Farnell now stocks Murata’s UWB and LoRa modules

Farnell is now offering Murata’s latest UWB and LoRa connectivity modules for convenient wireless integration. These modules are designed to simplify wireless development and certification, making it easier to incorporate wireless capabilities into a wide range of applications.

Murata’s UWB modules provide high-accuracy location functionality with UWB tag and anchor functions in compact packages. These modules feature integrated RF front ends, simplifying the implementation process and reducing the need for extensive RF expertise. This allows developers to seamlessly incorporate advanced location capabilities into their applications..

Additionally, Murata’s LoRa modules offer a compact, integrated solution with an embedded MCU. Developers have the flexibility to utilise the MCU as the Host for an End Node, providing customisation possibilities for various projects.

The technology enables location accuracy in the order of 0.1m for indoor or outdoor applications. The UWB Modules available at Farnell include:

• FiRa certified UWB module, Type 2BP is the ultra small UWB module which includes NXP’s SR150 UWB chipset, clock, filters and peripheral components. Ideally suited for general IoT devices including battery operated devices.
• UWB module with integrated BLE wireless MCU, Type 2AB is designed as ultra-small, high quality and lower power consumption module. It can be operated on the wireless MCU making this a suitable part for wearables and applications where size is critical
• UWB tag module with integrated BLE wireless MCU. Type 2DK is an all-in-one UWB + Bluetooth LE combo module which integrates NXP Trimension SR040 UWB Chipset, NXP QN9090 Bluetooth LE + MCU chipset, on board antenna and peripheral components. Ideally suited for UWB Tag/Tracker which operates by coin-cell battery, and general IoT devices.

The Murata Type 1SJ LoRa Modules are some of the smallest LoRa Modules in the line-up and include the Semtech SX1262 LoRa Connect Transceiver IC and ST Microelectronics STM32L0 MCU to provide customers with a Regulatory Certified Module that can be used as the core of a LoRa End Node product design. The LoRa modules available at Farnell include:

• LoRa OpenMCU Module, Type 1SJ-295 supplied as an OpenMCU configuration to allow custom Application to be flashed to integrated MCU, together with LoRa Stack.
• LoRaWAN Modem Module, Type 1SJ-6868 pre-flashed with modem Firmware and EUI to support LoRaWAN operation by AT Commands.
• LoRa Module Evaluation Kit to support development and verification for both OpenMCU and Modem configurations of Module.

https://uk.farnell.com

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Advantech announces new CoM with Rockchip for embedded vision applications

Advantech has introduced the ROM-6881, a SMARC 2.1 computer-on-module featuring Rockchip’s RK3588 and RK3588J chipsets, featuring eight-core processors, with up to 6.0 TOPS of AI inference capability. The ROM-6881 also supports high-resolution video with 8K@30fps video encoding and 8K@60fps decoding, ensuring efficient, high-quality display and resolution. This module enhances edge IoT applications in autonomous mobile robots (AMRs), medical fields, surveillance, robotics, and beyond.

The ROM-6881 is powered by the Rockchip processor RK3588. It features a total of eight processing cores (4 x Arm Cortex-A76 and 4 x Arm Cortex-A55) that can reach speeds of up to 2.4GHz. All eight cores are built using an advanced 8nm process, providing a 300% increase in performance over the previous RK3399 processor. This ensures optimal computing power tailored for platform management and a diverse range of feature-rich applications. Specifically designed for Edge AI applications, the RK3588 integrates a 6-TOPs NPU accelerator, giving it impressive AI computing capabilities.

The ROM-6881 supports 8K@60fps H.265 and VP9 decoding, as well as 8K@30fps encoding capabilities. Its integrated 3D GPU ensures efficient, high-quality 3D rendering and display of panoramic content. Additionally, the ROM-6881 is equipped to handle four MIPI CSI cameras, two USB 3.0, and three USB 2.0 signals, enabling access to multiple cameras simultaneously. Moreover, the module features a rich array of display interfaces including HDMI, DP, LVDS/DSI, and eDP for up to four screens. The ROM-6881 is well-suited for medical equipment such as endoscopes, hemodialysis, and AI-based in vitro diagnostics (IVD) systems.

Industrial robots and Automated Guided Vehicles (AGVs) often demand solutions that provide high data throughput, low latency, minimal power consumption, and cost efficiency. The ROM-6881 features a variety of interfaces including two gigabit ports, two USB 3.0 ports, three USB 2.0 ports, SATA, and UARTs, making it simple to integrate peripherals such as LiDAR, motors, IMUs, and cameras to maximize AMR efficiency. Moreover, the ROM-6881’s four PCIe 3.0 slots provide flexible expansion, allowing for enhancements in wired networks and the addition of FPGA, Wi-Fi 6, and 5G modules.

The ROM-6881 supports multiple operating systems, including Debian and Android. To facilitate advanced edge AI development, users can leverage the RKNN Toolkit developed by Rockchip. This toolkit handles AI model conversions as well as inference and performance within an Ubuntu PC environment. For robotics applications, the ROM-6881 runs the Robot Operating System (ROS2), providing a flexible framework for development of robotic applications.

http://www.advantech.com

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Raspberry Pi server provides optimised and reliable solutions for industrial and IoT applications

Sfera Labs has announced the first shipments of its new Strato Pi Max flexible and expandable industrial controller based on the Raspberry Pi Compute Module (CM) 4.

The Strato Pi Max stands out with its modular design, DIN rail-mount, Wi-Fi and BLE wireless connectivity, dual Ethernet ports, dual SD, eMMC, and/or SSD storage options, and two USB ports. It’s a versatile module that can support up to four embedded expansion boards, expanding its capabilities to include serial (RS485/RS232) and CAN bus interfaces, digital I/O, additional wireless connectivity, and support for an uninterruptible power supply (UPS).

Strato Pi Max retains isolated RS-485 port, and USB ports with independent power control and fault detection built into existing members of the Strato Pi family and complies with all relevant industry standards for electrical safety, electromagnetic compatibility (EMC), and sustainability.

Strato Pi Max is offered in two versions: Strato Pi Max XS, which supports up to one expansion board, and Strato Pi Max XL, which supports up to four.

Both models embed pre-assembled CM4 boards with up to 8GB RAM and 32 GB eMMC and can be equipped with a high-performance M.2 PCIe SSD.

Strato Pi Max XL can be ordered in the Lite variant, offering enhanced data reliability with the optional dual SD card.

The Strato Pi Max’s modular architecture is a key feature, allowing it to be tailored to each project’s specific needs. The Strato Pi Max XL can support up to eight interfaces for CAN bus or Modbus, demonstrating its adaptability.

Based on open technology and fully compatible with the toolsets, programming languages, and development frameworks available for Raspberry Pi, the new module will allow designers to implement advanced control systems in industrial, commercial, and residential environments in a shorter timeframe and at a lower cost

https://sferalabs.cc/product/strato-pi-max-xl/
https://sferalabs.cc/product/strato-pi-max-xs/

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Infineon extends its AIROC Wi-Fi 6/6E portfolio

Infineon has announced the company’s new AIROC CYW5591x connected microcontroller (MCU) product family. The new family integrates robust, long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4 along with a secured and versatile MCU to allow customers to build cost-optimised, power-efficient, small form-factor products for smart home, industrial, wearables, and other IoT applications. The flexible platform accelerates customers’ time-to-market with ModusToolbox software, RTOS and Linux host drivers, a fully validated Bluetooth stack and multiple sample code examples, Matter software enablement, and support for Infineon’s worldwide partner network.

This flexible device family can be used as the main processor in an IoT device or as a subsystem in more complex designs to fully offload connectivity for IoT applications. The product family is available in three versions: CYW55913 for tri-band (2.4/5/6 GHz), CYW55912 for dual-band (2.4/5 GHz), and CYW55911 for single-band (2.4GHz) support.
Key features
• An Arm Cortex M33 192MHz MCU with TrustZone CC312 with 768 KB SRAM
• Quad-SPI with XIP with on-the-fly encryption/decryption for FLASH and PSRAM
• 1×1 Tri-Band (2.4/5/6 GHz) 20MHz Wi-Fi 6/6E (802.11ax)
• Up to +24 dBm transmit power for Wi-Fi for best-in-class range
• Supports 6 GHz (Wi-Fi 6E) greenfield spectrum for lower congestion and reduced latency
• Matter-over-Wi-Fi support
• Bluetooth Low Energy 5.4 supports Bluetooth low energy 2 Mbps, LE Long Range, Advertising Extensions, and Advertising code selection for LE Long Range
• Bluetooth Low Energy range and power are also optizized with up to +19 dBm transmit power
• Best-in-class LE Longe Range sensitivity of -111.5 dBm
• Extensive peripherals and GPIO support: 3xSCB(I2C/SPI/UART), TCPWM, 7 channel 12-bit ADC, Digital Microphone support, TCM (I2S/PCM), and up to 47 GPIOs
• Hardware support for AES, RSA, ECC, ECDHA, ECDSA, Root-of-Trust
• Multi-layer security supporting lifecycle management, secured boot with firmware authentication and encryption, anti-rollback, crypto key establishment, and management
• PSA Level 2 Certifiable

https://infineon.com

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