768 kHz crystal for low power timing, DC-DC converters, RF matching circuits and a dual-band (2.4 and 5 GHz) antenna. This module thus offers class leading performance and miniaturisation.

Low power consumption and advanced power management enable battery lifetimes up to several months on AA batteries. Wi-Fi communication is compliant with the Wi-Fi Alliance specifications for Wi-Fi 6 including the following protocols: IEEE 802.11ax/ac/n/a/g/b/e/i/k/v/w.

Bluetooth LE connectivity is compliant with Bluetooth 5.4, enabling Long Range communication. ISP5261 Bluetooth LE section can be used either in peripheral or central roles and can handle up to 16 simultaneous central/peripheral connections. Also supported are the Matter and Thread protocols, allowing easy internet access and support for SmartHome applications.

Security Features are prominent in the module, with an ARM TrustZone processor, and NXP Edgelock hardware security module, supporting Root of Trust, secure communication and update verification.

https://www.insightsip.com

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