ST and Rosenberger unite to develop high-speed contactless connector based on 60GHz wireless technology

STMicroelectronics and Rosenberger, a leading manufacturer of impedance-controlled and optical connectivity solutions, are to collaborate on a contactless connector for ultra-reliable, short-range, point-to-point full-duplex data exchanges in industrial and medical applications.

Rosenberger’s RoProxCon, leverages ST’s 60GHz RF transceiver, the ST60A2, to deliver high-speed data transmission while providing immunity to movement, vibration, rotation and contaminants such as moisture and dust, which can disrupt conventional pin-and-receptacle interconnects.

The STMicroelectronics ST60A2 offers reliable, point-to-point, high-data-rate transmission of up to 6.25 Gbps over distances of a few centimetres at low power. The new connector will suit applications in smart factories, medical technology, connected devices, office equipment, conveyer technology and renewable energies.

Operating over an extended temperature range of -40 to +105 degrees C, the chip ST60A2 is suited to industrial markets. With a 2.2 x 2.2 mm package footprint, the chip offers an ultra-low power consumption of 70mW for a reliable, completely contactless link.

“Pairing ST’s contactless connectivity technology with our interconnect expertise and antenna-design knowledge enabled us to create a first-of-its-kind module that transmits full duplex data at up to 6 Gbps with complete rotational freedom,” said Folke Michelmann, executive vice-president medical and industries at Rosenberger.

“In working with ST, we see limitless application possibilities for our connector, which provides high-reliability and high-throughput at low power.”

STMicroelectronics RF&Communications division general manager Laurent Malier said: “We developed the ST60A2 contactless transceiver to allow customers to create reliable, high data-rate, extremely power-efficient wireless links. Rosenberger’s expertise in interconnects combined with our RF chip is an outstanding example of the value of the technology.”

“Customers across the full range of electronics applications have expressed interest in this transceiver and several have shared their need for a module that includes the antenna.”

Rosenberger’s portfolio includes solutions in high-frequency, high-voltage, and fibre optic technology for mobile communication networks, data centres, test and measurement applications, automotive electronics as well as for high-voltage contact systems, medical electronics an aerospace engineering.

As independent device manufacturer, STMicroelectronics works with more than 100,000 customers and thousands of partners to design and build products, solutions and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world.

For more information go to http://www.rosenberger.com and http://www.st.com

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R&S FSPN offers dedicated phase noise analysis and VCO testing

For high speed, real-time phase noise measurements using sources that require high stability in demanding applications, the new R&S FSPN phase noise analyser and VCO from Rohde & Schwarz offers sensitivity, accuracy and reliability.

Rohde & Schwarz designed the new R&S FSPN phase noise analyser and VCO tester for production and design engineers who characterise sources such as synthesizers, VCOs, OCXOs, and DROs. Providing high sensitivity and measurement speed, the R&S FSPN suits demanding phase noise and VCO analysis in development and production.

The R&S FSPN comes in two models, one covers the frequency range from 1 MHz to 8 GHz and the other from1 MHz to 26.5 GHz, addressing radar and satellite applications in the C band, X band, Ku band, and the complete K band.

Catering to measurement challenges in these fields, the R&S FSPN expands the Rohde & Schwarz phase noise product portfolio which already contains the R&S FSWP phase noise spectrum and signal analyser.

The R&S FSPN shares R&S FSWP features such as low noise internal local oscillators coupled with real-time cross correlation engines for increased measurement sensitivity.

Cross-correlation sensitivity gains can be viewed in real-time in result traces, allowing users to adjust the trade-off between measurement speed and sensitivity to meet their application requirements.

Users in production need just a few correlations to measure high-quality oscillators, synthesizers or VCOs with high throughput. By increasing the number of correlations, users in research and development can characterise the most sensitive commercially available synthesisers and oscillators. Simultaneous device frequency and phase settling times can be measured with up to 8 GHz of real-time analysis bandwidth.

To investigate oscillator long-term frequency stability, the R&S FSPN calculates the Allan variance in the time domain at fixed intervals and uses phase noise measurements to apply cross-correlations and suppress spurs.

The analyser is also equipped with three ultra-low-noise DC sources to supply and sweep VCOs. The built-in VCO characterisation measurement mode analyses VCO characteristics such as frequency, sensitivity, RF power or current draw versus tuning voltage.

For more information go to https://www.rohde-schwarz.com/product/fspn

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Impulse Embedded supplies Vecow’s EAC-2000 AI series

Impulse Embedded is now supplying the EAC-2000 series from Vecow. These compact, high-performance Edge intelligence systems use the NVIDIA Jetson Xavier NX SOM chip.

The series offers power efficiency in a rugged enclosure with wide temperature and DC power input ranges suitable for AI Vision projects, as well as industrial applications including traffic vision, intelligent surveillance, auto optical inspection, Smart Factory, AMR or AGV.

The NVIDIA Jetson Xavier NX System on Module (SOM) is a 15W processing unit that is built around a 384 Core NVIDIA Volta GPU, with 48 Tensor cores and a Hexa-core NVIDIA Carmel ARM V8.2 64-bit CPU with 6MB of L2 cache.

Capable of offering 21 TOPs of GPU accelerated performance, the Xavier NX can decode up to four 4K30 HEVC video streams while running modern neural networks in parallel. The EAC-2000 series is ready to be deployed out of the box as the Jetson Xavier NX also ships complete with 8GB of LPDDR4x of system memory and 16GB of eMMC storage.

NVIDIA’s Jetpack software suite means the EAC-2100 can be deployed with any application that was developed on a Jetson development kit.

The EAC-2000 is targeted at Edge AI demands and is powered by the NVIDIA Jetson Xavier NX. Packed with I/O, the EAC-2000 comes with one HDMI display port, two Gigabit PoE+ ports with 25W per port, dual Gigabit Ethernet, four USB3.1 and two serial ports.

For wireless connectivity, there is an M.2 E-key for wi-fi and Bluetooth, and an M.2 3042/3052 B-key slot that can support up to 5G cellular comms along with SIM card support and six antenna breakouts. For storage, in addition to the onboard 16GB eMMC included, there is an M.2 2280 M-key, plus an external SD card slot offering a variety of options.

The EAC-2100 expands on the feature set provided by the EAC-2000 and focuses more on in-vehicle usage, with the addition of CANbus support, four Fakra-Z connections for GMSL automotive cameras, and two Gigabit PoE+ ports.

Both models come in a compact wall-mountable metal chassis with EN 50155 and EN 50121-3-2 certification for EMC, a wide -20 degrees C to +70 degrees C operating temperature and 9V to 50V DC power input to meet the demands of a range of industrial automation and Edge applications, as well as support for the rail and in-vehicle market.

For more information go to http://www.impulse-embedded.co.uk

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Intel expands neuromorphic research chip – introducing Loihi 2

Now with one million neurons, the second generation research chip from Intel, Loihi 2, uses a pre-production Intel 4 process. There is also now a software framework for developing neuro-inspired applications.

The second-generation chip improves the speed, programmability, and capacity of neuromorphic processing, comments Mike Davies, director of Intel’s Neuromorphic Computing Lab. Loihi 2 broaden the processing technology’s use in power and latency constrained intelligent computing applications. “We are open sourcing Lava to address the need for software convergence, benchmarking, and cross-platform collaboration in the field, and to accelerate our progress toward commercial viability,” adds Davies.

Neuromorphic computing draws insights from neuroscience to create chips that function more like the biological brain. Researchers hope that it will deliver orders of magnitude improvements in energy efficiency, speed of computation and efficiency of learning across edge applications including vision, voice and gesture recognition to search retrieval, robotics, and constrained optimisation problems. To this end, Intel and partners have demonstrated robotic arms, neuromorphic skins and olfactory sensing projects.

Advances in Loihi 2 allow the architecture to support new classes of neuro-inspired algorithms and applications and provide processing that is 10 times faster than its predecessor. It also exhibits up to 15 times greater resource density (up to one million neurons per chip), and improved energy efficiency.

Fabricated with a pre-production version of the Intel 4 process, the use of extreme ultraviolet (EUV) lithography has simplified the layout design rules compared to past process technologies for rapid development of Loihi 2, says Intel.

The Lava software is an open, modular, and extensible framework, for researchers and application developers to build on each other’s progress and converge on a common set of tools, methods, and libraries. Lava runs seamlessly on heterogeneous architectures across conventional and neuromorphic processors, and is interoperable with a variety of AI, neuromorphic and robotics frameworks.

Developers can begin building neuromorphic applications without access to specialized neuromorphic hardware and can contribute to the Lava code base, including porting it to run on other platforms.

Loihi 2’s greater programmability will allow a wider class of difficult optimisation problems to be supported, including real-time optimisation, planning, and decision-making from edge to data centre systems.

Loihi 2 also improves support for advanced learning methods, including variations of backpropagation, the algorithm of deep learning.

Fully programmable neuron models and generalised spike messaging in Loihi 2 suggest reductions of over 60 times fewer ops per inference compared to standard deep networks running on the original Loihi without loss in accuracy. It incorporates faster, more flexible, and more standard I/O interfaces, including Ethernet interfaces, glueless integration with a wider range of event-based vision sensors, and larger meshed networks of Loihi 2 chips.

http://www.intel.com

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