Three RF power transistors series target ISM satellite, avionics and radar

Three series expand STMicroelectronics’ STPower family of LDMOS transistors, addressing RF power amplifier applications in commercial and industrial projects.

The high efficiency, low thermal resistance devices combine a short conduction-channel length with a high breakdown voltage for cost-effective, low power consumption but high reliability operation, says ST.

The IDCH and IDDE series are 28V / 32V common-source N-channel enhancement-mode, lateral, field-effect RF power transistors.

The IDCH devices provide output power from 8.0 to 300W and are specifically designed for applications up to 4GHz, including 2.45GHz industrial, scientific, and medical (ISM), wireless infrastructure, satellite communications, and avionics and radar equipment. The LDMOS devices are suitable for all types of modulation formats.

The IDDE series consists of 10 to 700W devices for broadband commercial, industrial, and scientific applications at frequencies up to 1.5GHz. The devices can withstand a load voltage standing wave ratio (VSWR) of 10:1, through all phases. The IDDE LDMOS transistors are suitable for all typical modulation formats, and for most classes of RF power amplifier operation including Class A, Class AB, and Class C. The high efficiency minimises the energy needed to deliver the required output power, resulting in lower operating costs and reduced heat dissipation to simplify thermal management and to enable more compact systems.

In the IDEV series, devices are based on a 50V common-source, N-channel-enhancement-mode, lateral field-effect, RF power transistor technology. The transistors have output power from 15 up to 2.2kW and are designed for ISM applications at frequencies up to 250MHz, including driving high power CO2 lasers, plasma generators, MRI systems, broadcast FM radio transmitters in the 88 to 108MHz range, and avionics and radar applications up to 1.5GHz. They are suitable for all typical modulation formats and for power amplifier operation in Class A, Class AB, and Class C.

The rugged IDEV series is capable of up to 2.2kW continuous wave (CW) output power, from HF (3.0 to 30MHz) frequencies up to 250MHz. The single ceramic package reduces the number of RF power transistors needed in high power applications, such as broadcast transmitters, says ST. Power efficiency greater than 82 per cent minimises system power demand and ensures high reliability with simple thermal management.

There STPower RF LDMOS devices are available in industry standard packages.

http://www.st.com

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AcceleRate arrays support PICMG COM-HPC interconnect data rates

Artificial intelligence (AI) accelerators, ASIC emulators and next-gen edge computing benefit from the PICMG COM-HPC Interconnect, says Samtec, at the release of its AcceleRate HP high performance arrays. AcceleRate HP supports 112Gbits per second PAM4 extreme performance in a micro footprint.

Samtec’s AcceleRate HP high performance arrays feature an open pin field array which maximises grounding and routing flexibility. System architects can route high performance differential pairs, single ended signals and high current voltage rails via the same interconnect.

The 2.2, 2.4 and 2.2mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and with more ground vias around the differential signals.

The arrays include dense 0.635mm pitch, a low profile 5.0 and up to 10mm stack heights. Up to 400 pins are available. Samtec has also published a roadmap to develop arrays with 1,000 or more pins.

The AcceleRate HP high performance arrays are data rate compatible with PCIe 5.0 and 100 GbE. The array has a BGA termination for easy assembly and self-alignment.

Founded in 1976, Samtec is a privately held manufacturer of a broad line of electronic interconnect solutions, including high speed board-to-board, high speed cables, mid-board and panel optics, precision RF, flexible stacking and micro / rugged components and cables.

http://www.samtec.com

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Qi1.3 wireless charging reference design accelerates transmitter development

Following swiftly on the heels of the Wireless Power Consortium (WPC)’s Qi 1.3 specification, Microchip has released a compliant reference design. It includes everything needed to quickly develop a Qi 1.3-certified transmitter, says the company.

The Qi 1.3 specification requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To meet these requirements, Microchip’s wireless charging reference design includes the necessary tools and support for the seamless integration and certification of wireless charging systems in automotive and consumer applications.

The three-coil Qi 1.3 reference design integrates secure storage subsystem software with the wireless power microcontroller and enables custom topologies and foreign object detection (FOD) implementation.

Microchip is a regular member in the Wireless Power Consortium (WPC) and provided expertise during development of the recently released Qi 1.3 specification. Qi 1.3 mandates hardware-based authentication between transmitter and receiving devices for power transfer above 5.0W. By adhering to the new authentication standard, designers can ensure phones receiving 15W are receiving it from a Qi-certified authenticated transmitter to ensure safety.

The reference design includes a Qi controller, Qi application software, provisioned authentication controller that is a WPC-approved secure storage subsystem and crypto software libraries that execute on the Qi controller. It also includes complete schematics, bill of materials, software and design guidelines. Microchip is partnering with Avnet to make evaluation boards for the Qi reference design available to qualified customers around the world.

The reference design also incorporates MIC4605 and MCP14700 gate drivers, MCP16331 and MCP1725 regulators, an MCP6C02 current sense device, an ATA6563 CAN transceiver and an MCP9700 temperature sensor.

Microchip’s dsPIC33C family of devices run the Qi application software and the company also offers the ECC608/TA100 secure storage subsystem provisioned by Microchip as a licensed WPC Manufacturing Certificate Authority.

The Qi 1.3 wireless charging transmitter reference design is available for demonstrations and evaluations for qualified customers. The company will provide a license agreement to access the reference design software. Evaluation boards for these reference design will be available for purchase for qualified customers through Avnet in August 2021.

https://www.microchip.com   

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Mouser Electronics signs global distribution agreement with Telink Semiconductor

Low power radio frequency and mixed signal chips for the IoT from Telink Semiconductor are now available from Mouser Electronics, following the signing of a global distribution agreement.

Mouser will add Telink’s range of SoCs, starter kits and multi-protocol IoT products to its portfolio. Among the highlights of the range are the Telink TLSR827x series of low power, concurrent, multi-protocol IoT devices operating at the ISM 2.4GHz band. The devices support Bluetooth Low Energy 5.1, Bluetooth SIG Mesh, Zigbee, HomeKit, RF4CE, and 2.4GHz proprietary protocols. They are built on a 32-bit RISC-based microcontroller capable of running up to 48MHz and feature up to 32 general-purpose inputs/outputs (GPIOs), including a 14-bit ADC, I²C, SPI, I²S, and stereo audio output.

There is also the TLSR8278 audio RCU (remote control unit) starter kit features a button function and voice command function support and is therefore suitable for RF and IR remote control applications. The starter kit has 27 valid buttons and two-colour indicating LEDs. It also offers Google voice service.

Mouser also offer the TLSR825x series multi-protocol single-chip devices suitable for IoT and human interface device (HID) applications. The low power, concurrent devices support Bluetooth Low Energy 5.0 and up to eight antennae for indoor positioning in addition to standard Bluetooth 5.0 features. Designers can use the TLSR825X devices in a wide range of applications, including wearable devices, wireless toys, advanced remote controls, smart lighting, and smart home products.

Telink’s Kite Mesh Starter Kit is based on the TLSR8258 and features multiple PCBAs to implement Bluetooth Mesh applications. It is suitable for home automation and smart lighting, and includes multiple USB dongles for emulating gateways or mesh nodes, as well as a remote control PCBA to emulate remote controllers or wall switches. The mesh starter kit is supported by a range of PC tools and a software development kit to support rapid development of mesh applications.

https://www.mouser.com

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