Jetsys-5320 meets data processing rates for AI, says Elma 

Based on Nvidia’s GPU processing, the Jetsys-5320 enhances inference computing in data driven embedded systems, says Elma Electronic. It provides general purpose GPU inference computing at the edge for deep learning and machine learning operations in AI applications.

It combines the Nvidia-based computation with a rugged, low power computing systems for intelligent video analytics (IVA), virtual reality (VR), augmented reality (AR) and AI at the edge, as well as in unmanned or autonomous vehicles and robots.

According to Elma, it increases visual intelligence throughout transportation and defence applications including high resolution sensor systems, movement tracking security systems, automatic target recognition, threat location detection and prediction as well as machine condition-based monitoring and predictive maintenance, semi-autonomous driving and driver advisory systems.

The JetSys-5320 is based on the Nvidia Jetson TX2i system on module (SoM). Using a dual-core Denver 2 64-bit CPU and quad-core Arm A57 Complex and 256 CUDA cores, Nvidia’s Pascal architecture delivers 1.3TFLOP performance. 

The system also provides HD-SDI, Gigabit Ethernet with PoE, USB 3.0 interfaces for video capture and miniPCIe expansion slots. The JetSys-5320 operates in temperatures from -40 to +71 degrees C, offers IP 67-rated ingress protection and meets MIL-STD-810G for harsh environments.

“AI-based computing is enabling multiple levels of intelligence and safety advancements throughout the embedded computing industry,” said Ram Rajan, vice president of engineering at Elma Electronic. “We’re seeing a huge increase in object detection and tracking, video surveillance, target recognition and condition-based monitoring, so we built an AI platform that could handle the processing requirements for these kinds of applications used in challenging environments.” 

Elma’s other SFF modular embedded computing systems include the ComSys family for communication-based computing and NetSys series for networking applications

Elma Electronic manufactures commercial, industrial and rugged electronic products for embedded systems and application-ready platforms – from components, embedded boards, backplanes, chassis and enclosures, power supplies, to fully integrated subsystems. 

It also offers standard and custom cabinets and enclosures as well as precision components such as rotary switches/encoders, LEDs, front panels and small cases.

The company leverages proven technology based on VITA, PICMG, and other standards-based architectures (i.e. OpenVPX, SOSA, VME, CompactPCI Serial, COM Express and PCIe/104). Elma is also actively engaged in designing solutions for applications requiring smaller footprints. 

http://www.elma.com

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COM Express Type 10 mini module supports up to four cores

Based on the Intel Atom x6000E series processor (Elkhart Lake), the PCOM-BA02VGL is a COM Express Type 10 mini module by Portwell. It features an operating temperature range of -40 to +85 degrees C. 

The PCOM-BA02GL measures 84 x 55mm and is based on the 10nm Intel Atom x6000E series / Pentium / Celeron processors (formerly Elkhart Lake). It supports up to four cores with 4.5 to 12W TDP (thermal dynamic performance) and integrates the Intel Gen 11 UHD graphics engine with triple displays support in 4K resolution. 

The PCOM-BA02GL COM Express module includes optional I/O flexibility, for example Gen 3 PCI-Express and is designed to enable applications using Type 10 COM Express products to rapidly upgrade systems without changing carrier boards or an entire computer system. It also minimises changes in software, says Portwell.

The PCOM-BA02GL COM Express module supports up to 8Gbyte LPDDR4 3200M transfers per second SDRAM soldered onboard memory with integrated in-band ECC which allows more affordable standard memory to be used instead of more expensive ECC memory (ECC or non-ECC can be configured by BIOS), explains Portwell. The module can support up to 3.0GHz in turbo mode, increasing cost-performance effectiveness, adds the company. There are also two USB 3.2 Gen 2 (10Gbits per second), 2.5GbE LAN with the support of Intel TSN (time sensitive networking) and time co-ordinated computing (TCC) for real-time computing and control with low-latency capability. There are also four PCI Express x1 Gen 3 (8.0Gtransfers per second) expansion interfaces. According to Sid Huang, Portwell’s product manager, this is the first time PCIe Gen 3 is available in the lower power processors, ensuring the modules can fulfil most applications that need great expandability and higher throughput such as Wi-Fi, Bluetooth and NVMe modules. The PCOM-BA02GL COM Express module also supports dual 4K high resolution display including DP/HDMI and LVDS/ eDP that delivers up to two times faster graphics performance compared to the previous generation. 

The low power Intel Atom processor x6000E family is housed on the PCOM-BA02GL module board. In this design, Huang explains, the company has maximises COM technology to produce a unit that not outputs under 4.5 to around 12W for fanless applications, but which also supports a wide industrial temperature range and wide voltage input (4.75 to 20V DC). The module conserves energy resources, minimises carbon impact and keeps energy budgets under control, he added.

The compact and rugged PCOM-BA02GL is suitable for mission critical applications in harsh environments, and applications such as industrial automation, factory automation, process control, embedded system for IIoT, edge computing, manufacturing, intelligent gateway, transportation. 

http://www.portwell.eu

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CommAgility unveils 5G small cell standalone reference platform

Wireless Telecom Group’s CommAgility brand has introduced an indoor 5G small cell standalone gNodeB reference platform. The SC-RF2-5Gn78 combines the company’s SmallCellPHY-5G and SmallCellStack-5G software along with its baseband and RF hardware based on NXP’s Layerscape and Layerscape Access SoCs. This solution is pre-integrated and tested to reduce risk and effort.

The SC-RF2-5Gn78 includes two high-quality, flexible, 40MHz bandwidth RF channels, supporting 2×2 MIMO downlink operation. Based on NXP’s Layerscape and Layerscape Access processors, the platform combines 16 Arm Cortex-A72 cores with NXP VSPA DSP cores, security and wireless accelerators. Future upgrades will support greater bandwidths and more channels, giving higher throughput, says CommAgility. As a collaboration partner with NXP for its Layerscape Access processors, CommAgility can provide support to others developing and deploying 5G products using the NXP platform. CommAgility says it can also customise its 5G software to help simplifiy development, cut time to market and reduce risk.

CommAgility software is deployed in various 5G technology development projects including 5G mmWave repeaters, 5G base stations and small cells, US Department of Defense 5G research projects and private network deployment. The new platform offers a 5G gNodeB basestation which can be used as a complete small cell solution.

“The SC-RF2-5Gn78 provides a 5G small cell development platform that can significantly cut time-to-market, reduce risk, and form the basis of a final product design,” said Edward Young, senior vice-president and managing director at CommAgility. “These capabilities, shown in previous end-to-end connectivity demonstrations using our 5G Reference gNodeB, SmallCellPHY-5G and SmallCellSTACK-5G software, have enabled our current 5G customers to accelerate their development and deployment of 5G solutions.”

The CommAgility software portfolio for 5G NR development includes pre-ported and validated PHY and Stack software, a 5G core, and physical layer reference chains. This simplifies the development of 5G small cells and private networks, with the software’s flexible architecture making integration easier with hardware accelerators and libraries. Versions are available for 5G gNodeB and UE product developers. As well as the SC-RF2-5Gn78, CommAgility also offers the 5G Reference gNodeB, a pre-integrated reference design.

Go to http://wirelesstelecomgroup.com

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Alliance Memory offers 3V multiple I/O serial NOR Flash memory solutions 

Alliance Memory offers a new line of 3V multiple input/output serial NOR flash memory products designed to provide supply continuity for Micron Technology customers using discontinued N25Q series devices. Offering support for single, dual, and quad SPI modes, the AS25F series combines fast read performance up to 104MHz with fast program and erase times of 0.3ms and 40ms typical, respectively. 

Available in 8-pin SOP wide body (209mils) and 8L WSON (6x5mm) packages, the devices operate from a single 2.7V to 3.6V power supply over an industrial temperature range of -40 degrees C to +85 degrees C. The solutions offer typical erase/program currents of 20mA and maximum read currents of 25mA at 104MHz, and they are said by Alliance Memory to provide reliable, long-term performance with 100,000 program/erase cycles and 10-year data retention.

 AS25F series devices support uniform 4KB or 32KB or 64KB erase, offers an 8/16/32/64byte wrap-around burst read mode, and features program/erase suspend and resume. Advanced security features include block protection and 4K-bit secured OTP to protect content from hostile access and inadvertent programming and erasing.

 With their enhanced performance, the serial NOR flash memory products are designed to meet the demands of the computer, consumer, communications, IoT and mobile markets. The devices are suitable for use in, among others, chipsets for PCs, DVD and Blu-ray players, wireless LANs and cable modems, printers, set-top boxes, LCD displays, mobile and wearable devices, digital cameras, handheld GPS units and smart meters. 

Samples and production quantities of the 3V serial NOR flash memory products are available now, with lead times of 16 to 20 weeks. 

Alliance Memory is a global provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada and South America. 

Go to http://www.alliancememory.com

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