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Embedded computer soars high with Intel Xeon processor

Tue, Nov 23, 2021

A compact embedded computer from VersaLogic is based on the Intel Xeon processor. The Eagle features Intel’s Coffee Lake Refresh Xeon processor and includes high speed on-board NVMe SSD storage, ECC memory, Ethernet, TPM 2.0 security, general purpose I/O (GPIO) and USB ports, as well as a SATA port for off-board storage.

The compact size makes it suitable for use in restricted spaces. The Eagle is based on Intel’s 9th generation Xeon-E processor which features six cores and hyper-threading. There is also soldered down 128Gbyte NVMe fast read/write storage and up to 32Gbyte ECC memory. These features make it suitable for intensive processing at the edge, says Versalogic. This particularly applies when security concerns or limited communication bandwidth preclude sending raw data back to a data centre, the company says. Connectivity interfaces include Ethernet, USB 3.2, serial, I2C, GPIO, and Mini DisplayPort connections. SATA III connectivity is provided for applications requiring an off-board storage capability.

The compact and tough Eagle has a footprint of 96 x 90mm and is 37mm high to fit in most 1U enclosures.

As a member of the VersaLogic EPU product family, the Eagle is designed and tested for industrial temperature operation, i.e., -40 to +85 degrees C. It meets MIL-STD-202H specifications for shock and vibration. The latching connectors ensure secure cable attachment in hostile environments, says VersaLogic.

Like other VersaLogic products, the Eagle is designed from the ground up for long-term availability (10+ year typical production lifecycle). Modifications to the off-the-shelf product are available, even in low OEM quantities. Modifications include conformal coating, revision locks, custom labelling, customised testing and screening.

The Eagle (EPU-5120) is now in stock at VersaLogic and will be in stock at Digi-Key soon.

VersaLogic supplies embedded computers and expert technical support for critical markets such as medical and defence. Its products feature long-term availability, -40 to +85 degrees C operation, MIL-STD-202 shock and vibration testing, and US-based support.

http://www.VersaLogic.com

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Aaeon bases COM Type 6 board on 11th generation Intel Core processor

Tue, Nov 23, 2021

Based on the 11th Generation Intel Core processor, the COM-TGUC6 has been released by Aaeon. It offers developers and users a significant increase in performance over previous generations of COM boards, says Aaeon, with faster memory speeds, greater display support and higher bandwidth connections.

The rugged design increases processing performance with the 11th Generation Intel Core U processors (formerly Tiger Lake). For memory operations it supports dual DDR4 modules up to 3200MHz. The board supports in-band ECC, providing memory error detection even with non-ECC memory modules. Together this offers faster, more accurate data processing, vital for increasingly complex applications in robotics and AI computing, says Aaeon. The COM-TGUC6 can be configured with the industrial grade Intel Core U processor, enabling the board to meet WiTAS II wide temperature specifications, operating in temperatures from -40 to +85 degrees C.

The COM-TGUC6 is designed to bring faster data processing and connections, using the latest generation of I/O and expansion features. Included in this feature set is the Intel i225LM chipset, powering 2.5Gbit per second Ethernet speeds. This enables faster network connections for applications that demand higher bandwidths. Additionally, the system supports four USB3.2 Gen 2 ports, up to eight USB2.0 ports, as well as SATA III storage devices.

The COM-TGUC6 also provides flexible display support, with connections for VGA, up to three DDI ports and LVDS / eDP support. The board is capable of powering up to four independent displays, for digital signage, medical equipment and gaming. The COM-TGUC6 also supports a range of expansion options including five PCIe Gen 3 lanes, as well as PCI Express Graphics (PEG) Gen 4.

Aaeon provides customers and clients with a range of services to help ensure the right product for the job. From carrier boards and enclosures to OEM / ODM services, the company’s service and support helps accelerate development and reduce time to market.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI edge applications. The company provides reliable computing including industrial motherboards and systems, rugged tablets, embedded AI edge systems, uCPE network appliances, and LoRaWAN / WWAN. Aaeon also works closely with cities and governments to develop and deploy smart city ecosystems and works with premier chip designers to deliver stable, reliable platforms. It is recognised as an Associate member of the Intel Internet of Things Solutions Alliance.

http://www.aaeon.com

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Renesas introduces dual-beam active beamforming IC

Mon, Nov 22, 2021

ICs for phased array antennae in satellite comms (satcom), radar and point-to-point communications systems have been added to the portfolio of mmWave LNAs and Tx BFICs from Renesas Electronics. The company has added the F6121 and F6122 dual-beam active beamforming ICs for Ku-band satcom and the F6123 for Ku-band radar and line-of-sight communications.

They are claimed to have best-in-class power consumption, noise figure with a compact size to enable next-generation, low-latency electronically steered antennae for in-flight connectivity (IFC), maritime, satcom-on-the-move, and low earth orbit (LEO) ground terminals.

The F61xx Rx devices are believed to be the first commercial products to feature dual-beam capability for make-before-break or simultaneous multi-satellite, multi-orbit operation over the full Ku and Ka Satcom bands. The Ics offer OEMs the flexibility of LNA selection and placement for improved noise figure and system G/T performance.

“Our customers face three main challenges as they migrate from mechanical antennas to electronically steered antennas: thermal management, physical integration and affordability,” said Naveen Yanduru, vice president of RF Communications Product division at Renesas.

The second generation of F61xx dual-beam beamforming ICs address the thermal, integration, and cost challenges designers face as they transition from bulky mechanically steered antennae to the lower weight and leaner profile active electronically scanned array antennae (AESAs). The ICs deliver reduced power consumption, increased on-chip beam-state memory, and dual-beam operation (configurable for single beam with 40 per cent power savings), as well as improved RF performance, reports Renesas. They also complement the company’s sub-6GHz RFIC portfolio and the 5G mmWave product lines.

The ICs have the flexibility to support dual/single-beam, full/half-duplex, single/dual-polarisation and 1D and 2D array architectures. The compact footprint has less than four per cent panel area utilisation on Ku λ/2 grid and relaxed pitch FC-BGA package for reduced integration complexity and improved RF isolation.

The fast and flexible digital interface with on-chip beam-state memory allows for low latency antenna beam switching in under 100ns

The F6121 Rx BFIC, the F6921 LNA and F6521 Tx BFIC are in production and available now to support half-duplex and full-duplex antenna designs for Ku-band LEO and GEO ground terminals. The F6121, F6122, and F6123 ICs are available now and shipping to customers designing satcom and radar systems for 2022 deployments.

http://www.renesas.com

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Battery charger IC is designed for low voltage charging for wearables

Wed, Nov 17, 2021

A battery charger IC has been designed by Rohm for low-voltage charging. The BD71631QWZ is suitable for wearables like wireless ear buds and thin, compact IoT devices such as smart displays powered by rechargeable batteries.

The need for safer, higher density rechargeable batteries has led to the development of new battery types, including all- or semi-solid types and using novel materials for the electrode part and batteries that adopt different terminal compositions. Many of the latest rechargeable batteries are small and thin, requiring low voltage charging in the 2.0 to 3.0V range. There are currently no battery charger ICs that can handle a wide voltage range, says Rohm.

The BD71631QWZ battery charger IC supports low voltage charging of Li-ion but also new types of rechargeable batteries such as all-solid and semi-solid state models. The IC achieves low voltage charging over a wide range from 2.0 to 4.7V by improving the stability of the internal circuit

Unlike general battery charger ICs that provide a fixed voltage, the BD71631QWZ battery charger IC allows the charge voltage to be easily set by simply changing the external resistor, reducing design load when changing batteries. The original package technology results in a compact package just 0.4mm thick, which is 60 per cent lower than conventional products in this market to make devices smaller and thinner. Each charging characteristic like charge/termination current can be set for CCCV charging, providing an optimal charging environment for thin, compact IoT and wearable devices usng the latest rechargeable batteries.

In addition to devices using low voltage and single-cell Li-ion rechargeable batteries, the battery charger IC can be used in wearable devices, such as wireless ear buds, electronic pens, e-cigarettes, smart displays or tags and other compact IoT devices.

An evaluation board, BD71631QWZ-EVK-001, is also available.

Rohm Semiconductor develops and manufactures a large product range from SiC diodes and MOSFETs, analogue ICs such as gate drivers and power management ICs to power transistors and diodes to passive components.

http://www.rohm.com/eu

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Embedded computer soars high with Intel Xeon processor

Aaeon bases COM Type 6 board on 11th generation Intel Core processor

Renesas introduces dual-beam active beamforming IC

Battery charger IC is designed for low voltage charging for wearables

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