Rohm has developed a breakthrough in AI-equipped MCUs

Rohm has developed AI-equipped MCUs (AI MCUs) – ML63Q253x-NNNxx / ML63Q255x-NNNxx – that enable fault prediction and degradation forecasting using sensing data in a wide range of devices, including industrial equipment such as motors. According to Rohm these MCUs are the industry’s first to independently execute both learning and inference without relying on a network connection.

As the need for efficient operation of equipment and machinery continues to grow, early failure detection and enhanced maintenance efficiency have become key challenges. Equipment manufacturers are seeking solutions that allow real-time monitoring of operational status while avoiding the drawbacks of network latency and security risks. Standard AI processing models, however, typically depend on network connectivity and high-performance CPUs, which can be costly and difficult to install.

In response, Rohm has developed AI MCUs that enable standalone AI learning and inference directly on the device. These network-independent solutions support early anomaly detection before equipment failure – contributing to a more stable, efficient system operation by reducing maintenance costs and the risk of line stoppages.

The new products adopt a simple 3-layer neural network algorithm to implement Rohm’s proprietary on-device AI solution “Solist-AI™.” This enables the MCUs to perform learning and inference independently, without the need for cloud or network connectivity.

AI processing models are generally classified into three types: cloud-based, edge, and endpoint AI. Cloud-based AI performs both training and inference in the cloud, while edge AI utilises a combination of cloud and on-site systems - such as factory equipment and PLCs - connected via a network. Typical endpoint AI conducts training in the cloud and performs inference on local devices, so network connection is still required. Furthermore, these models typically perform inference via software, necessitating the use of GPUs or high-performance CPUs.

In contrast, Rohm’s AI MCUs, although categorised as endpoint AI, can independently carry out both learning and inference through on-device learning, allowing for flexible adaptation to different installation environments and unit-to-unit variations, even within the same equipment model. Equipped with Rohm’s proprietary AI accelerator “AxlCORE-ODL,” these MCUs deliver approximately 1,000 times faster AI processing compared to Rohm’s conventional software-based MCUs (theoretical value at 12MHz operation), enabling real-time detection and numerical output of anomalies that “deviate from the norm”. In addition, high-speed learning (on-site) at the point of installation is possible, making them ideal for retrofitting into existing equipment.

These AI MCUs feature a 32-bit Arm® Cortex-M0+ core, CAN FD controller, 3-phase motor control PWM, and dual A/D converters, achieving a low power consumption of approximately 40mW. As such, they are ideally suited for fault prediction and anomaly detection in industrial equipment, residential facilities, and home appliances.

The lineup will consist of 16 products in different memory sizes, package types, pin counts, and packaging specifications. Mass production of 8 models in the TQFP package began sequentially in February 2025. Among these, two models with 256KB of Code Flash memory and taping packaging are available for purchase, along with an MCU evaluation board, through online distributors.

Rohm has released an AI simulation tool (Solist-AI Sim) on its website that allows users to evaluate the effectiveness of learning and inference prior to deploying the AI MCU. The data generated by this tool can also serve as training data for the actual AI MCU, supporting pre-implementation validation and improving inference accuracy.

 

https://www.rohm.com

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BeagleBoard Wi-Fi 6 Bluetooth LE wireless modules now at Mouser

Mouser is now shipping the CC33 wireless modules from BeagleBoard. The BM3301 modules are high-performance 2.4GHz Wi-Fi® 6 and Bluetooth Low Energy 5.4 combo wireless modules for industrial IoT, automotive, smart home, consumer electronics, healthcare, and embedded systems applications.

The BeagleBoard CC33 wireless modules, available from Mouser, are powered by TI’s 10th-generation connectivity chip (CC3301), delivering application throughput of up to 50 Mbps and are designed for reliable performance in extreme conditions (-40°C to +85°C), making them ideal for diverse applications requiring robust wireless connectivity. There are two variants to this module: The BeagleMod BM3301-1313 is a 13mm × 13mm BGA module, footprint-compatible with the TI WL18xxMOD series for easy drop-in design upgrades. The BeagleMod BM3301-1216 is a 12mm × 16mm M.2 1216 LGA module that includes an IPEX Gen 4 connector, and a u.FL antenna connector to simplify board layout, with both featuring Wi-Fi 6, Bluetooth LE 5.4, and integrated 2.4 GHz PA for complete wireless solutions with up to +20.5 dBm output power.

Mouser also stocks the BeagleY-AI single-board computer (SBC), a low-cost, open-source, community-supported development platform in a familiar form factor compatible with other popular SBC accessories. It was developed to streamline the process of building smart human-machine interfaces (HMI), incorporating cameras and high-speed connectivity into a reliable embedded system. The BeagleY-AI SBC features a powerful 64-bit, quad-core A53 processor and numerous powerful AI accelerators paired with C7x DSPs capable of 4 TOPS (trillion-operations per second) combined (2 TOPS each), an integrated 50GFLOP GPU supporting up to three concurrent display outputs and modern connectivity with USB 3.1 and PCIe Gen 3. An onboard BeagleMod CC33 module (BM3301- 1313) provides Wi-Fi 6 and BLE 5.4 connectivity.

https://www.mouser.com

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Rutronik offers USB Type-C connectors from Molex for industrial and consumer applications

With USB Type-C connectors from Molex, Rutronik offers future-proof interface solutions for industrial and consumer electronics applications. The connectors support data rates of up to 40 Gbit/s (USB4), currents of up to 5.0 A and power delivery of up to 100 W – ideal for applications with high power requirements and limited space, such as portable medical devices, industrial electronics, AR / VR systems and smart home appliances.

Thanks to their compact design, IPX8-certified variants and high mechanical robustness (up to 10,000 mating cycles), the components are particularly suitable for applications where reliability and continuous operation are key. Various mounting options – including vertical, top and mid-mount versions – offer maximum design flexibility in a small space.

Benefits at a glance:
• USB4-compatible: data transfer rates up to 40 Gbit / s
• Power delivery capable: Up to 100 W charging power (5.0 A / 20 V)
• Metal-reinforced mating area for high mating cycles (up to 10,000 mating cycles)
• Mating force on PCB: 0
• Mating force: 5 to 20 N
• Unmating force: 8 to 20 N (1 to 30 cycles); 6 to 20 N (after 10,000 cycles)
• Sockets with liquid protection according to IPX8, thanks to LSR moulding (liquid silicone rubber) ·
• Variants with 6, 14, 16 or 24 contacts available

Application examples:
• Portable medical devices (e.g. glucose meters, inhalers)
• Smart home and (I)IoT components
• AR/VR end devices and wearables
• Industrial electronics, measuring and testing devices
• Cash register systems and projectors

https://www.rutronik.com/

 

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Integrated matching filters from ST now available for long-range wireless MCUs

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to simplify the development of IoT, smart-metering, and remote-monitoring applications.

The new MLPF-WL-01D3/02D3/04D3 ICs combine impedance matching and harmonic filtering on a single glass substrate to optimise the main radio’s RF performance, leveraging proprietary integrated passive device (IPD) technology. Precision engineered and housed in an ultra-compact package, the highly integrated devices ensure right-first-time design while saving development time, bill-of-materials costs, and board space.

Integrating antenna protection, the new devices substantially simplify the RF connection to the MCU. In addition to ensuring optimal performance, integrated matching and filtering also increases reliability and reduces overall cost by eliminating the need to combine multiple discrete components.

In total, there will be seven variants, letting designers optimise for radio operation in high-band (826-958MHz) or low-band (413-479MHz), high-power (16dBm/20dBm) or low-power (10dBm), and for 4-layer or 2-layer PCB designs. The non-conductive glass substrate ensures outstanding performance with minimal temperature drift, and the chip-scale package has extremely compact dimensions, measuring just 1.47mm x 1.87mm and 630µm high after reflow.

The long-range sub-GHz radio of ST’s STM32WL33 wireless MCUs can operate in either of the 413-479MHz and 826-958MHz license-free bands and with up to 20dBm output power where local regulations permit. With an Arm® Cortex®-M0+ core and selected peripherals also on-chip, the highly integrated wireless MCUs simplify the design of remote-monitoring equipment for smart city, smart agriculture, and smart industry. Applications include smart meters, and safety systems, asset-trackers, and proximity detection. A set of reference designs (STDES-WL3xxxx), pre-certified and fine-tuned for STM32WL33 MCUs, is also available.

https://www.st.com

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