Asahi Kasei Microdevices launches camera‐less integrated sensing modules

Asahi Kasei Microdevices has announced the commercial availability of its AK581xAIM Antenna-in-Module (AiM) millimetre wave (mmWave) radar modules for the high-precision sensing of human presence, breathing, position, and posture, as well as fall- detection, all without the use of cameras. These complete sensing solutions will enable product developers to accelerate proof-of-concept (PoC) development and integrate advanced sensing features quickly, without the need for antenna or radar design expertise.

As a growing number of adults over 50 plan to age in place—as many as 75% in the United States, according to a 2024 AARP survey—the demand for privacy‐conscious monitoring in consumer electronics, smart homes, and IoT healthcare applications is increasing. Asahi Kasei Microdevices’ AiM radar modules address this need by combining compact radar modules with ready‐to‐use evaluation kits, and provide customers a streamlined path from concept to deployment.

AKM’s new AiM modules (AK5816AIM / AK5818AIM) integrate their AK581x mmWave radar IC and a 4-in/4-out antenna array into a single compact package (23 mm × 23 mm). The antenna integration eliminates the need for custom RF design, reducing engineering effort and shortening time‐to‐market. Multi‐channel measurement and high angular resolution enable precise 3D sensing to accurately detect human location, motion, posture, and falls, while distinguishing between people, pets, and objects.

The AK581xAIM mmWave radar modules provide an unobtrusive, privacy-preserving solution for a broad range of applications such as vital signs sensing, posture estimation, and fall detection, which are especially relevant among older individuals. The lack of cameras makes it possible to offer these features even in bedrooms or restrooms, where safety monitoring is often limited by the need for privacy, and thus allow for faster response time and reduced caregiver burden. Additionally, these modules may help to increase energy efficiency when used for occupancy-aware control of HVAC systems, lighting, and more.

To simplify evaluation and accelerate development, AKM offers two development kits. The “AIMEZ V” is optimised for rapid proof-of-concept and implementation testing and features USB, Ethernet, Wi Fi, and Bluetooth Low Energy connectivity. The “LUMI” is designed for advanced algorithm development and is equipped with a high-performance System-on-Chip (SoC) for large-scale data processing and machine learning applications.

Both kits include a baseline software environment for quick setup and support for integrating proprietary algorithms, enabling a smooth transition from evaluation to product development.

https://www.akm.com

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New ST  Bluetooth 5.4 / Thread module for smart and IoT applications now at Mouser

Mouser Electronics is now shipping the new ST67W Wi-Fi 6 / Bluetooth 5.4 / Thread module from STMicroelectronics. The ST67W Module simplifies the development of next-generation wireless solutions for smart homes, smart appliances, healthcare, and industrial IoT applications.

The STMicroelectronics ST67W module, available from Mouser, is powered by Qualcomm’s high-performance 1 × 1 2.4GHz Wi‑Fi 6 and Bluetooth 5.4 QCC743 microcontroller, with support for Matter protocol over Wi-Fi that operates as a future-proof IoT connectivity transceiver, together with an external STM32 host MCU for running applications.

The ST67W module is ready to integrate with any STM32 MCU with all RF front-end circuitry built-in, including power/low-noise amplifiers, the RF switch, balun, and integrated PCB antenna, with 4Mbyte Flash for code and data storage and a 40MHz crystal. The module’s security features, cryptographic accelerators and services, including secure boot and debug reaching PSA Certified Level 1, make it easy for designers to comply with the upcoming Cyber Resilience Act and RED directives. The STMicroelectronics ST67W module is self-contained, pre-certified, and comes in a 32-lead LGA package ready for board placement. The module is offered with a PCB antenna (version B) or an RF connector for an external antenna (version U).

The STMicroelectronics X-NUCLEO-67W61M1 expansion board, also available from Mouser, is a versatile development tool for the ST67W module. The expansion board can be used with the ARDUINO® Uno V3 and Raspberry Pi boards, and is stackable on ST’s Nucleo-64, Nucleo-144, and Discovery boards.

https://www.mouser.com

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Renesas introduces ultra-low-power MCUs for next-generation smart home appliances

Renesas has introduced the new 16-bit RL78/L23 microcontroller (MCU) group, expanding its low-power RL78 family. Running at 32MHz, the RL78/L23 MCUs combine industry-leading low-power performance with essential features such as dual-bank flash memory, segment LCD control, and capacitive touch functionality to support smart home appliances, consumer electronics, IoT and metering systems. These compact devices address the performance and power requirements of modern display-based human-machine interface (HMI) applications.

The RL78/L23 is optimised for ultra-low power consumption and ideal for battery-powered applications that spend the majority of time in standby. They offer an active current of just 109μA/MHz and a standby current as low as 0.365μA, along with a fast 1μs wake-up time to help minimise CPU activity. The LCD controller’s new reference mode, VL4, reduces LCD operating current by approximately 30 percent when compared to the existing RL78/L1X group. The MCUs come with SMS (SNOOZE Mode Sequencer), which enables dynamic LCD segment display without CPU intervention. By offloading tasks to the SMS, the devices minimise CPU wake-ups and contribute to system-level power savings.

The RL78/L23 offers a wide operating voltage range of 1.6V to 5.5V, which supports direct operation from 5V power supplies commonly used in home appliances and industrial systems. This capability reduces the need for external voltage regulators. The MCUs also integrate key components such as capacitive touch sensing, a temperature sensor, and internal oscillator, reducing BOM cost and PCB size.

Its built-in segment LCD controller and capacitive touch realize sleek, responsive user interfaces for products such as induction cooktops and HVAC systems. The IH timer (Timer KB40) enables precise multi-channel heat control, which is essential in smart kitchen appliances such as rice cookers and IH cooktops. The devices include dual-bank flash memory for seamless firmware updates via FOTA (Firmware Over-the-Air), allowing continuous system operation in applications like metering, where downtime must be minimised. The dual-bank architecture allows one memory bank to run the user program, while the other receives updates. This approach keeps the system functional throughout the process for improved reliability.

The RL78/L23 comes with an easy-to-use development environment. Developers can leverage support tools such as Smart Configurator and QE for Capacitive Touch to streamline system design. Renesas offers the RL78/L23 Fast Prototyping Board which is compatible with Arduino IDE, and a capacitive touch evaluation system for in-depth testing and validation.

https://renesas.com

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Latest Bluetooth module from Panasonic now in mass production and supporting Bluetooth 6.0

Now in mass production, the PAN B611-1 Bluetooth module from Panasonic Industry is based on the powerful Nordic nRF54L15 single chip controller. The product now also supports Bluetooth 6.0 and the cutting-edge Bluetooth Channel Sounding feature, enabling precise distance measurement and improved wireless communication.

All 32 pins available on nRF54L15 are routed out on to a hybrid packaging consisting of castellated edges and LGA in a hybrid layout such that a dedicated number of pins positioned at the edge lending for easy prototyping, with the rest of the GPIOs located at the bottom that allows leveraging the full potential of the wireless SoC platform.

The module benefits from very small dimensions of only 10.35 mm × 9.8 mm × 1.9 mm. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.

Based on nRF54L15, the module is shipped with an open embedded application processor based on ARM Cortex-M33 processor clocking up to 128 MHz for high performance embedded applications with a 256 kB RAM. Furthermore, the module has a non-volatile memory of 1.5 MB as available on the SoC.

However, Panasonic adds further features above and beyond those available on the SoC. Pascal Maier, Head of IOT Devices at Panasonic Industry comments: “Our latest PAN B611-1 Bluetooth module is a versatile device that can support a variety of applications – from ultra-low power battery driven solution to very complex applications like Matter, as well as sophisticated algorithm-heavy features like Channel Sounding. This is why we offer different spec variants to enable a variety of applications. The modules are for example available with additional integrated slow clock crystal for energy efficient battery powered operation and additional 4 MB Flash Memory for more complex applications. We think our clients will love this module for its versatility and power at a competitive price point.”

An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms.

Furthermore, the PAN B611-1 is ideally suited for Matter applications, as dedicated variants exist with additional flash memory, and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. Apart from Matter, the highly versatile module also supports a variety of wireless protocols in the 2.4 GHz spectrum including Bluetooth LE, Bluetooth Mesh and IEEE 802.15.4 – enabling Zigbee and Thread as well as other third-party proprietary technologies, which make it effortless to develop products for smart home standards like Matter and Zigbee and even allow running multiple wireless protocols concurrently.

The PAN B611-1 Bluetooth module is available with an integrated chip antenna (-1C) or as bottom pad version (-1B) to cater to diverse project needs. It is certified for Europe (CE RED), UK (UKCA), USA (FCC), Canada (ISED), Japan (MIC).

https://industry.panasonic.eu

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